초록 ▼

An electronic device includes a thermally isolated element formed above a substrate such that the thermally isolated element is isolated from the substrate by a cavity, a thermal-to-electrical transducer for converting heat to an electrical signal, an electrical-to-thermal transducer for converting

An electronic device includes a thermally isolated element formed above a substrate such that the thermally isolated element is isolated from the substrate by a cavity, a thermal-to-electrical transducer for converting heat to an electrical signal, an electrical-to-thermal transducer for converting an electrical signal to heat, a functional material whose physical property changes at a particular temperature, and a circuit, formed on the substrate, for controlling the electrical-to-thermal transducer in accordance with a signal received from the thermal-to-electrical transducer. The thermal-to-electrical transducer, the electrical-to-thermal transducer, and the functional material are formed in the thermally isolated element.

대표청구항 ▼

[ What is claimed is:] [1.]1. An electronic device, comprising:a substrate;a functional device which is operated at a desired temperature;a thermally isolated diaphragm formed above the substrate, said thermally isolated diaphragm including a device portion which is isolated from the substrate by a

[ What is claimed is:] [1.]1. An electronic device, comprising:a substrate;a functional device which is operated at a desired temperature;a thermally isolated diaphragm formed above the substrate, said thermally isolated diaphragm including a device portion which is isolated from the substrate by a cavity; anda electrical-to-thermal transducer formed in said thermally isolated diaphragm for converting an electrical signal to heat;at least a part of the functional device being in thermal contact with the device portion of the thermally isolated diaphragm.