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Molding method for BGA semiconductor chip package 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B29C-045/02
  • B29C-045/14
  • B29C-070/70
출원번호 US-0418569 (1999-10-15)
발명자 / 주소
  • Kao-Yu Hsu TW
  • Chun Hung Lin TW
  • Tao-Yu Chen TW
출원인 / 주소
  • Advanced Semiconductor Engineering, Inc. TW
인용정보 피인용 횟수 : 40  인용 특허 : 11

초록 ▼

A molding method for a BGA semiconductor chip package comprising a substrate supporting an array of chips having two lines of bonding pads formed at two respective side thereof. The molding method comprises the steps of: (A) providing a molding apparatus comprising a molding die having a molding cav

대표청구항 ▼

1. A molding method for a BGA semiconductor chip package comprising a substrate supporting an array of chips each having only two lines of bonding pads formed at two opposing sides thereof, the molding method comprising the steps of:providing a molding apparatus comprising a molding die having a mol

이 특허에 인용된 특허 (11)

  1. Mess Leonard E., Ball grid array (BGA) encapsulation mold.
    상세보기
  2. Huang Chien Ping,TWX ; Yu Kevin,TWX ; Huang Chih Ming,TWX, Encapsulating method of substrate based electronic device.
    상세보기
  3. Saeki Junichi (Yokohama JPX) Kaneda Aizo (Yokohama JPX) Ozawa Masakazu (Yonezawa JPX) Nakagawa Takashi (Takasaki JPX) Nishi Kunihiko (Kokubunji JPX), Method and apparatus for encapsulating semi-conductors.
    상세보기
  4. Lee Shaw Wei ; Takiar Hem P. ; Drummond Fred, Method for forming a panel of packaged integrated circuits.
    상세보기
  5. Newman Keith G. (Sunnyvale CA), Method of making integrated circuit package having multiple bonding tiers.
    상세보기
  6. Woosley Alan H. (Austin TX) Downey ; Jr. Harold A. (Austin TX) Mace Everitt W. (Hutto TX), Method of packaging a semiconductor device.
    상세보기
  7. Chia Chok J. ; Lim Seng-Sooi ; Low Qwai H., Molded array integrated circuit package.
    상세보기
  8. Yoshida Isamu (Yokohama JPX) Saeki Junichi (Yokohama JPX) Tsunoda Shigeharu (Fujisawa JPX) Nishi Kunihiko (Tokyo JPX) Mitani Masao (Yokohama JPX), Resin encapsulating apparatus for semiconductor devices.
    상세보기
  9. Takeda Shinji,JPX, Resin-sealed type ball grid array IC package and manufacturing method thereof.
    상세보기
  10. Kang Je Bong,KRX ; Song Young Yee,KRX ; Sung Si Chan,KRX, Semiconductor integrated circuit device having dummy bonding wires.
    상세보기
  11. Lim Hong Woo,KRX, Substrate having gate recesses or slots and molding device and molding method thereof.
    상세보기

이 특허를 인용한 특허 (40)

