초록 ▼

A method for cleaning or recycling a polishing pad conditioning disk used in a chemical mechanical polishing apparatus is disclosed. In the method, a conditioning disk that has a top surface formed of diamond particles and covered by a layer of polishing debris such as silicon oxide is first provide

A method for cleaning or recycling a polishing pad conditioning disk used in a chemical mechanical polishing apparatus is disclosed. In the method, a conditioning disk that has a top surface formed of diamond particles and covered by a layer of polishing debris such as silicon oxide is first provided. A water jet that has a pressure of at least 1,500 psi, or preferably, 3,000 psi is directed toward the top surface of the conditioning disk for at least 5 min., and preferably, for at least 10 min. to substantially remove the polishing debris. The conditioning disk is then positioned on a heated surface and heated to a temperature of at least 40.degree. C. while simultaneously being blown by a flow of inert gas or CO2 maintained at 0.degree. C. or below on the top surface to remove any residual polishing debris by causing a thermal shock in the silicon oxide films and a separation from the conditioning disk.

대표청구항 ▼

1. A method for cleaning a polishing pad conditioning disk comprising the steps of:providing a conditioning disk having a top surface covered with polishing debris; directing a water jet of at least 1,500 psi pressure toward said top surface for at least 5 min. to substantially remove said polishing

1. A method for cleaning a polishing pad conditioning disk comprising the steps of:providing a conditioning disk having a top surface covered with polishing debris; directing a water jet of at least 1,500 psi pressure toward said top surface for at least 5 min. to substantially remove said polishing debris; and heating the conditioning disk to a temperature of at least 30.degree. C. while simultaneously directing a flow of inert gas or CO2 maintained at 0.degree. C. or below onto said top surface to remove residual polishing debris.