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Modular deposition system having batch processing and serial thin film deposition 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C23C-014/34
출원번호 US-0653444 (2000-08-31)
발명자 / 주소
  • Washburn Hudson A.
  • Hamilton Jarrett L.
출원인 / 주소
  • United Module Corporation
대리인 / 주소
    Townsend Townsend & Crew LLPBains, Esq.
인용정보 피인용 횟수 : 5  인용 특허 : 41

초록

A flexible, modular thin film deposition machine comprises a number of batch process stations which define a batch process path. At least one of the batch process stations is a thin film deposition station including a serial deposition chamber and an inter-chamber disk transfer mechanism. The disks

대표청구항

[ What is claimed is:] [1.]1. A thin film deposition system comprising:a plurality of deposition stations comprising at least a first and a second deposition station each deposition station including walls defining a batch chamber and a deposition chamber and a mechanism to transfer individual subst

이 특허에 인용된 특허 (41)

  1. Yamazaki Shunpei (Tokyo JPX) Tashiro Mamoru (Tokyo JPX) Miyazaki Minoru (Tokyo JPX), Apparatus for chemical vapor deposition and method of film deposition using such deposition.
  2. Yamazaki Itaru (Nagahama JPX), Apparatus for forming a functional deposited film by means of plasma chemical vapor deposition.
  3. Beardow Terence (Endenfield GB2), Apparatus for sputter coating discs.
  4. Gallego JosM. (Ormskirk GB2), Apparatus for the deposition of multi-layer coatings.
  5. Wirz Peter (Waldernbach DEX) Pfannekuche Heinz-Wilhelm (Hanau DEX) Bathon Thomas (Moembris DEX) Eckert Karl (Nidderau DEX), Apparatus for the production of coatings of uniform thickness profile on substrates, especially by cathode sputtering.
  6. Yamazaki Shumpei (Tokyo JPX), Carbon deposition by ECR CVD using a catalytic gas.
  7. Yamazaki Shunpei (Tokyo JPX) Hayashi Shigenori (Atsugi JPX), Carbon material containing a halogen and deposition method for same.
  8. Zejda Jaroslav (Rodenbach DEX), Cathode sputtering system with axial gas distribution.
  9. Yamazaki Shunpei (Tokyo JPX), Conductive layer deposition method with a microwave enhanced CVD system.
  10. Yamazaki Shunpei (Tokyo JPX) Hayashi Shigenori (Atsugi JPX), Cyclotron resonance chemical vapor deposition method of forming a halogen-containing diamond on a substrate.
  11. Yamazaki Shumpei (Tokyo JPX), Diamond film deposition by ECR CVD using a catalyst gas.
  12. Boys Donald R. (Cupertino CA) Graves Walter E. (San Jose CA), Disk or wafer handling and coating system.
  13. Hollars Dennis R. ; Waltrip Delbert F. ; Zubeck Robert B. ; Bonigut Josef ; Smith Robert M. ; Payne Gary L., Heating system for high throughput sputtering.
  14. Hutchinson Martin A. (Santa Clara CA), Magnetron sputter device using the same pole piece for coupling separate confining magnetic fields to separate targets s.
  15. Potter Robert I. (San Jose CA), Magnetron sputtering cathode with electrically variable source size and location for coating multiple substrates.
  16. Hata Tomonobu (Ishikawa JPX), Magnetron sputtering method and apparatus.
  17. Wolf Bernd (Hanau DEX) Wirz Peter (Waldernbach DEX), Magnetron type sputtering cathode.
  18. Takei Hiromichi (Chigasaki JPX) Suwa Hidenori (Zushi JPX) Ono Shinichi (Chigasaki JPX) Tsukakoshi Osamu (Hiratsuka JPX), Method and device for controlling an electromagnet for a magnetron sputtering source.
  19. Zhang, Hongyong; Yamazaki, Shunpei; Inushima, Takashi, Method for forming a semiconductor film by sputter deposition in a hydrogen atmosphere.
  20. Chen Tu (Saratoga CA) Yamashita Tsutomu T. (San Jose CA), Method for manufacturing a magnetic disk having reduced bit shift, minimized noise, increased resolution and uniform mag.
  21. Begin Robert G. (Montecito CA) Clarke Peter J. (Santa Barbara CA), Method for processing semi-conductor wafers in a multiple vacuum and non-vacuum chamber apparatus.
