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A semiconductor optical radiation package includes a leadframe, at least one semiconductor optical radiation emitter and an encapsulant. The leadframe has a heat extraction member, which supports the semiconductor optical emitter and provides one or more thermal paths for removing heat generated wit

A semiconductor optical radiation package includes a leadframe, at least one semiconductor optical radiation emitter and an encapsulant. The leadframe has a heat extraction member, which supports the semiconductor optical emitter and provides one or more thermal paths for removing heat generated within the emitter to the ambient environment, as well as at least two electrical leads for providing electrical coupling to the semiconductor optical radiation emitter. The encapsulant covers and protects the emitter and optional wire bonds from damage and allows radiation to be emitted from the emitter into the ambient environment. The semiconductor optical radiation package provides high emitted flux and is preferably compatible with automated processing techniques.

대표청구항 ▼

1. A semiconductor radiation emitter package comprising:a heat extraction member having a low thermal resistance; at least one semiconductor radiation emitter in thermal contact with the heat extraction member, said at least one semiconductor radiation emitter having an anode and a cathode for energ

1. A semiconductor radiation emitter package comprising:a heat extraction member having a low thermal resistance; at least one semiconductor radiation emitter in thermal contact with the heat extraction member, said at least one semiconductor radiation emitter having an anode and a cathode for energizing the semiconductor radiation emitter; at least one anodic electrical lead coupled to an anode of at least one of said semiconductor radiation emitters, said at least one anodic electrical lead having a high thermal resistance; at least one cathodic electrical lead coupled to a cathode of at least one of said semiconductor radiation emitters, said at least one cathodic electrical lead having a high thermal resistance; and an encapsulant substantially transparent to radiation from said at least one semiconductor radiation emitter, the encapsulant formed to cover each semiconductor radiation emitter, a portion of said at least one anodic electrical lead, a portion of each cathodic electrical lead, and a portion of the heat extraction member.