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Light emitting diode mounting structure 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F21V-021/00
출원번호 US-0766837 (2001-01-23)
우선권정보 JP-0326941 (1998-11-17); JP-0004434 (1999-11-01)
발명자 / 주소
  • Masaya Ohkohdo JP
  • Hirokazu Sakata JP
출원인 / 주소
  • Ichikoh Industries, Ltd. JP
대리인 / 주소
    Foley & Lardner
인용정보 피인용 횟수 : 35  인용 특허 : 6

초록

A light emitting diode mounting structure for a light emitting diode having four leads has two metal plates fixed to wire on a housing. The leads engage the metal plates in electrical contact therewith and are supported by the metal plates, a surface part of which reflects light from the light emitt

대표청구항

1. A light emitting diode mounting structure comprising:a light emitting diode having a lead; a non-metallic holder engaging with a housing; and a metal connecting member mounted to the holder, the connecting member having an integrally formed foot part and clip part, the lead being grabbed in and s

이 특허에 인용된 특허 (6)

  1. Rifkin, Gary L.; Lawrence, Charles C.; Zilber, Sam; Hamby, Michael, LED Circuit board indicator housing and tie-bar assembly.
  2. Ahroni Joseph M., Lamp unit with improved push-in type bulb holder.
  3. Lin Te H. (5F ; No. 38 ; Lane 1050 ; Ming-Hoo Rd. HsinChu City TWX), Miniature light set.
  4. Ahroni Joseph M. (2701 W. Manor Pl. ; #204 Seattle WA 98199), Series-parallel connected miniature light set.
  5. Dragoon Daniel (Manasquan NJ), Surface mounted LED package.
  6. Critelli John (Point Pleasant NJ) Oesterheld Klaus (Middletown NJ) DeBaun Carleton (Toms River NJ) Dowstra Bart (Barnegat NJ), Surface mounted led package.

이 특허를 인용한 특허 (35)

  1. Lodhie, Pervaiz, Circular light structure.
  2. Lodhie, Pervaiz, Circular light structure.
  3. Lodhie,Pervaiz, Circular light structure.
  4. Conroy, David, Device for connecting a cable to an electric component arranged in a housing.
  5. Mrakovich, Matthew; Nall, Jeffrey, Flexible high-power LED lighting system.
  6. Mrakovich,Matthew; Nall,Jeffrey, Flexible high-power LED lighting system.
  7. Mrakovich,Matthew; Nall,Jeffrey, Flexible high-power LED lighting system.
  8. Wu, Hsiang-Chen, Illuminant device and manufacturing method thereof.
  9. Hayes, Earl J., LED and flex cable lighting assembly.
  10. Lodhie, Pervaiz, LED bulb.
  11. Maeta, Susumu; Omae, Mitsuhiro; Matsumoto, Akihisa; Watanabe, Takafumi, LED indicator casing, LED indicator, and LED indicator joint member comprising hanger members.
  12. Cho, Jae Ho; Kim, Jung Yun; Cho, Kang Hyun, LED lamp.
  13. Lodhie, Pervaiz, LED light.
  14. Lodhie, Pervaiz, LED light.
  15. Lodhie, Pervaiz, LED light.
  16. Kuo,Ming Shan; Chen,Wei Jen, LED light assembly with LED connecting device.
  17. Lodhie, Pervaiz, LED light bulb for use in an illuminated aircraft sign.
  18. Lodhie, Pervaiz, LED light module.
  19. Lodhie, Pervaiz, LED light module.
  20. Lodhie, Pervaiz, LED light module with cutouts.
  21. Lodhie, Pervaiz, LED light module with cutouts.
  22. Muguruma,Shuji; Funamoto,Keiji, Light emitting diode board.
  23. Moriyama,Hideo; Yanagita, legal representative,Koichi; Yanagita, deceased,Munehiko, Light emitting module.
  24. Lodhie, Pervaiz, Loop LED light.
  25. Uhler,George J.; Trojan,Thomas, Low voltage track lighting assembly and system.
  26. Chan, Timothy, Method and system for attachment of light emitting diodes to circuitry for use in lighting.
  27. Mighetto,Paul R., Modular lighting apparatus.
  28. Talavera González, Néstor; Barrios Muñoz, Arturo Ángel; Cavazos Ramos, Oscar René; Rebolledo Salazar, Luis, Module for an LED lamp that allows for two different types of connections to power with sufficient heat dissipation capacity.
  29. Oesterheld, Klaus; Jenkins, Kenneth, Surface mount circuit board indicator.
  30. Ling, Elizabeth Fung Ching; Wai, Chia Chee; Joh, Ng Joh; Peng, Koay Hui, System and method for surface mountable display.
  31. Lodhie, Pervaiz, Two-stage LED light module.
  32. Lodhie, Pervaiz, Two-stage LED light module.
  33. Seo, Won Cheol; Cho, Dae Sung, Wafer-level light emitting diode and wafer-level light emitting diode package.
  34. Seo, Won Cheol; Cho, Dae Sung, Wafer-level light emitting diode package and method of fabricating the same.
  35. Seo, Won Cheol; Cho, Dae Sung, Wafer-level light emitting diode package and method of fabricating the same.
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