  22. Hurwitt Steven D. (Park Ridge NJ) Aronson Arnold J. (Pomona NY) Van Nutt Charles (Monroe NY), Method of enhancing the performance of a magnetron sputtering target.
  23. Yamagata Noriaki (Shibukawa JPX) Yoshino Nobuyuki (Shibukawa JPX) Hirai Shuichi (Machida JPX), Method of producing recording media and its apparatus.
  24. Maher Joseph A. (South Hamilton MA) Vowles E. John (Goffstown MA) Napoli Joseph D. (Winham NH) Zafiropoulo Arthur W. (Manchester MA) Miller Mark W. (Burlington MA), Method providing multiple-processing of substrates.
  25. Lauro Michael P. (Lincoln RI) Beaulieu Roland (Tiverton RI) Crissman Everett E. (Woonsocket RI) Loferski Joseph J. (Providence RI) Case Christopher (New Providence NJ), Modular sputtering apparatus.
  26. Washburn Hudson A. ; Hamilton Jarrett L., Modular sputtering machine having batch processing and serial thin film sputtering.
  27. Tashiro Mamoru (Tokyo JPX) Urata Kazuo (Tokyo JPX) Yamazaki Shunpei (Tokyo JPX), Photo CVD apparatus, with deposition prevention in light source chamber.
  28. Yamazaki Shunpei (Tokyo JPX), Photo-chemical vapor deposition of silicon nitride film.
  29. Yamazaki Shunpei (Tokyo JPX), Production of oxide superconducting films by multilayer deposition.
  30. Lee Steven N. (Irvine CA), Side lifting tool wafer-boat assembly.
  31. Hughes John L. (Rodeo CA), Sputter coating source.
  32. Hedgcoth Virgle L. (1524 Hacienda Pl. Pomona CA 91768), Sputtered magnetic recording disk.
  33. Abe Katsuo (Yokosuka JPX) Kobayashi Shigeru (Kawasaki JPX) Kamei Tsuneaki (Kanagawa JPX) Tateishi Hideki (Yokohama JPX) Aiuchi Susumu (Yokohama JPX), Sputtering cathode structure for sputtering apparatuses, method of controlling magnetic flux generated by said sputterin.
  34. Yamazaki Shunpei (Tokyo JPX) Suzuki Kunio (Tokyo JPX) Kinka Mikio (Atsugi JPX) Fukada Takeshi (Ebina JPX) Abe Masayoshi (Tama JPX) Shibata Katsuhiko (Atsugi JPX) Shinohara Hisato (Atsugi JPX) Susukid, Sputtering system for deposition on parallel substrates.
  35. Tepman Avi (Cupertino CA) Grunes Howard (Santa Cruz CA) Somekh Sasson (Los Altos Hills CA) Maydan Dan (Los Altos Hills CA), Staged-vacuum wafer processing system and method.
  36. Hughes John L. (Rodeo CA) Lawson Eric C. (Sunnyvale CA), Substrate handling and processing system.
  37. Strahl Thomas L. (Fremont CA) Lamont ; Jr. Lawrence T. (San Jose CA) Peterson Carl T. (Fremont CA) Brown Hobart A. (Santa Cruz CA) McCormick Lonnie W. (Cupertino CA) Mosely Roderick C. (Mountain View, System and method for processing workpieces.
  38. Bourez Allen J. (San Jose CA) Lal Brij B. (San Jose CA) Russak Michael A. (Los Gatos CA), Target assembly having inner and outer targets.
  39. Kudo Hideo (9-30-2-201 Miwa ; Nagano-shi ; Nagano ; 380 JPX) Tani Shigeru (433-10 Kojima ; Nagano-shiu ; Nagano 381 JPX) Tamaki Yasushi (28-3 Kitajou ; Nagano-shi ; Nagano ; 381 JPX) Ishida Genichi (, Thin film forming method and system.
  40. Turner Frederick T. (Sunnyvale CA) Hutchinson Martin A. (Santa Clara CA) Shaw R. Howard (Palo Alto CA) Lamont ; Jr. Lawrence T. (Mountain View CA), Wafer coating system.
  41. Edwards Richard C. (Ringwood NJ) Kolesa Michael S. (Suffern NY) Ishikawa Hiroichi (Mahwah NJ), Wafer processing cluster tool batch preheating and degassing apparatus.

이 특허를 인용한 특허 (5)

  1. Fourezon, Gilles; Poirson, Jean-Marc, Installation for the vacuum treatment in particular of substrates.
  2. Takahashi,Nobuyuki, Interback-type substrate processing device.
  3. Malhotra,Sudhir S.; Bertero,Gerardo; Tsoi,Ching; Stafford,Donald, Magnetic recording medium having novel underlayer structure.
  4. Henrich, Juergen; Schaefer, Michael; Haberkorn, Edgar, Process chamber, inline coating installation and method for treating a substrate.
  5. Takahashi, Nobuyuki, Substrate processing device and through-chamber.
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