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특허 상세정보

Lap-top enclosure having surface coated with heat-absorbing phase-change material

국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) H05K-007/20   
미국특허분류(USC) 361/700 ; 174/015.2 ; 165/104.33
출원번호 US-0868587 (1997-06-04)
발명자 / 주소
출원인 / 주소
대리인 / 주소
    Hamilton, Brook, Smith & Reynolds, P.C.
인용정보 피인용 횟수 : 22  인용 특허 : 8

An electronic apparatus, e.g., a lap top computer, has an enclosure which on its inner surface is coated with a phase-change material, e.g., in micro encapsulated form, preferably mixed with paint which is used to coat the inner surface of the enclosure. The phase change material absorbs heat generated by components in the electronic apparatus and maintains the components in the apparatus at a reasonable temperature.


[ We claim:] [1.]1. A lap-top computer enclosure having heat generating electronic components enclosed in the lap-top computer enclosure, the lap-top computer enclosure having an inner surface coated with an encapsulant layer containing phase-change material which absorbs heat produced by the heat generating electronic components such that heat is dissapated from the components in an isothermal process.

이 특허를 인용한 특허 피인용횟수: 22

  1. Xiong,Wei. Conductive cooling pad for use with a laptop computer. USP2008017324340.
  2. Pal, Debabrata. Controller cooling arrangement. USP2017129850817.
  3. Novotny,Shlomo. Cooling failure mitigation for an electronics enclosure. USP2008027327578.
  4. Ben Jamaa, Haykel; Baillin, Xavier; Ollier, Emmanuel; Soupremanien, Ulrich. Electronic component and fabrication process of this electronic component. USP2015018937385.
  5. Cao, Weijie; Xi, Shenghua; Fang, Li. Electronic device. USP2016119502324.
  6. Willets,Julie A.; Meyers,Gerald D.; Johnson,Larry L.. Fuel cell system with inverter and phase change material. USP2008047352578.
  7. Zuo, Jon; Ernst, Donald M.. Heat pipe having a wick structure containing phase change materials. USP2005056889755.
  8. Pidwerbecki, David; Uan-Zo-li, Alexander B.. High heat capacity electronic components and methods for fabricating. USP2015129226428.
  9. Rehmann, Mark L.; Heatly, Michael M.. Information handling systems having coatings with porous particles and processes of forming the same. USP2010067729108.
  10. Elias,J. Michael; Cepas,Bruce M.; Korn,James A.. Integrated power and cooling architecture. USP2006027002800.
  11. Tracy, Mark S.; Ashcraft, Britt C.; Lev, Jeffrey A.; Walker, Paul N.. Laptop computer user thermal isolation apparatus. USP2013098526179.
  12. Elias, J. Michael; Cepas, Bruce M.. Method and apparatus for absorbing thermal energy. USP2003096621702.
  13. Novotny,Shlomo; Rousmaniere,Arthur S.; Vogel,Marlin. Method and system for cooling electronic components. USP2007087252139.
  14. Warner, Charles C.; Foster, Scott A.; Evans, Stewart W.; Krivoy, Raul; Burke, Michael W.; Rae, John R.. Portable radiometry and imaging apparatus. USP2005026849849.
  15. Warner,Charles C.; Foster,Scott A.; Evans,Stewart W.; Krivoy,Raul; Burke,Michael W.; Rae,John R.. Portable radiometry and imaging apparatus. USP2008087411193.
  16. Foxenland, Eral. Self-cooling electrical device. USP2012078218321.
  17. MacDonald, Mark. Techniques for computing device cooling using a self-pumping fluid. USP2016049326422.
  18. Kaul, Raj K.. Thermal insulating coating for spacecrafts. USP2005096939610.
  19. Bao, Zhongping; Burrell, James D.; Cheng, Liang. Thermal management of integrated circuits using phase change material and heat spreaders. USP2015018937384.
  20. Hu,Xuejiao. Transpiration cooling for passive cooled ultra mobile personal computer. USP2008127463486.
  21. Pal, Debabrata. Two-phase electronic component cooling arrangement. USP2015059042097.
  22. Orsini, Lawrence; Wei, Yun. Use of computationally generated thermal energy. USP2016109480188.