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[미국특허] Method and device for machining holes or shapes of varying profile using an excimer laser 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B23K-026/00
출원번호 US-0359811 (1999-07-23)
우선권정보 FRX, 19980730, 98 09742
발명자 / 주소
  • Fournier Gerard Albert Felix,FRX
  • Vigneau Joel Olivier Alfred Abel,FRX
출원인 / 주소
  • Societe Nationale d'Etude et de Construction de Moteurs d'Aviation "Snecma", FRX
대리인 / 주소
    Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
인용정보 피인용 횟수 : 39  인용 특허 : 4

초록 ▼

A device for machining a hole or a shape of varying profile in a mechanical workpiece using an excimer laser comprises a screen having an aperture of predetermined shape disposed between the excimer laser and a device for focussing the laser beam, the screen being movable in a plane perpendicular to

대표청구항 ▼

[ What is claimed is:] [1.]1. A device for machining a hole or a shape of varying profile in a mechanical workpiece using an excimer laser, said device comprising an excimer laser which emits a beam in the form of pulses, a device for focussing said beam, and a screen disposed between the excimer la

이 특허에 인용된 특허 (4) 인용/피인용 타임라인 분석

  1. Tanaka Minoru (Yokohama JPX) Oshida Yoshitada (Fujisawa JPX) Yoshitake Yasuhiro (Yokohama JPX) Tanimoto Tetsuzo (Yokohama JPX), Illuminating method and illuminating apparatus for carrying out the same, and projection exposure method and projection.
    상세보기
  2. Gu Bo (Kanata CAX) Hunter John (Almonte CAX), Laser machining of a workpiece through adjacent mask by optical elements creating parallel beams.
    상세보기
  3. Ota Kazuo,JPX, Laser machining system for sequential irradiation of machining points.
    상세보기
  4. Mourou Gerard A. (Ann Arbor MI) Du Detao (Ann Arbor MI) Dutta Subrata K. (Ann Arbor MI) Elner Victor (Ann Arbor MI) Kurtz Ron (Ann Arbor MI) Lichter Paul R. (Ann Arbor MI) Liu Xinbing (Ann Arbor MI) , Method for controlling configuration of laser induced breakdown and ablation.
    상세보기