  1. Ko, WonJun; Cho, NamJu, Base package system for integrated circuit package stacking and method of manufacture thereof.
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  2. Donofrio, Matthew; Nordby, Howard; Andrews, Peter S., Conformally coated light emitting devices and methods for providing the same.
    상세보기
  3. Vinciarelli, Patrizio; LaFleur, Michael B., Encapsulation method for electronic modules.
    상세보기
  4. Kuo,Frank, Encapsulation method for leadless semiconductor packages.
    상세보기
  5. Kuo, Frank, Encapsulation techniques for leadless semiconductor packages.
    상세보기
  6. Ahmad,Syed Sajid, Interconnecting substrates for electrical coupling of microelectronic components.
    상세보기
  7. Ahmad,Syed Sajid, Interconnecting substrates for electrical coupling of microelectronic components.
    상세보기
  8. Oga, Akira; Inao, Hisaho; Hidaka, Hiroshi, Lead frame and method for fabricating resin-encapsulated semiconductor device.
    상세보기
  9. Negley, Gerald H.; Van De Ven, Antony Paul; Hunter, F. Neal, Lighting device.
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  10. Chakraborty, Arpan, Low index spacer layer in LED devices.
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  11. Lee, Kian Chai; Tim, Teoh Bee Yong; M, Vijendran; Choong, Lien Wah, Method and apparatus for distributing mold material in a mold for packaging microelectronic devices.
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  12. Bolken, Todd O., Method and apparatus for packaging a microelectronic die.
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  13. Bolken, Todd O., Method and apparatus for packaging a microelectronic die.
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  14. Bolken, Todd O., Method and apparatus for packaging a microelectronic die.
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  15. Chan, Shiun-Wei; Ke, Chih-Hsun, Method for packaging light emitting diode.
    상세보기
  16. Ahmad, Syed Sajid, Method of Interconnecting substrates for electrical coupling of microelectronic components.
    상세보기
  17. Cobbley,Chad A., Method of encapsulating interconnecting units in packaged microelectronic devices.
    상세보기
  18. Cobbley,Chad A., Method of encapsulating packaged microelectronic devices with a barrier.
    상세보기
  19. Gotou, Masakatsu; Kasai, Norihiko, Method of manufacturing a semiconductor device.
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  20. Hayashida, Tetsuya; Kasai, Norihiko, Method of manufacturing a semiconductor device in which a block molding package utilizes air vents in a substrate.
    상세보기
  21. Negley, Gerald H.; Leung, Michael, Methods of coating semiconductor light emitting elements by evaporating solvent from a suspension.
    상세보기
  22. Bolken, Todd O., Microelectronic devices and microelectronic die packages.
    상세보기
  23. Leung, Michael S.; Tarsa, Eric J.; Ibbetson, James, Molded chip fabrication method and apparatus.
    상세보기
  24. Leung, Michael S.; Tarsa, Eric J.; Ibbetson, James, Molded chip fabrication method and apparatus.
    상세보기
  25. Leung, Michael S; Tarsa, Eric J; Ibbetson, James, Molded chip fabrication method and apparatus.
    상세보기
  26. Shih-Chang Lee TW; Gwo Liang Weng TW, Molding apparatus and molding method for flexible substrate based package.
    상세보기
  27. Gerber, Mark Allen; O'Conner, Shawn Martin, Package-on-package semiconductor assembly.
    상세보기
  28. Cobbley, Chad A., Packaged microelectronic devices with interconnecting units.
    상세보기
  29. James, Stephen L.; Cobbley, Chad A., Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectronic devices.
    상세보기
  30. James,Stephen L.; Cobbley,Chad A., Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectronic devices.
    상세보기
  31. Hussell, Christopher P.; Emerson, David T., Phosphor distribution in LED lamps using centrifugal force.
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  32. Hussell, Christopher P.; Emerson, David T., Phosphor distribution in LED lamps using centrifugal force.
    상세보기
  33. Roberts, John; Chaloupecky, Robert; You, Chenhua, Solid state array modules for general illumination.
    상세보기
  34. Roberts, John; Chaloupecky, Robert; You, Chenhua, Solid state linear array modules for general illumination.
    상세보기
  35. Farnworth, Warren M., Systems and methods for compressing an encapsulant adjacent a semiconductor workpiece.
    상세보기
  36. Eing-Chieh Chen TW; Cheng-Yuan Lai TW; Tzu-Yi Tien TW, Thermally-enhanced stacked-die ball grid array semiconductor package and method of fabricating the same.
    상세보기
  37. Negley, Gerald; Leung, Michael; Becerra, Maryanne; Tarsa, Eric; Andrews, Peter, Uniform emission LED package.
    상세보기
  38. Chitnis, Ashay; Ibbetson, James; Chakraborty, Arpan; Tarsa, Eric J.; Keller, Bernd; Seruto, James; Fu, Yankun, Wafer level phosphor coating method and devices fabricated utilizing method.
    상세보기
  39. Chitnis, Ashay; Ibbetson, James; Keller, Bernd; Emerson, David T.; Edmond, John; Bergmann, Michael J.; Cabalu, Jasper S.; Britt, Jeffrey C.; Chakraborty, Arpan; Tarsa, Eric; Seruto, James; Fu, Yankun, Wafer level phosphor coating method and devices fabricated utilizing method.
    상세보기
  40. Chakraborty, Arpan, Wafer level phosphor coating technique for warm light emitting diodes.
    상세보기

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