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Method for attaching a micromechanical device to a manifold, and fluid control system produced thereby 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B32B-031/00
  • F16K-007/00
출원번호 US-0503443 (2000-02-14)
발명자 / 주소
  • Harris James M.
  • Selser Michael J.
  • Weber Walter A.
출원인 / 주소
  • Redwood Microsystems, Inc.
대리인 / 주소
    Pennie & Edmonds LLP
인용정보 피인용 횟수 : 30  인용 특허 : 7

초록

A method of attaching a micromechanical fluid control device to a substrate includes the steps of forming a first ring of a first adhesive around an aperture defined between a micromechanical fluid control device and a substrate. The first adhesive forms a first interface between the micromechanical

대표청구항

[ What is claimed is:] [1.]1. A method of attaching a micromechanical fluid control device to a substrate comprising the steps of:forming a first ring of a first adhesive around an aperture defined between a micromechanical fluid control device and a substrate, said first adhesive forming a first in

이 특허에 인용된 특허 (7)

  1. Selser Michael J. ; Arkilic Errol B. ; Taheri Babak A., Apparatus and method for mounting micromechanical fluid control components.
  2. Okamura Naomi (Kuki JPX) Aoki Hiroshi (Saitama JPX) Makino Junzo (Omiya JPX) Yagi Hajime (Tokyo JPX) Arai Yasuo (Saitama JPX) Yamanaka Takashi (Chiba JPX), Bonding method and adhesive useful for the method.
  3. Abbott Richard (Dearborn Heights MI), Dual adhesive method and article.
  4. Loux Alan D. ; Higdon William R. ; Slater Timothy G., Housing assembly for micromachined fluid handling structure.
  5. Barksdale Daniel L. (Brownsburg IN), Lap seam and method forming same.
  6. Gagne Robert J. (Glastonbury CT) Plein ; II William J. (South Windsor CT) Carson Kenneth (Shannon MS), Mirror door and method of making same.
  7. Maesaka Michinobu,JPX ; Oyama Jyunji,JPX ; Irie Makoto,JPX ; Hirakawa Atsushi,JPX, Sealing structure and method of sealing electronic component.

이 특허를 인용한 특허 (30)

  1. Lutz, Markus; Partridge, Aaron; Kronmueller, Silvia, Anchors for microelectromechanical systems having an SOI substrate, and method of fabricating same.
  2. Lutz,Markus; Partridge,Aaron; Kronmueller,Silvia, Anchors for microelectromechanical systems having an SOI substrate, and method of fabricating same.
  3. Enicks, Darwin Gene; Carver, Damian, Bandgap and recombination engineered emitter layers for SiGe HBT performance optimization.
  4. Enicks,Darwin Gene; Carver,Damian, Bandgap engineered mono-crystalline silicon cap layers for SiGe HBT performance enhancement.
  5. Partridge, Aaron; Lutz, Markus; Kronmueller, Silvia, Electromechanical system having a controlled atmosphere, and method of fabricating same.
  6. Partridge, Aaron; Lutz, Markus; Kronmueller, Silvia, Electromechanical system having a controlled atmosphere, and method of fabricating same.
  7. Partridge, Aaron; Lutz, Markus; Gupta, Pavan, Encapsulated microelectromechanical structure.
  8. Partridge, Aaron; Lutz, Markus; Gupta, Pavan, Encapsulated microelectromechanical structure.
  9. Partridge, Aaron; Lutz, Markus; Gupta, Pavan, Encapsulated microelectromechanical structure.
  10. Enicks,Darwin Gene, Method and system for controlled oxygen incorporation in compound semiconductor films for device performance enhancement.
  11. Lutz,Markus; Partridge,Aaron, Method for adjusting the frequency of a MEMS resonator.
  12. Lutz,Markus; Partridge,Aaron, Method for adjusting the frequency of a MEMS resonator.
  13. Harris, James M.; Patel, Sapna, Method for producing and testing a corrosion-resistant channel in a silicon device.
  14. Harris,James M.; Patel,Sapna, Method for producing and testing a corrosion-resistant channel in a silicon device.
  15. Partridge, Aaron; Lutz, Markus; Kronmueller, Silvia, Method of fabricating electromechanical device having a controlled atmosphere.
  16. Partridge, Aaron; Lutz, Markus; Kronmueller, Silvia, Method of fabricating microelectromechanical systems and devices having trench isolated contacts.
  17. Wolfgang Schahl DE; Peter Weichelt DE, Method of joining rail vehicle components and subassemblies by adhesion.
  18. Partridge, Aaron; Lutz, Markus; Kronmueller, Silvia, Microelectromechanical device including an encapsulation layer of which a portion is removed to expose a substantially planar surface having a portion that is disposed outside and above a chamber and including a field region on which integrated circuits are formed and methods for fabricating same.
  19. Partridge, Aaron; Lutz, Markus; Kronmueller, Silvia, Microelectromechanical device including an encapsulation layer of which a portion is removed to expose a substantially planar surface having a portion that is disposed outside and above a chamber and including a field region on which integrated circuits are formed, and methods for fabricating same.
  20. Partridge, Aaron; Lutz, Markus; Kronmueller, Silvia, Microelectromechanical device including an encapsulation layer of which a portion is removed to expose a substantially planar surface having a portion that is disposed outside and above a chamber and including a field region on which integrated circuits are formed, and methods for fabricating same.
  21. Partridge,Aaron; Lutz,Markus; Kronmueller,Silvia, Microelectromechanical systems and devices having thin film encapsulated mechanical structures.
  22. Partridge,Aaron; Lutz,Markus; Kronmueller,Silvia, Microelectromechanical systems having trench isolated contacts, and methods for fabricating same.
  23. Partridge,Aaron; Lutz,Markus; Kronmueller,Silvia, Microelectromechanical systems, and devices having thin film encapsulated mechanical structures.
  24. Enicks, Darwin G.; Friedrichs, Carl E.; Brucher, Richard A., System, apparatus and method for contaminant reduction in semiconductor device fabrication equipment components.
  25. Enicks,Darwin G.; Friedrichs,Carl E.; Brucher,Richard A., System, apparatus and method for contaminant reduction in semiconductor device fabrication equipment components.
  26. Lutz,Markus; Partridge,Aaron, Temperature controlled MEMS resonator and method for controlling resonator frequency.
  27. Lutz,Markus; Partridge,Aaron, Temperature controlled MEMS resonator and method for controlling resonator frequency.
  28. Lutz,Markus; Partridge,Aaron, Temperature controlled MEMS resonator and method for controlling resonator frequency.
  29. Partridge, Aaron; Lutz, Markus; Gupta, Pavan, Wafer encapsulated microelectromechanical structure.
  30. Partridge, Aaron; Lutz, Markus; Gupta, Pavan, Wafer encapsulated microelectromechanical structure and method of manufacturing same.
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