이 특허를 인용한 특허 (39) 인용/피인용 타임라인 분석

  1. Nawrodt, Sebastian; Ullmann, Ronny; Heinig, Karsten; Matthies, Christian; Weisser, Juergen, Apparatus and method for generating separating fissures in a substrate.
    상세보기
  2. Sulfridge, Marc, Conductive interconnect structures and formation methods using supercritical fluids.
    상세보기
  3. Sulfridge, Marc, Conductive interconnect structures and formation methods using supercritical fluids.
    상세보기
  4. Sulfridge, Marc, Conductive interconnect structures and formation methods using supercritical fluids.
    상세보기
  5. Kling, Carl C., Configured-hole high-speed drilling system for micro-via pattern formation, and resulting structure.
    상세보기
  6. Koga, Norihisa; Koga, Shinji; Yoshitaka, Naoto; Nishiya, Akira, Laser processing apparatus and laser processing method.
    상세보기
  7. Von Borstel, Michael, Laser processing machine with gas flushed beam guiding chamber.
    상세보기
  8. Bass, Isaac Louis; Guss, Gabriel Mark, Method and system for laser-based formation of micro-shapes in surfaces of optical elements.
    상세보기
  9. Chong, Chin Hui; Lee, Choon Kuan, Method of manufacturing an interposer.
    상세보기
  10. Sulfridge, Marc, Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods.
    상세보기
  11. Sulfridge, Marc, Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods.
    상세보기
  12. Sulfridge, Marc, Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods.
    상세보기
  13. Kuhn, Terrel E.; Flamand, Sossity A.; Woodcock, Gregory O.; Dudebout, Rodolphe; Frye, Lowell, Methods of forming fan-shaped effusion holes in combustors.
    상세보기
  14. Hiatt, William M.; Kirby, Kyle K., Microelectronic devices and methods for filing vias in microelectronic devices.
    상세보기
  15. Hiatt, William M.; Kirby, Kyle K., Microelectronic devices and methods for filling vias in microelectronic devices.
    상세보기
  16. Kirby, Kyle K.; Akram, Salman; Hembree, David R.; Rigg, Sidney B.; Farnworth, Warren M.; Hiatt, William M., Microelectronic devices and methods for forming interconnects in microelectronic devices.
    상세보기
  17. Kirby, Kyle K.; Akram, Salman; Hembree, David R.; Rigg, Sidney B.; Farnworth, Warren M.; Hiatt, William M., Microelectronic devices and methods for forming interconnects in microelectronic devices.
    상세보기
  18. Clark, Douglas; Oliver, Steven D.; Kirby, Kyle K.; Dando, Ross S., Microelectronic workpieces and methods and systems for forming interconnects in microelectronic workpieces.
    상세보기
  19. Rigg, Sidney B.; Watkins, Charles M.; Kirby, Kyle K.; Benson, Peter A.; Akram, Salman, Microelectronics devices, having vias, and packaged microelectronic devices having vias.
    상세보기
  20. Lee, Teck Kheng; Lim, Andrew Chong Pei, Microfeature workpiece substrates having through-substrate vias, and associated methods of formation.
    상세보기
  21. Hiatt, William M.; Dando, Ross S., Microfeature workpieces and methods for forming interconnects in microfeature workpieces.
    상세보기
  22. Borthakur, Swarnal, Microfeature workpieces having conductive interconnect structures formed by chemically reactive processes, and associated systems and methods.
    상세보기
  23. Borthakur, Swarnal, Microfeature workpieces having conductive interconnect structures formed by chemically reactive processes, and associated systems and methods.
    상세보기
  24. Borthakur, Swarnal, Microfeature workpieces having conductive interconnect structures formed by chemically reactive processes, and associated systems and methods.
    상세보기
  25. Tuttle, Mark E., Microfeature workpieces having interconnects and conductive backplanes, and associated systems and methods.
    상세보기
  26. Tuttle, Mark E., Microfeature workpieces having interconnects and conductive backplanes, and associated systems and methods.
    상세보기
  27. Lee, Teck Kheng, Partitioned through-layer via and associated systems and methods.
    상세보기
  28. Lee, Teck Kheng, Partitioned through-layer via and associated systems and methods.
    상세보기
  29. Lee, Teck Kheng, Partitioned through-layer via and associated systems and methods.
    상세보기
  30. Loringer, Gary, Process for drilling holes through a thermal barrier coating.
    상세보기
  31. Watkins, Charles M.; Hiatt, William M., System and methods for forming apertures in microfeature workpieces.
    상세보기
  32. Watkins, Charles M.; Hiatt, William M., Systems and methods for forming apertures in microfeature workpieces.
    상세보기
  33. Watkins, Charles M.; Hiatt, William M., Systems and methods for forming apertures in microfeature workpieces.
    상세보기
  34. Watkins, Charles M.; Hiatt, William M., Systems and methods for forming apertures in microfeature workpieces.
    상세보기
  35. Watkins, Charles M.; Hiatt, William M., Systems and methods for forming apertures in microfeature workpieces.
    상세보기
  36. Akram, Salman; Watkins, Charles M.; Hiatt, William M.; Hembree, David R.; Wark, James M.; Farnworth, Warren M.; Tuttle, Mark E.; Rigg, Sidney B.; Oliver, Steven D.; Kirby, Kyle K.; Wood, Alan G.; Velicky, Lu, Through-wafer interconnects for photoimager and memory wafers.
    상세보기
  37. Akram, Salman; Watkins, Charles M.; Hiatt, William M.; Hembree, David R.; Wark, James M.; Farnworth, Warren M.; Tuttle, Mark E.; Rigg, Sidney B.; Oliver, Steven D.; Kirby, Kyle K.; Wood, Alan G.; Velicky, Lu, Through-wafer interconnects for photoimager and memory wafers.
    상세보기
  38. Akram, Salman; Watkins, Charles M.; Hiatt, William M.; Hembree, David R.; Wark, James M.; Farnworth, Warren M.; Tuttle, Mark E.; Rigg, Sidney B.; Oliver, Steven D.; Kirby, Kyle K.; Wood, Alan G.; Velicky, Lu, Through-wafer interconnects for photoimager and memory wafers.
    상세보기
  39. Bunker, Ronald Scott; Wei, Bin; Ritter, Ann Melinda; Lipkin, Don Mark; Rebak, Raul Basilio; Kool, Lawrence Bernard; Gray, Dennis Michael, Turbine components with cooling features and methods of manufacturing the same.
    상세보기

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