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[미국특허] Probe card, test method and test system for semiconductor wafers 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G01R-031/26
  • G01R-031/02
출원번호 US-0394960 (1999-09-10)
발명자 / 주소
  • Salman Akram
  • C. Patrick Doherty
  • Warren M. Farnworth
  • David R. Hembree
출원인 / 주소
  • Micron Technology, Inc.
대리인 / 주소
    Stephen A. Gratton
인용정보 피인용 횟수 : 54  인용 특허 : 36

초록 ▼

A probe card for testing a semiconductor wafer, a test method, and a test system employing the probe card are provided. The probe card includes: a substrate; patterns of pin contacts slidably mounted to the substrate; and a force applying member for biasing the pin contacts into electrical contact w

대표청구항 ▼

1. A method for testing a semiconductor wafer having a plurality of contacts comprising:providing a probe card comprising a substrate having a plurality of openings, a plurality of electrically conductive pins slidably mounted in the openings for movement in a Z direction, and a force applying membe

이 특허에 인용된 특허 (36) 인용/피인용 타임라인 분석

  1. Krivy Andrew J. ; Farnworth Warren M. ; Hembree David R. ; Akram Salman ; Wark James M. ; Jacobson John O., Calibration target for calibrating semiconductor wafer test systems.
    상세보기
  2. Akram Salman ; Wark James M. ; Farnworth Warren M., Direct connect interconnect for testing semiconductor dice and wafers.
    상세보기
  3. Hembree David R. ; Farnworth Warren M. ; Wark James M., Force applying probe card and test system for semiconductor wafers.
    상세보기
  4. Hembree David R. ; Jacobson John O. ; Wark James M. ; Farnworth Warren M. ; Akram Salman ; Wood Alan G., Interconnect for making temporary electrical connections with bumped semiconductor components.
    상세보기
  5. Akram Salman ; Farnworth Warren M., Interconnect with pressure sensing mechanism for testing semiconductor wafers.
    상세보기
  6. Akram Salman ; Farnworth Warren M., Interconnect with pressure sensing mechanism for testing semiconductor wafers.
    상세보기
  7. Huff Richard E. (Belmont CA), Membrane probe contact bump compliancy system.
    상세보기
  8. Liu Ken K. F. (Saratoga CA) Min Byoung-Youl (Cupertino CA) Moti Robert J. (San Jose CA) Husain Syed A. (Milpitas CA), Membrane probing of circuits.
    상세보기
  9. Liu Ken Kuang-Fu ; Min Byoung-Youl ; Sano Kunio,JPX ; Sato Takashi,JPX, Membrane probing of circuits.
    상세보기
  10. Akram Salman ; Farnworth Warren M. ; Wood Alan G., Method for fabricating a semiconductor interconnect with laser machined electrical paths through substrate.
    상세보기
  11. Akram Salman ; Farnworth Warren M. ; Wood Alan G., Method for fabricating semiconductor components using focused laser beam.
    상세보기
  12. Elder Richard A. (Dallas TX) Wilson Arthur M. (Dallas TX) Bagen Susan V. (Dallas TX) Miller Juanita G. (Richardson TX), Method for fabrication of probe card for testing of semiconductor devices.
    상세보기
  13. Farnworth Warren M. (Nampa ID) Akram Salman (Boise ID) Wood Alan G. (Boise ID), Method for forming contact pins for semiconductor dice and interconnects.
    상세보기
  14. Tada Tetsuo (Hyogo JPX) Takagi Ryouichi (Hyogo JPX), Method of manufacturing a probing card for wafer testing.
