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Porous silicon oxycarbide integrated circuit insulator 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-023/58
출원번호 US-0517029 (2000-03-02)
발명자 / 주소
  • Ahn Kie Y.
  • Forbes Leonard
출원인 / 주소
  • Micron Technology, Inc.
대리인 / 주소
    Schwegman, Lundberg, Woessner & Kluth, P.A.
인용정보 피인용 횟수 : 80  인용 특허 : 16

초록

An integrated circuit includes at least one porous silicon oxycarbide (SiOC) insulator, which provides good mechanical strength and a low dielectric constant (e.g., .epsilon..sub.R <2) for minimizing parasitic capacitance. The insulator provides IC isolation, such as between circuit elements, betwee

대표청구항

[ What is claimed is:] [1.]1. An integrated circuit formed on a substrate, comprising:a plurality of transistors formed on the substrate;a plurality of first conductors interconnecting ones of the transistors; anda silicon oxycarbide insulator insulating portions of the first conductive layer from t

이 특허에 인용된 특허 (16)

  1. Hsia Liang Choo,TWX ; Chang Thomas Tong Long, Additive metalization using photosensitive polymer as RIE mask and part of composite insulator.
  2. Renlund Gary M. (Scotia NY) Minnear William P. (Schenectady NY) Bracco Angelo A. (Albany NY), Cellular silicon-oxy-carbide glass from foamed silicone resins.
  3. Jeng Shin-Puu, Low capacitance interconnect structure for integrated circuits.
  4. Gnade Bruce (Dallas TX) Cho Chih-Chen (Richardson TX) Levine Jules D. (Dallas TX), Low density, high porosity material as gate dielectric for field emission device.
  5. Kapoor Ashok K. (Palo Alto CA) Pasch Nicholas F. (Pacifica CA), Low dielectric constant insulation layer for integrated circuit structure and method of making same.
  6. Gnade Bruce E. ; Cho Chih-Chen ; Smith Douglas M., Low dielectric constant material for electronics applications.
  7. Bremmer Jeffrey Nicholas ; Chung Kyuha ; Saha Chandan Kumar ; Spaulding Michael John, Method for producing thick crack-free coatings from hydrogen silsesquioxane resin.
  8. Gnade Bruce E. (Dallas TX) Cho Chih-Chen (Richardson TX) Smith Douglas M. (Albuquerque NM), Method of making a semiconductor device using a low dielectric constant material.
  9. Cogan Stuart F. (Sudbury MA), Protective overlayer material and electro-optical coating using same.
  10. Loboda Mark J. (Midland MI), Reverse direction pyrolysis processing.
  11. Jeng Shin-Puu (Plano TX), Selective formation of low-density, low-dielectric-constant insulators in narrow gaps for line-to-line capacitance reduc.
  12. Sakamoto Mitsuru (Tokyo JPX) Hamano Kuniyuki (Tokyo JPX), Semiconductor device having multilayered wiring structure with a small parasitic capacitance.
  13. Ichikawa Kouji,JPX ; Fujii Hiroshi,JPX ; Tsuruta Susumu,JPX ; Ishihara Hideaki,JPX, Semiconductor integrated circuit.
  14. Loboda Mark Jon ; Michael Keith Winton, Silicon carbide metal diffusion barrier layer.
  15. Renlund Gary M. (Salt Lake City UT) Lewis Larry N. (Scotia NY) Stein Judith (Schenectady NY) Bracco Angelo A. (Albany NY), Silicon-oxy-carbide glass method of preparation and articles.
  16. Klersy Patrick J. (Madison Heights MI) Jablonski David C. (Waterford MI) Ovshinsky Stanford R. (Bloomfield Hills MI), Thin-film structure for chalcogenide electrical switching devices and process therefor.

