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Low thermal expansion composite comprising bodies of negative CTE material disposed within a positive CTE matrix 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
  • B32B-013/00
  • B32B-017/06
  • C03C-022/02
  • B22F-007/00
출원번호 US-0072248 (1998-05-04)
발명자 / 주소
  • Jin Sungho
  • Mavoori Hareesh
출원인 / 주소
  • Agere Systems Guardian Corp.
대리인 / 주소
    Lowenstein Sandler PC
인용정보 피인용 횟수 : 27  인용 특허 : 33

초록

A reduced CTE composite structure is made by providing a matrix material whose CTE is to be reduced, adding negative CTE bodies to the matrix material and mechanically coupling the matrix material to the negative CTE bodies as by deforming the composite structure. A preferred application is to make

대표청구항

[ What is claimed is:] [1.]1. A composite structure comprising:a matrix material having a positive coefficient of thermal expansion (CTE); anddisposed within said matrix material, a plurality of bodies of a material having a negative coefficient of thermal expansion comprising an alloy selected from

이 특허에 인용된 특허 (33)

  1. Tanaka Tomoo,JPX ; Ito Masaya,JPX, Al metal joined body.
  2. Taniguchi Masato,JPX ; Suzuki Osamu,JPX, Brazing alloy and composite assembly joined by using the same.
  3. Ito, Masaya, Ceramic and aluminum alloy composite.
  4. Marker Alexander J. ; Campbell John H., Cladding glass ceramic for use in high powered lasers.
  5. Lenling William J., Coating that enables soldering to non-solderable surfaces.
  6. Nonami Tohru,JPX ; Satoh Naoyoshi,JPX, Composite biological implant of a ceramic material in a metal substrate.
  7. Martin Jacob H. (Wellesley MA), Composite heat transfer device.
  8. Kennedy Christopher R. (Newark DE) Sonuparlak Birol (Newark DE) Fareed Ali S. (Wilmington DE) Garnier John E. (Newark DE) Schiroky Gerhard H. (Hockessin DE), Composite materials and methods for making the same.
  9. Kennedy Christopher Robin (Newark DE) Sonuparlak Birol (Newark DE) Fareed Ali Syed (Wilmington DE) Garnier John Edward (Newark DE) Schiroky Gerhard Hans (Hockessin DE) Landini Dennis James (Newark DE, Composite materials and methods for making the same.
  10. Marshall Andrew C. ; Fellman Michael L., Composite structure.
  11. Marshall Andrew C. ; Fellman Michael L., Composite structure.
  12. Marshall Andrew C. ; Fellman Michael L., Heat conduction honeycomb core.
  13. Nakamura Yasuyuki (Suita JPX) Hirano Kenji (Suita JPX), Heat-conductive composite material.
  14. Nakamura Yasuyuki (Takatsuki JPX) Kawakami Makoto (Suita JPX), Heat-conductive material and method of producing the same.
  15. Fu Cheng-Tsu (Hsinchu TWX) Li Ai-Kang (Hsinchu TWX) Lai Chung-Ping (Taipei TWX) Duann Jia-Ruey (Hsinchu TWX), High performance ceramic composites containing tungsten carbide reinforced chromium carbide matrix.
  16. Kodama Hironori (Hitachi JPX) Ogihara Satoru (Hitachi JPX) Arakawa Hideo (Hitachi JPX) Inoue Hirokazu (Ibaraki JPX) Yasutomi Yoshiyuki (Katsuta JPX) Miyoshi Tadahiko (Hitachi JPX), Installation structure of integrated circuit devices.
