초록 ▼

A chip-scale sensor package is described. In one embodiment, the chip-scale sensor package includes a semiconductor substrate having a sensor region, and a semiconductor cap having a recess. The semiconductor cap is bonded to the semiconductor substrate with a thermocompression bond to form a cavity

A chip-scale sensor package is described. In one embodiment, the chip-scale sensor package includes a semiconductor substrate having a sensor region, and a semiconductor cap having a recess. The semiconductor cap is bonded to the semiconductor substrate with a thermocompression bond to form a cavity therebetween. The semiconductor substrate is bonded to the semiconductor cap using different types of materials. The semiconductor substrate and/or the semiconductor cap may optionally include a semiconductor device such as an electronically trimmable integrated circuit fabricated thereon. In addition, the semiconductor substrate may optionally include an integral stress isolation flexible region for isolation of the sensor region.

대표청구항 ▼

1. A chip-scale sensor package, comprising:a semiconductor substrate including at least one electronically trimmable integrated circuit fabricated thereon and a sensor region; and a semiconductor cap including a recess, wherein the semiconductor cap is bonded to the semiconductor substrate with a th

1. A chip-scale sensor package, comprising:a semiconductor substrate including at least one electronically trimmable integrated circuit fabricated thereon and a sensor region; and a semiconductor cap including a recess, wherein the semiconductor cap is bonded to the semiconductor substrate with a thermocompression bond to form a cavity therebetween.