초록 ▼

An array module containing an array of electronic units is mounted in an installation frame. The electronic units can be mounted by rails in a hermetically sealed array housing and blind-mate connectors can connect the units to a rear plate. Blind-mate connectors also can connect the rear plate to t

An array module containing an array of electronic units is mounted in an installation frame. The electronic units can be mounted by rails in a hermetically sealed array housing and blind-mate connectors can connect the units to a rear plate. Blind-mate connectors also can connect the rear plate to the installation frame for external connection. A plurality of resilient mounts are fastened to the installation frame to protect the frame and storage array module from external shock. A thermal transfer mechanism transfers thermal energy between the electronic units and a region exterior to the installation frame. The electronic units can be enclosed in hermetically sealed chambers having side rails for rigidly fastened to the unit and a resilient support connecting the side rails to at least one of the covers of the hermetically sealed chamber. Thermal rails can be permanently mounted by a plurality of resilient thermal conductors to either the side rails or one of the covers, and a fastener removably mounts the thermal rails to the other of the side rails or one of the covers so that the thermal rails and resilient thermal conductors provide conduction of thermal energy between the side rails and one of the covers.

대표청구항 ▼

[ What is claimed is:] [1.]1. An apparatus, comprising:an array module having:a housing having a rear plate and opposing side walls defining a module chamber,a plurality of mounting locations on said side walls of said housing and in said module chamber,a plurality of electronic units having mountin

[ What is claimed is:] [1.]1. An apparatus, comprising:an array module having:a housing having a rear plate and opposing side walls defining a module chamber,a plurality of mounting locations on said side walls of said housing and in said module chamber,a plurality of electronic units having mounting features along opposite sides thereof, said mounting features being assembled to respective ones of said mounting locations so that said housing supports said electronic units in said module chamber, each of said electronic units having at least one first connector,a plurality of second connectors in said module chamber, each said first connector on said electronic units mating with a respective second connector, andat least one third connector on said housing connected to said plurality of second connectors to provide electrical connection to each of said, plurality of electronic units;an installation frame having:a rear wall and opposing side walls defining an installation chamber,a plurality of resilient mounts fastened to external surfaces of said installation frame, each said mount being arranged to be fastened to a support platform to isolate said installation frame from mechanical shock or vibration in said support platform,at least one fourth connector on said installation frame, said at least one fourth connector mating with said at least one third connector, andat least one external connector connected to said at least one fourth connector for providing electrical connection to said at least one fourth connector; andheat transfer means for transferring thermal energy between said electronic units and a region exterior to said installation frame.