이 특허를 인용한 특허 (80)

  1. Ahn, Kie Y.; Forbes, Leonard, Atomic layer deposited titanium silicon oxide films.
  2. Derderian, Garo J.; Sandhu, Gurtej Singh, Atomic layer deposition and conversion.
  3. Derderian, Garo J.; Sandhu, Gurtej Singh, Atomic layer deposition and conversion.
  4. Ahn, Kie Y.; Forbes, Leonard, Atomic layer deposition of a ruthenium layer to a lanthanide oxide dielectric layer.
  5. Eldridge,Jerome M.; Ahn,Kie Y.; Forbes,Leonard, Atomic layer deposition of metal oxide and/or low asymmetrical tunnel barrier interploy insulators.
  6. Ahn, Kie Y.; Forbes, Leonard, Conductive layers for hafnium silicon oxynitride.
  7. Ahn, Kie Y.; Forbes, Leonard, Conductive layers for hafnium silicon oxynitride films.
  8. Ahn, Kie Y.; Forbes, Leonard, Conductive layers for hafnium silicon oxynitride films.
  9. Eldridge,Jerome M.; Ahn,Kie Y.; Forbes,Leonard, Deposition of metal oxide and/or low asymmetrical tunnel barrier interpoly insulators.
  10. Sandhu, Gurtej S.; Durcan, D. Mark, Devices with nanocrystals and methods of formation.
  11. Sandhu, Gurtej S.; Durcan, D. Mark, Devices with nanocrystals and methods of formation.
  12. Forbes, Leonard, Ferroelectric write once read only memory for archival storage.
  13. Forbes, Leonard, Ferroelectric write once read only memory for archival storage.
  14. Forbes, Leonard; Ahn, Kie Y., Germanium-silicon-carbide floating gates in memories.
  15. Forbes, Leonard; Ahn, Kie Y., Germanium-silicon-carbide floating gates in memories.
  16. Ahn, Kie Y.; Forbes, Leonard, Hafnium titanium oxide films.
  17. Ahn, Kie Y.; Forbes, Leonard, Hafnium titanium oxide films.
  18. Ahn, Kie Y.; Forbes, Leonard, HfAlOfilms for gate dielectrics.
  19. Farrar,Paul A., Hydrophobic foamed insulators for high density circuits.
  20. Farrar, Paul A., Insulators for high density circuits.
  21. Farrar, Paul A., Insulators for high density circuits.
  22. Farrar, Paul A., Low dielectric constant STI with SOI devices.
  23. Farrar, Paul A., Low dielectric constant STI with SOI devices.
  24. Farrar, Paul A., Low dielectric constant shallow trench isolation.
  25. Farrar, Paul A., Low dielectric constant shallow trench isolation.
  26. Farrar, Paul A., Low dielectric constant shallow trench isolation.
  27. Farrar, Paul A., Low dielectric constant shallow trench isolation.
  28. Farrar, Paul A., Low dielectric constant shallow trench isolation.
  29. Ahn, Kie Y.; Forbes, Leonard, Low-temperature grown high quality ultra-thin CoTiO3 gate dielectrics.
  30. Ahn,Kie Y.; Forbes,Leonard, Low-temperature grown high quality ultra-thin CoTiO3 gate dielectrics.
  31. Ahn, Kie Y.; Forbes, Leonard, Low-temperature grown high quality ultra-thin CoTiOgate dielectrics.
  32. Farrar, Paul A., Memory system with conductive structures embedded in foamed insulator.
  33. Forbes, Leonard; Ahn, Kie Y., Memory utilizing oxide nanolaminates.
  34. Forbes, Leonard; Ahn, Kie Y., Memory utilizing oxide nanolaminates.
  35. Forbes, Leonard; Ahn, Kie Y., Memory utilizing oxide-conductor nanolaminates.
  36. Forbes, Leonard; Ahn, Kie Y., Memory utilizing oxide-conductor nanolaminates.
  37. Forbes,Leonard; Ahn,Kie Y., Memory utilizing oxide-conductor nanolaminates.
  38. Forbes, Leonard; Ahn, Kie Y., Memory utilizing oxide-nitride nanolaminates.
  39. Forbes,Leonard; Ahn,Kie Y., Memory utilizing oxide-nitride nanolaminates.
  40. Forbes,Leonard; Ahn,Kie Y., Memory utilizing oxide-nitride nanolaminates.
  41. Nakamura, Yoshitaka; Tamaru, Tsuyoshi; Fukuda, Naoki; Goto, Hidekazu; Asano, Isamu; Aoki, Hideo; Kawakita, Keizo; Yamada, Satoru; Tanaka, Katsuhiko; Sakuma, Hiroshi; Hirasawa, Masayoshi, Method for fabricating semiconductor integrated circuit.
  42. Shinriki, Hiroshi; Shimizu, Akira, Method for forming metal wiring structure.
