초록 ▼

The present invention is directed to an LED lamp and method of using one or more lamps, and portable lighting products such as flashlights using such LED lamp(s). The LED lamp according to the invention provides uniformly distributed light that radiates spherically approximately 270.degree. in all d

The present invention is directed to an LED lamp and method of using one or more lamps, and portable lighting products such as flashlights using such LED lamp(s). The LED lamp according to the invention provides uniformly distributed light that radiates spherically approximately 270.degree. in all directions, both radially and axially. This newly designed lamp is ideally suited as a source of illumination for beam lights of the type employing reflective surfaces to produce a beam of light. The at least one chip is encased in at least one envelope surrounding the chip, with the envelope extending from a first position below the position of the at least one chip to a second position above the chip position. The second position of the envelope forms a lens in from of the at least one chip with the surface of the lens being configured and positioned relative to the ship such that a substantially uniform portion of light emitted from the chip is reflected off of the surface. In this manner, light is radiated spherically over an angle up to 270.degree. relative to the chip position. In the preferred embodiment, the envelope is formed as a cylinder at its lower position and the lens is formed as a transitional surface extending from a position below the position of the chip at an angle or curvature inward from the cylindrical position to encase the chip.

대표청구항 ▼

[ What is claimed is:] [1.]1. An LED lamp comprising at least one semiconductor chip coupled to a source of electrical power, said at least one chip being encased in at least one envelope surrounding said at least one chip, said at least one envelope having a first portion with a central axis and at

[ What is claimed is:] [1.]1. An LED lamp comprising at least one semiconductor chip coupled to a source of electrical power, said at least one chip being encased in at least one envelope surrounding said at least one chip, said at least one envelope having a first portion with a central axis and at least one side wall, and a second portion adjacent to said first portion, said second portion forming a lens in front of said at least one chip with the surface of said lens being configured and positioned relative to said at least one chip such that a substantially uniform portion of light emitted from said at least one chip is reflected off of said surface, such that light is radiated spherically over an angle greater than 180.degree. relative to said chip position.