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A resistor chip has a pair of mutually separated upper-surface electrodes on the upper surface of an electrically insulating substrate in a form of a chip, an resistor film having end portions which are each over a corresponding one of these upper-surface electrodes, a cover coating made of a glass

A resistor chip has a pair of mutually separated upper-surface electrodes on the upper surface of an electrically insulating substrate in a form of a chip, an resistor film having end portions which are each over a corresponding one of these upper-surface electrodes, a cover coating made of a glass material which is over a portion of this resistor film, and a pair of plated metallic layers each over a corresponding one of end surfaces of the substrate. Edge sections of the insulator film over the upper-surface electrodes are not covered by the cover coating and are each directly covered by one of these plated metallic layers.

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1. A resistor chip comprising:an electrically insulating substrate in a form of a chip having a pair of end surfaces which face mutually each other in a longitudinal direction and an upper surface which extends between said end surfaces; a pair of upper-surface electrodes which are on said upper sur

1. A resistor chip comprising:an electrically insulating substrate in a form of a chip having a pair of end surfaces which face mutually each other in a longitudinal direction and an upper surface which extends between said end surfaces; a pair of upper-surface electrodes which are on said upper surface and are separated from each other in said longitudinal direction; a resistor film having end portions which are each over and directly contacting a corresponding one of said upper-surface electrodes; a cover coating over a portion of said resistor film, said cover coating not directly contacting said upper-surface electrodes; a pair of end-surface electrodes each formed over a corresponding one of said end surfaces and contacting a corresponding one of said upper-surface electrodes; and a pair of plated metallic layers each over a corresponding one of said end-surface electrodes and directly contacting a portion of a corresponding one of said upper-surface electrodes; wherein edge sections of said end portions of said resistor film over and directly contacting said upper-surface electrodes are not covered by said cover coating and are each directly contacted by a corresponding one of said plated metallic layers.