    상세보기
  15. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Method of planarizing tips of probe elements of a probe card assembly.
    상세보기
  16. Akram Salman ; Hembree David R. ; Wood Alan G., Micromachined probe card having compliant contact members for testing semiconductor wafers.
    상세보기
  17. Swapp Mavin (Mesa AZ), Micromachined semiconductor probe card.
    상세보기
  18. Akram Salman ; Hembree David R. ; Wood Alan G., Micromachined silicon probe card for semiconductor dice and method of fabrication.
    상세보기
  19. Iino Shinji (Yamanashi JPX) Kubota Tamio (Kofu JPX) Yokota Keiichi (Nirasaki JPX), Probe card.
    상세보기
  20. Hembree David R. ; Farnworth Warren M. ; Akram Salman ; Wood Alan G. ; Doherty C. Patrick ; Krivy Andrew J., Probe card and testing method for semiconductor wafers.
    상세보기
  21. Hagihara Junichi,JPX, Probe card device used in probing apparatus.
    상세보기
  22. Hembree David R. ; Farnworth Warren M. ; Akram Salman ; Wood Alan G. ; Doherty C. Patrick ; Krivy Andrew J., Probe card for semiconductor wafers and method and system for testing wafers.
    상세보기
  23. Liu Jui-Hsiang (Chandler AZ) Olsen Dennis R. (Scottsdale AZ), Probe card for testing unencapsulated semiconductor devices.
    상세보기
  24. Doherty C. Patrick ; deVarona Jorge L. ; Akram Salman, Probe card having on-board multiplex circuitry for expanding tester resources.
    상세보기
  25. Akram Salman ; Doherty C. Patrick ; Farnworth Warren M. ; Hembree David R., Probe card, test method and test system for semiconductor wafers.
    상세보기
  26. Yoshizawa Tetsuo (Yokohama JPX) Imaizumi Masaaki (Tokyo JPX) Nishida Hideyuki (Kawasaki JPX) Kondo Hiroshi (Ohsaka JPX) Sakaki Takashi (Tokyo JPX) Ichida Yasuteru (Machida JPX) Konishi Masaki (Ebina , Probe method for measuring part to be measured by use thereof and electrical circuit member.
    상세보기
  27. Kitamura Yoshisuke (Yamanashi-ken JPX) Nagasaka Munetoshi (Yamanashi-ken JPX), Probe test apparatus.
    상세보기
  28. Sano Kunio,JPX, Probing method and device with contact film wiper feature.
    상세보기
  29. Sano Kunio (Yamanashi-ken JPX), Probing test apparatus.
    상세보기
  30. Farnworth Warren M. ; Wood Alan G. ; Brooks Mike, Semiconductor package including flex circuit, interconnects and dense array external contacts.
    상세보기
  31. Hembree David R. ; Akram Salman, Semiconductor probe card having resistance measuring circuitry and method fabrication.
    상세보기
  32. Hembree David R. ; Akram Salman, Semiconductor probe card having resistance measuring circuitry and method of fabrication.
    상세보기
  33. Reid Lee R. (Plano TX) Cody Tommy D. (Garland TX), Solid state multiprobe testing apparatus.
    상세보기
  34. Hembree David R. ; Jacobson John O. ; Wark James M. ; Farnworth Warren M. ; Akram Salman ; Wood Alan G., System and interconnect for making temporary electrical connections with bumped semiconductor components.
    상세보기
  35. Akram Salman ; Wood Alan G. ; Farnworth Warren M., Temporary package, system, and method for testing semiconductor dice and chip scale packages.
    상세보기
  36. Vinh Nguyen T., Variable contact pressure probe.
    상세보기

