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Protection of microelectronic devices during packaging 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/44
출원번호 US-0572562 (2000-05-16)
발명자 / 주소
  • Kenneth A. Peterson
  • William R. Conley
출원인 / 주소
  • Sandia Corporation
대리인 / 주소
    Robert D. Watson
인용정보 피인용 횟수 : 138  인용 특허 : 12

초록 ▼

The present invention relates to a method of protecting a microelectronic device during device packaging, including the steps of applying a water-insoluble, protective coating to a sensitive area on the device; performing at least one packaging step; and then substantially removing the protective co

대표청구항 ▼

1. A method of protecting a microelectronic device during device packaging, comprising, in the order presented:providing a microelectronic device having a sensitive area; vapor depositing a water-insoluble, protective coating on the sensitive area; performing at least one packaging step; and substan

이 특허에 인용된 특허 (12)

  1. Kellam Mark D. ; Berry Michele J., Encapsulated micro-relay modules and methods of fabricating same.
    상세보기
  2. Alfaro Rafael C. (Carrollton TX) Blair David (Allen TX), Grid array masking tape process.
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    상세보기
  4. Barron Carole C. ; Fleming James G. ; Montague Stephen, Method for integrating microelectromechanical devices with electronic circuitry.
    상세보기
  5. Smith James H. ; Ricco Antonio J., Method for preventing micromechanical structures from adhering to another object.
    상세보기
  6. Kaeriyama Toshiyuki,JPX ; Harada Takeshi,JPX, Method of cleaning wafer after partial saw.
    상세보기
  7. Gale Richard O. (Richardson TX) Mignardi Michael A. (Dallas TX), Method of protecting micromechanical devices during wafer separation.
    상세보기
  8. Brenner Mike ; Hogan Timothy J. ; Dyer Lawrence D. ; Lester Lisa A. T. ; Harden Joseph G., Method of reducing wafer particles after partial saw using a superhard protective coating.
    상세보기
  9. Kao Pai-Hsiang ; Mathew Ranjan J. ; De Vera Cornelio, Methods and apparatuses for singulation of microelectromechanical systems.
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  10. Kinsman Larry (Boise ID), Packaging means for a semiconductor die having particular shelf structure.
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  11. Degani Yinon (Highland Park NJ) Kossives Dean P. (Glen Gardner NJ), Process for fabircating an integrated circuit.
    상세보기
  12. Warren Robert W., Top of die chip-on-board encapsulation.
    상세보기

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