  17. Taniguti Masato (Nagoya JPX) Ito Masaya (Nagoya JPX), Joined body of ceramic member and metallic member, and process for joining ceramic member and metallic member.
  18. Takahashi Yoshikazu (Kasugai JPX) Suzuki Masahiko (Nagoya JPX) Takeuchi Makoto (Okazaki JPX) Deguchi Masaaki (Okazaki JPX), Longitudinal-effect type laminar piezoelectric/electrostrictive driver, and printing actuator using the driver.
  19. Numata Shun-ichi (Hitachi JPX) Fujisaki Koji (Hitachi JPX) Kinjo Noriyuki (Hitachi JPX) Imaizumi Junichi (Hitachi JPX) Mikami Yoshikatsu (Shimodate JPX), Low thermal expansion resin material and composite shaped article.
  20. Numata Shun-ichi (Hitachi JPX) Fujisaki Koji (Hitachi JPX) Kinjo Noriyuki (Hitachi JPX) Imaizumi Junichi (Hitachi JPX) Mikami Yoshikatsu (Shimodate JPX), Low thermal expansion resin material and composite shaped article.
  21. Richter Mark A. (West Palm Beach FL), Metal-composite bonding.
  22. Fukaya Yasuhiro (Nishi JPX) Hirai Shozo (Nishi JPX), Method for bonding ceramics and metals.
  23. Edamura Mizuo (10-9 ; Seiryodai 8-chome Tarumi-ku ; Kobe ; Hyogo JPX), Method of bonding ceramics and metal, or bonding similar ceramics among themselves; or bonding dissimilar ceramics.
  24. Seibold Robert W. (Santa Monica CA) Buller Bruce W. (Walnut CA) Gibson James O. (El Segundo CA), Method of making a fiber reinforced ceramic glass composites having tailored coefficient of thermal expansion.
  25. Keck Steven D. (Hockessin DE) Rocazella Michael A. (Newark DE) Engelgau Peter M. (Dover DE) Hannon Gregory E. (Newark DE) White Danny R. (Elkton MD) Nagelberg Alan S. (Wilmington DE), Methods of forming electronic packages.
  26. Glenn Thomas P. ; Hollaway Roy D.,PHX ; Panczak Anthony E., Near chip size integrated circuit package.
  27. Sandhage Kenneth H. (Randolph MA), Process for making ceramic/metal and ceramic/ceramic laminates by oxidation of a metal precursor.
  28. Jester Randy D. (1795 Lake Cunningham Rd. Greer SC 29651) Penoyer John A. (106 Strubridge Dr. Greenville SC 29615) Roth Douglas D. (604 Pack Mountain Ridge Rd. Taylors SC 29687) Frank Detlef (Karolin, Process for treating liquid crystal polymer film.
  29. Jester Randy Douglas (Greer SC) Penoyer John Arthur (Greenville SC) Roth Douglas Duane (Taylors SC) Frank Detlef (Mainz DEX) Onodera Minoru (Kurashiki JPX) Tsudaka Takeichi (Kurashiki JPX) Sato Toshi, Process for treating liquid crystal polymer film.
  30. Sekhar Jainagesh A. (Cincinnati OH) de Nora Vittorio (Nassau BSX), Refractory protective coated electroylytic cell components.
  31. Kohmoto Kenichiro (Itami JPX) Osada Mitsuo (Sakata JPX), Semiconductor element-mounting composite heat-sink base.
  32. Gore John G., Slotted printed circuit board surface mount stress relief system.
  33. Sue Jiinjen A. (Indianapolis IN) Troue Harden H. (Plainfield IN), Titanium nitride and zirconium nitride coating compositions, coated articles and methods of manufacture.

