초록 ▼

A surface mount component includes a substrate having two main faces, and first electrodes made of a metal, such as zinc, which is unlikely to cause migration. The first electrodes are formed on most of the entire face of both main faces of the substrate. Second electrodes made of a superior bonding

A surface mount component includes a substrate having two main faces, and first electrodes made of a metal, such as zinc, which is unlikely to cause migration. The first electrodes are formed on most of the entire face of both main faces of the substrate. Second electrodes made of a superior bonding material, such as copper, are disposed on the first electrodes. Lead terminals are bonded to the second electrodes by a bonding material, and an external packaging material covers the surface mount component. This configuration suppresses the occurrence of migration and improves resistance to electrical breakdown.

대표청구항 ▼

[ What is claimed is:] [2.]2. A surface mount electronic component comprising:a substrate having a main face;a pair of electrodes disposed on said substrate;a pair of lead terminals bonded respectively to said electrodes using a bonding material; andan external packaging material covering: i) said s

[ What is claimed is:] [2.]2. A surface mount electronic component comprising:a substrate having a main face;a pair of electrodes disposed on said substrate;a pair of lead terminals bonded respectively to said electrodes using a bonding material; andan external packaging material covering: i) said substrate, ii) said electrodes; and iii) at least a part of said lead terminals;wherein a portion of said lead terminals exposed from said external packaging material is used as a terminal for connecting to an external part; said electrodes are formed on substantially the entire main face of said substrate; and said electrodes are made of a material in which migration is substantially prevented.