초록 ▼

A semiconductor die carrier includes a housing that defines a cavity for holding one or more semiconductor dies, electrically conductive leads, and a cover plate having an aperture formed therethrough. The housing includes insulative side walls and a end plate joined to the side walls. The side wall

A semiconductor die carrier includes a housing that defines a cavity for holding one or more semiconductor dies, electrically conductive leads, and a cover plate having an aperture formed therethrough. The housing includes insulative side walls and a end plate joined to the side walls. The side walls and the end plate may be molded together as a one-piece unit. One or more of the side walls includes openings for receiving the leads so that an internal lead section extends within the cavity and an external lead section extends from the side walls external of the housing. The side walls may include a recess for receiving the cover plate. The aperture in the cover plate allows a semiconductor die held in the housing to be exposed to the environment.

대표청구항 ▼

[ What is claimed is:] [14.]14. A semiconductor die package comprising:a housing defining a cavity for holding at least one semiconductor die, said housing including a plurality of insulative side walls and an end plate joined to said side walls, wherein the thickness of the end plate is greater tha

[ What is claimed is:] [14.]14. A semiconductor die package comprising:a housing defining a cavity for holding at least one semiconductor die, said housing including a plurality of insulative side walls and an end plate joined to said side walls, wherein the thickness of the end plate is greater than the distance that the side walls extend away from the end plate;a plurality of electrically conductive leads extending through at least one of said side walls, each of said leads including an internal lead section extending within the cavity and an external lead section extending externally of said at least one side wall; anda cover plate joined to said side walls opposite said end plate, wherein said cover plate includes an aperture formed therethrough which exposes to the environment a sufficient portion of said at least one semiconductor die such that pressing a human digit into said aperture results in contact between said human digit and said at least one semiconductor die.