|국가/구분||United States(US) Patent 등록|
|미국특허분류(USC)||521/107; 521/137; 521/163; 521/170; 521/174|
|발명자 / 주소|
|출원인 / 주소|
|대리인 / 주소||
|인용정보||피인용 횟수 : 6 인용 특허 : 3|
An insulated structure is formed by injection of a foamed thermal-insulating material created by foaming into a space between a plastic board and metal plate with a disposition of copper pipes. A non-halogenated organophosphorus compound having a molecular weight over 150 as an additive with an OH group as a functional group is mixed with the raw materials of the foamed thermal-insulating material including polyol, a foam stabilizer, a catalyst, a foaming agent having at least one component of hydrocarbon, and an organic polyisocyanates. By adding a non-...
1. A foamed thermal-insulating material formed by foaming, said foamed thermal-insulating material comprising:a) polyol; b) a foam stabilizer; c) a catalyst; d) a foaming agent having at least one component of hydrocarbon; and e) an isocyanate component comprising organic polyisocyanates polymerized by a non-halogenated organophosphorous compound with active hydrogen.