초록 ▼

A system for high-pressure drying of semiconductor wafers includes the insertion of a wafer into an open vessel, the immersion of the wafer in a liquid, pressure-sealing of the vessel, pressurization of the vessel with an inert gas, and then the controlled draining of the liquid using a moveable dra

A system for high-pressure drying of semiconductor wafers includes the insertion of a wafer into an open vessel, the immersion of the wafer in a liquid, pressure-sealing of the vessel, pressurization of the vessel with an inert gas, and then the controlled draining of the liquid using a moveable drain that extracts water from a depth maintained just below the gas-liquid interface. Thereafter, the pressure may be reduced in the vessel and the dry and clean wafer may be removed. The high pressure suppresses the boiling point of liquids, thus allowing higher temperatures to be used to optimize reactivity. Megasonic waves are used with pressurized fluid to enhance cleaning performance. Supercritical substances are provided in a sealed vessel containing a wafer to promote cleaning and other treatment.

대표청구항 ▼

1. A method for processing a wafer, comprising the steps of:placing the wafer into a vessel; delivering a liquid into the vessel, creating a liquid level; sealing the vessel so that it is pressure-tight; delivering a pressurized gas into the vessel; transmitting sonic energy to the wafer; draining t

1. A method for processing a wafer, comprising the steps of:placing the wafer into a vessel; delivering a liquid into the vessel, creating a liquid level; sealing the vessel so that it is pressure-tight; delivering a pressurized gas into the vessel; transmitting sonic energy to the wafer; draining the liquid from the vessel; reducing the gas pressure within the vessel; and removing the wafer from the vessel.