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A method for electroplating copper in trenches, including the steps of providing a semiconductor substrate having a trench formed therein and electrolytically depositing a first copper containing layer having an upper surface and a predetermined thickness within the trench. The first copper depositi

A method for electroplating copper in trenches, including the steps of providing a semiconductor substrate having a trench formed therein and electrolytically depositing a first copper containing layer having an upper surface and a predetermined thickness within the trench. The first copper deposition step has a first ratio of brighteners concentration:levelers concentration. Then a second copper containing layer having an upper surface and a predetermined thickness is electrolytically deposited over the first copper containing layer. The second copper deposition step has a second ratio of brighteners concentration:levelers concentration that is less than the said first ratio of brighteners concentration:levelers concentration. The second copper containing layer upper surface having a greater planarity than the first copper containing layer upper surface due to an increased concentration of levelers relative to the brighteners in the electrolytic bath.

대표청구항 ▼

1. A method for electroplating copper in a trench, the steps comprising:providing a semiconductor structure having a trench formed therein; depositing by electrolysis a first copper containing layer having an upper surface and a predetermined thickness within said trench; said first copper depositio

1. A method for electroplating copper in a trench, the steps comprising:providing a semiconductor structure having a trench formed therein; depositing by electrolysis a first copper containing layer having an upper surface and a predetermined thickness within said trench; said first copper deposition having a first ratio of brighteners concentration:levelers concentration; and depositing by electrolysis a second copper containing layer having an upper surface and a predetermined thickness over said first copper containing layer within said trench, wherein said second copper containing layer upper surface has a greater planarity than said first copper containing layer upper surface and said second copper deposition having a second ratio of brighteners concentration:levelers concentration that is less than said first ratio of brighteners concentration:levelers concentration.