이 특허를 인용한 특허 (54) 인용/피인용 타임라인 분석

  1. Brunner,Matthias, Apparatus and method for contacting of test objects.
    상세보기
  2. Kirby,Kyle K.; Farnworth,Warren M.; Wark,James M.; Hiatt,William M.; Hembree,David R.; Wood,Alan G., Compliant contact pin assembly and card system.
    상세보기
  3. Kirby,Kyle K.; Farnworth,Warren M.; Wark,James M.; Hiatt,William M.; Hembree,David R.; Wood,Alan G., Compliant contact pin assembly and card system.
    상세보기
  4. Kirby,Kyle K.; Farnworth,Warren M.; Wark,James M.; Hiatt,William M.; Hembree,David R.; Wood,Alan G., Compliant contact pin assembly, card system and methods thereof.
    상세보기
  5. Kirby,Kyle K.; Farnworth,Warren M.; Wark,James M.; Hiatt,William M.; Hembree,David R.; Wood,Alan G., Compliant contact pin test assembly and methods thereof.
    상세보기
  6. Brunner, Matthias; Kurita, Shinichi; Schmid, Ralf; Abboud, Fayez (Frank) E.; Johnston, Benjamin; Bocian, Paul; Beer, Emanuel, Configurable prober for TFT LCD array test.
    상세보기
  7. Brunner,Matthias; Kurita,Shinichi; Schmid,Ralf; Abboud,Fayez E.; Johnston,Benjamin; Bocian,Paul; Beer,Emanuel, Configurable prober for TFT LCD array test.
    상세보기
  8. Brunner,Matthias; Kurita,Shinichi; Schmid,Ralf; Abboud,Fayez (Frank) E.; Johnston,Benjamin; Bocian,Paul; Beer,Emanuel, Configurable prober for TFT LCD array testing.
    상세보기
  9. Mok, Sammy; Chong, Fu Chiung, Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies.
    상세보기
  10. Kirby,Kyle K.; Farnworth,Warren M.; Wark,James M.; Hiatt,William M.; Hembree,David R.; Wood,Alan G., Contact pin assembly and contactor card.
    상세보기
  11. Zhou, Yu; Yu, David; Aldaz, Robert Edward; Khoury, Theodore A., Contact structure and production method thereof and probe contact assembly using same.
    상세보기
  12. Zhou, Yu; Yu, David; Aldaz, Robert Edward; Khoury, Theodore A., Contact structure production method.
    상세보기
  13. Zhou, Yu; Yu, David; Aldaz, Robert Edward; Khoury, Theodore A., Contact structure production method.
    상세보기
  14. Beaman,Brian S.; Chiu,George Liang Tai; Fogel,Keith; Lauro,Paul A.; Morris,Daniel P.; Shih,Da Juan, Electrical connector design and contact geometry and method of use thereof and methods of fabrication thereof.
    상세보기
  15. Haemer,Joseph Michael; Chong,Fu Chiung; Modlin,Douglas N., Enhanced compliant probe card systems having improved planarity.
    상세보기
  16. Bottoms, Wilmer R.; Chong, Fu Chiung; Mok, Sammy; Modlin, Douglas, High density interconnect system for IC packages and interconnect assemblies.
    상세보기
  17. Chong, Fu Chiung; Kao, Andrew; McKay, Douglas; Litza, Anna; Modlin, Douglas; Mok, Sammy; Parekh, Nitin; Swiatowiec, Frank John; Shan, Zhaohui, High density interconnect system having rapid fabrication cycle.
    상세보기
  18. Chong, Fu Chiung; Kao, Andrew; McKay, Douglas; Litza, Anna; Modlin, Douglas; Mok, Sammy; Parekh, Nitin; Swiatowiec, Frank John; Shan, Zhaohui, High density interconnect system having rapid fabrication cycle.
    상세보기
  19. Chong,Fu Chiung; Kao,Andrew; McKay,Douglas; Litza,Anna; Modlin,Douglas; Mok,Sammy; Parekh,Nitin; Swiatowiec,Frank John; Shan,Zhaohui, High density interconnect system having rapid fabrication cycle.
    상세보기
  20. Hartnett, Fred, In-circuit testing system and method.
    상세보기
  21. Lewinnek, David Walter; Sinsheimer, Roger Allen; Valiente, Luis Antonio; DiPalo, Craig Anthony, Interconnect for transmitting signals between a device and a tester.
    상세보기
  22. Chong, Fu Chiung; Mok, Sammy, Massively parallel interface for electronic circuit.
    상세보기
  23. Chong,Fu Chiung; Mok,Sammy, Massively parallel interface for electronic circuit.
    상세보기
  24. Chong,Fu Chiung; Mok,Sammy, Massively parallel interface for electronic circuit.
    상세보기
  25. Chao, Clinton Chih-Chieh; Yang, Fei-Chieh; Chen, Chun-Hsing; Wang, Mill-Jer; Huang, Sheng-Hsi; Hsu, Ming-Cheng, Method for assembling a wafer level test probe card.
    상세보기