이 특허를 인용한 특허 (27)

  1. DiGiovanni, Anthony A., Abrasive article and method of forming.
  2. DiGiovanni, Anthony A., Abrasive articles and earth-boring tools.
  3. Zhong,Johnny; Wang,Steve; Xu,Senlu, Athermal fused coupler package for optical fibers.
  4. Dennis, Timothy A., Coefficient of thermal expansion filler for vanadium-based frit materials and/or methods of making and/or using the same.
  5. Dennis, Timothy A., Coefficient of thermal expansion filler for vanadium-based frit materials and/or methods of making and/or using the same.
  6. Dennis, Timothy A., Coefficient of thermal expansion filler for vanadium-based frit materials and/or methods of making and/or using the same.
  7. Whitman, Bruce; Likozar, Martin; Kalman, Steve; Kunkel, Cory; Burdoff, Theodore, Composite structural components with reduced coefficient of thermal expansion.
  8. DiGiovanni, Anthony A.; Lyons, Nicholas J.; Hale, Matthew S.; Morozov, Konstantin E.; Liversage, John H.; Scott, Danny E.; Sinor, Allen, Cutting element and method of forming thereof.
  9. Vempati, Chaitanya K.; Patel, Suresh G.; Oldham, Jack Thomas; Fuselier, Danielle M.; Powers, Jim; Lyons, Nicholas J., Cutting element for a drill bit used in drilling subterranean formations.
  10. DiGiovanni, Anthony A.; Lyons, Nicholas J.; Hale, Matthew S.; Morozov, Konstantin E.; Liversage, John H.; Scott, Danny E.; Sinor, L. Allen, Cutting element incorporating a cutting body and sleeve and method of forming thereof.
  11. Vempati, Chaitanya K.; Patel, Suresh G.; Oldham, Jack T.; Fuselier, Danielle M.; Powers, Jim R.; Lyons, Nicholas J., Cutting elements for drill bits for drilling subterranean formations and methods of forming such cutting elements.
  12. Vempati, Chaitanya K.; Oldham, Jack Thomas; Reek, Edwin R; Fuselier, Danielle M.; Patel, Suresh G.; Laing, Robert, Drill bit for use in drilling subterranean formations.
  13. Hogan, John P.; Dennis, Timothy Alan; Petrmichl, Rudolph Hugo; Kemenah, Greg, Frits for use in vacuum insulating glass (VIG) units, and/or associated methods.
  14. Shiomi, Kazuhiro; Ishio, Masaaki; Hasegawa, Tsuyoshi, Heat sink member and method of manufacturing the same.
  15. Jones,Keith D., Materials for electronic devices.
  16. Dennis, Timothy A., Method of making vacuum insulated glass (VIG) window unit.
  17. DiGiovanni, Anthony A., Methods of forming abrasive articles.
  18. DiGiovanni, Anthony A., Methods of forming abrasive articles.
  19. Sreeram, Attiganal N.; Lewis, Brian; Hozer, Leszek; Liberatore, Michael James; Minogue, Gerard, Thermal interface material and heat sink configuration.
  20. Lewis, Brian G.; Singh, Bawa; Laughlin, John P.; Kyaw, David V.; Ingham, Anthony E.; Sreeram, Attiganal N.; Hozer, Leszek; Liberatore, Michael J.; Minogue, Gerard R., Thermal interface material and solder preforms.
  21. Lewis,Brian G.; Singh,Bawa; Laughlin,John P.; Kyaw,David V.; Ingham,Anthony E.; Sreeram,Attiganal N.; Hozer,Leszek; Liberatore,Michael J.; Minogue,Gerard R., Thermal interface material and solder preforms.
  22. Whitman, Bruce D.; Likozar, Martin; Kalman, Steve; Kunkel, Cory; Burdorff, Theodore, Thermoplastic components with reduced coefficient of thermal expansion.
  23. Hogan, John P.; Dennis, Timothy Alan; Petrmichl, Rudolph Hugo; Kemenah, Greg, Vacuum insulating glass (VIG) unit with lead-free dual-frit edge seals and/or methods of making the same.
  24. Dennis, Timothy A., Vanadium-based frit materials, and/or methods of making the same.
  25. Dennis, Timothy A., Vanadium-based frit materials, and/or methods of making the same.
  26. Dennis, Timothy A., Vanadium-based frit materials, and/or methods of making the same.
  27. Dennis, Timothy A., Vanadium-based frit materials, binders, and/or solvents and methods of making the same.
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