  43. Kim, Jae-Hak; Shin, Hong-Jae; Lee, Soo-Geun; Lee, Kyoung-Woo, Method of fabricating semiconductor devices having low dielectric interlayer insulation layer.
  44. Ahn, Kie Y.; Forbes, Leonard, Methods for atomic-layer deposition.
  45. Farnworth,Warren M.; Jiang,Tongbi, Methods for forming porous insulator structures on semiconductor devices.
  46. Farnworth,Warren M.; Jiang,Tongbi, Methods for forming porous insulators from "void" creating materials and structures and semiconductor devices including same.
  47. Ahn, Kie Y.; Forbes, Leonard, Methods of forming an insulating metal oxide.
  48. Ahn, Kie Y.; Forbes, Leonard, Methods of forming titanium silicon oxide.
  49. Ahn, Kie Y.; Forbes, Leonard, Methods of forming zirconium aluminum oxide.
  50. Forbes,Leonard, NOR flash memory cell with high storage density.
  51. Forbes,Leonard, NOR flash memory cell with high storage density.
  52. Forbes,Leonard, NOR flash memory cell with high storage density.
  53. Forbes, Leonard, Nanocrystal write once read only memory for archival storage.
  54. Forbes, Leonard, Nanocrystal write once read only memory for archival storage.
  55. Forbes,Leonard, Nanocrystal write once read only memory for archival storage.
  56. Forbes,Leonard, Nanocrystal write once read only memory for archival storage.
  57. Forbes,Leonard, Nor flash memory cell with high storage density.
  58. Farrar,Paul A., Packaging of electronic chips with air-bridge structures.
  59. Farrar,Paul A., Packaging of electronic chips with air-bridge structures.
  60. Farrar, Paul A., Polynorbornene foam insulation for integrated circuits.
  61. Ahn, Kie Y.; Forbes, Leonard, Porous silicon oxycarbide integrated circuit insulator.
  62. Ahn, Kie Y.; Forbes, Leonard, Ruthenium for a dielectric containing a lanthanide.
  63. Ahn, Kie Y.; Forbes, Leonard, Ruthenium for a dielectric containing a lanthanide.
  64. Ahn, Kie Y.; Forbes, Leonard, Ruthenium layer for a dielectric layer containing a lanthanide oxide.
  65. Farnworth,Warren M.; Jiang,Tongbi, Semiconductor devices and other electronic components including porous insulators created from "void" creating materials.
  66. Farnworth, Warren M.; Jiang, Tongbi, Semiconductor devices including porous insulators.
  67. Farnworth, Warren M.; Jiang, Tongbi, Semiconductor devices including porous insulators.
  68. Nakamura,Yoshitaka; Tamaru,Tsuyoshi; Fukuda,Naoki; Goto,Hidekazu; Asano,Isamu; Aoki,Hideo; Kawakita,Keizo; Yamada,Satoru; Tanaka,Katsuhiko; Sakuma,Hiroshi; Hirasawa,Masayoshi, Semiconductor integrated circuit device having a conductive film which contains metal atoms bondable to a halogen element.
  69. Saha, Atanu; Joshi, Salil Mohan; Zhang, An-Ping, SiOC membranes and methods of making the same.
  70. Ahn, Kie Y.; Forbes, Leonard, Structures containing titanium silicon oxide.
  71. Bouche,Guillaume; Caruyer,Gregory; Ancey,Pascal, Support and decoupling structure for an acoustic resonator, acoustic resonator and corresponding integrated circuit.
  72. Ahn, Kie Y.; Forbes, Leonard, Titanium aluminum oxide films.
  73. Forbes, Leonard, Write once read only memory employing charge trapping in insulators.
  74. Forbes,Leonard, Write once read only memory employing charge trapping in insulators.
  75. Forbes,Leonard, Write once read only memory employing charge trapping in insulators.
  76. Forbes,Leonard, Write once read only memory employing floating gates.
  77. Forbes,Leonard, Write once read only memory employing floating gates.
  78. Forbes,Leonard, Write once read only memory employing floating gates.
  79. Forbes,Leonard, Write once read only memory with large work function floating gates.
  80. Forbes,Leonard, Write once read only memory with large work function floating gates.
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