  26. Farnworth, Warren M.; Wood, Alan G.; Hembree, David R., Method for fabricating semiconductor components and interconnects with contacts on opposing sides.
    상세보기
  27. Akram,Salman; Farnworth,Warren M.; Wood,Alan G., Method for fabricating semiconductor components by forming conductive members using solder.
    상세보기
  28. Hembree, David R.; Farnworth, Warren M.; Akram, Salman; Wood, Alan G.; Doherty, C. Patrick; Krivy, Andrew J., Method for testing semiconductor wafers.
    상세보기
  29. Kirby,Kyle K.; Farnworth,Warren M.; Wark,James M.; Hiatt,William M.; Hembree,David R.; Wood,Alan G., Method of making contact pin card system.
    상세보기
  30. Kirby,Kyle K.; Farnworth,Warren M.; Wark,James M.; Hiatt,William M.; Hembree,David R.; Wood,Alan G., Methods of forming a contact pin assembly.
    상세보기
  31. Johnston, Benjamin M.; Krishnaswami, Sriram; Nguyen, Hung T.; Brunner, Matthias; Liu, Yong, Mini-prober for TFT-LCD testing.
    상세보기
  32. Okumura, Katsuya; Yonezawa, Toshihiro, Probe and method of manufacturing probe.
    상세보기
  33. Endres, Eric; Strom, John T.; Kuwasaki, Christian; McLaughlin, Christopher, Probe card analysis system and method.
    상세보기
  34. Hembree,David R.; Farnworth,Warren M.; Akram,Salman; Wood,Alan G.; Doherty,C. Patrick; Krivy,Andrew J., Probe card for semiconductor wafers having mounting plate and socket.
    상세보기
  35. Wood, Alan G.; Doan, Trung T.; Hembree, David R., Probe card for testing microelectronic components.
    상세보기
  36. Kirby, Kyle K., Probe card for use with microelectronic components, and methods for making same.
    상세보기
  37. Ku, Wei-Cheng; Lai, Jun-Liang, Probe card of low power loss.
    상세보기
  38. Wood, Alan G.; Doan, Trung T.; Hembree, David R., Probe card, e.g., for testing microelectronic components, and methods for making same.
    상세보기
  39. Krishnaswami, Sriram; Brunner, Matthias; Beaton, William; Liu, Yong; Johnston, Benjamin M.; Nguyen, Hung T.; Ledl, Ludwig; Schmid, Ralf, Prober for electronic device testing on large area substrates.
    상세보기
  40. Schaeffer, Ralph; Crump, Brett, Selectively configurable microelectronic probes.
    상세보기
  41. Schaeffer, Ralph; Crump, Brett, Selectively configurable probe structures, e.g., for testing microelectronic components.
    상세보기
  42. Schaeffer, Ralph; Crump, Brett, Selectively configurable probe structures, e.g., for testing microelectronic components.
    상세보기
  43. Schaeffer,Ralph; Crump,Brett, Selectively configurable probe structures, e.g., for testing microelectronic components.
    상세보기
  44. Schaeffer,Ralph; Crump,Brett, Selectively configurable probe structures, e.g., selectively configurable probe cards for testing microelectronic components.
    상세보기
  45. Farnworth, Warren M.; Wood, Alan G.; Hembree, David R., Semiconductor component and interconnect having conductive members and contacts on opposing sides.
    상세보기
  46. Akram, Salman; Farnworth, Warren M.; Wood, Alan G., Semiconductor package having interconnect with conductive members.
    상세보기
  47. Akram, Salman; Farnworth, Warren M.; Wood, Alan G., Stacked semiconductor package having laser machined contacts.
    상세보기
  48. Sinsheimer, Roger Allen, Structure for transmitting signals in an application space between a device under test and test electronics.
    상세보기
  49. Lin, Lee-Chung; Huang, Jun-Hao; Hsiao, Chun-Chieh, System and method for qualifying multiple device under test (DUT) test head.
    상세보기
  50. Mok, Sammy; Chong, Fu Chiung; Milter, Roman, Systems for testing and packaging integrated circuits.
    상세보기
  51. Ito, Daisuke; Nakagawa, Hiroshi; Ito, Katsutoshi; Shinonaga, Naoyuki; Senba, Shinji, Test board for testing semiconductor device.
    상세보기
  52. Suto, Anthony J.; Wrinn, Joseph Francis; Toscano, John P.; Arena, John Joseph, Test fixture.
    상세보기
  53. Zaerpoor,Koorosh, Ultra-short low-force vertical probe test head.
    상세보기
  54. Zaerpoor,Koorosh, Ultra-short low-force vertical probe test head and method.
    상세보기

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