초록 ▼

A semiconductor chip interposer increases fatigue life of interconnections between a first component having a relatively high thermal coefficient of expansion (TCE) and a second component having a relatively low TCE. The semiconductor chip interposer includes a thin metal plate having a plurality of

A semiconductor chip interposer increases fatigue life of interconnections between a first component having a relatively high thermal coefficient of expansion (TCE) and a second component having a relatively low TCE. The semiconductor chip interposer includes a thin metal plate having a plurality of through holes, the thin metal plate having a TCE intermediate the relatively high TCE and the relatively low TCE. An insulation coating on the thin metal plate is also included on walls of the through holes. An electrical conductive material fills each of the insulated through holes for electrical interconnection between the first component and the second component.

대표청구항 ▼

[ We claim:] [1.]1. A semiconductor chip interposer for increasing fatigue life of interconnections between a first component having a relatively high thermal coefficient of expansion (TCE) and a second component having a relatively low TCE, comprising:a thin substrate having a TCE intermediate the

[ We claim:] [1.]1. A semiconductor chip interposer for increasing fatigue life of interconnections between a first component having a relatively high thermal coefficient of expansion (TCE) and a second component having a relatively low TCE, comprising:a thin substrate having a TCE intermediate the relatively high TCE and the relatively low TCE and a plurality of through holes that are electrically insulated from one another, wherein the substrate is a thin metal plate having a thickness in the range of 2-8 mil; andan electrical conductive material filling each of the insulated through holes for electrical interconnection between the first component and the second component.