$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

[미국특허] Apparatus and method for conditioning a fixed abrasive polishing pad in a chemical mechanical planarization process 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B24B-053/00
출원번호 US-0607895 (2000-06-30)
발명자 / 주소
  • Mike Ravkin
  • Katrina Mikhaylich
  • Don E. Anderson
출원인 / 주소
  • Lam Research Corporation
대리인 / 주소
    Brinks Hofer Gilson & Lione
인용정보 피인용 횟수 : 37  인용 특허 : 34

초록

A method and apparatus for conditioning a fixed abrasive polishing pad used in chemical mechanical planarization of semiconductor wafers is described. The apparatus includes a conditioning member formed from glass, at least one collimated hole structure located within the conditioning member, wherei

대표청구항

1. An apparatus for conditioning a fixed abrasive polishing pad used in chemical mechanical planarization of semiconductor wafers, the apparatus comprising:a fixed abrasive polishing pad; a conditioning member formed from glass positioned adjacent the fixed abrasive polishing pad and adapted to enga

이 특허에 인용된 특허 (34) 인용/피인용 타임라인 분석

  1. Rutherford Denise R. (Stillwater MN) Goetz Douglas P. (St. Paul MN) Thomas Cristina U. (Woodbury MN) Webb Richard J. (Inver Grove Heights MN) Bruxvoort Wesley J. (Woodbury MN) Buhler James D. (Shring, Abrasive construction for semiconductor wafer modification.
  2. Southwick Scott A., Apparatus and method for refurbishing fixed-abrasive polishing pads used in chemical-mechanical planarization of semicon.
  3. Hoshizaki Jon A. ; Williams Roger O. ; Buhler James D. ; Reichel Charles A. ; Hollywood William K. ; De Geus Richard ; Lee Lawrence L., Apparatus for chemical mechanical polishing.
  4. Kreager Douglas P. ; Lee Junedong, Apparatus for conditioning polishing pads.
  5. Phillips James D. (Posen MI), Apparatus for trueing CBN abrasive belts and grinding wheels.
  6. Lund Douglas E. (13304 Purple Sage Dallas TX 75240), Automatic chemical and mechanical polishing system for semiconductor wafers.
  7. Smith Robert K. (52 Drayton Street Bowden ; 5007 AUX), Belt cleaner.
  8. Mohr Larry D. (5936 S. Dorsey La. Tempe AZ 85282), Belt cleaning apparatus.
  9. Somekh Sasson, Chemical mechanical polishing with multiple polishing pads.
  10. Birang Manoocher ; Prince John, End effector for pad conditioning.
  11. Talieh Homayoun (Santa Clara County CA) Weldon David Edwin (Santa Cruz County CA), Linear polisher and method for semiconductor wafer planarization.
  12. Trojan Daniel R. ; Lee Lawrence L., Low profile, low hysteresis force feedback gimbal system for chemical mechanical polishing.
  13. Pant Anil K. ; Young Douglas W. ; Breivogel Joseph R. ; Volodarski Konstantin ; Volfovski Leon, Method and apparatus for aligning and tensioning a pad/belt used in linear planarization for chemical mechanical polishi.
  14. Labunsky Michael ; Huynh Tac ; Meyer Anthony ; Nagengast Andrew ; Travis Glenn W., Method and apparatus for conditioning a polishing pad used in chemical mechanical planarization.
  15. Breivogel Joseph R. (Aloha OR) Price Matthew J. (Portland OR) Barns Christopher E. (Portland OR), Method and apparatus for conditioning a semiconductor polishing pad.
  16. Cadien Kenneth C. (Portland OR) Yau Leopoldo D. (Portland OR), Method and apparatus for conditioning of chemical-mechanical polishing pads.
  17. Robinson Karl M., Method and apparatus for conditioning polishing pads used in mechanical and chemical-mechanical planarization of substra.
  18. Ravkin Michael A. ; Ravkin Ilya A. ; Verhovsky Yuli, Method and apparatus for improved conditioning of polishing pads.
  19. Lankford David, Method and apparatus for planarizing microelectronic substrates and conditioning planarizing media.
  20. Hoshizaki Jon A. ; Williams Roger O. ; Buhler James D. ; Reichel Charles A. ; Hollywood William K. ; de Geus Richard ; Lee Lawrence L., Method for chemical mechanical polishing.
  21. Mattingly Wayne A. (Rio Rancho NM) Morimoto Seiichi (Beaverton OR) Preston Spencer E. (Portland OR), Method for conditioning the surface of a polishing pad.
  22. Meikle Scott G. (Boise ID) Marty Lucky F. (Scottsdale AZ), Method for selectively reconditioning a polishing pad used in chemical-mechanical planarization of semiconductor wafers.
  23. Bruxvoort Wesley J. ; Culler Scott R. ; Ho Kwok-Lun ; Kaisaki David A. ; Kessel Carl R. ; Klun Thomas P. ; Kranz Heather K. ; Messner Robert P. ; Webb Richard J. ; Williams Julia P., Method of modifying an exposed surface of a semiconductor wafer.
  24. Gill Gerald L., Pad conditioner.
  25. Baldy Andr (Seyssins FRX) Barrois Grard (Le Fontanil FRX) Blanc Henri (Saint Julien de Ratz FRX) Dominiak Marcel (Grenoble FRX), Polishing machine having a taut microabrasive strip and an improved wafer support head.
  26. Talieh Homayoun (San Jose CA) Weldon David E. (Los Gatos CA), Polishing pad cluster for polishing a semiconductor wafer.
  27. Appel Andrew T. (Dallas TX) Chisholm Michael F. (Plano TX), Semiconductor substrate conditioning head having a plurality of geometries formed in a surface thereof for pad condition.
  28. Pant Anil K. ; Breivogel Joseph R. ; Young Douglas W. ; Jairath Rahul ; Engdahl Erik H., Sensors for a linear polisher.
  29. Leach Michael A. (Bristol VT) Paulsen James K. (Jericho VT) Machesney Brian J. (Burlington VT) Venditti Daniel J. (Essex Junction VT) Whitaker Christopher R. (Jericho VT), System for mechanical planarization.
  30. Mogi Katsumi (Omiya JPX) Endo Osamu (Omiya JPX), Truing apparatus for wafer polishing pad.
  31. Klievoneit Harold R. (Phoenix AZ) Smith Arthur A. (Tucson AZ), Wafer grinder.
  32. Talieh Homayoun (San Jose CA) Weldon David E. (Los Gatos CA) Nagorski Boguslaw A. (San Jose CA), Wafer polishing machine with fluid bearings.
  33. Weldon David E. (Los Gatos CA) Nagorski Boguslaw A. (San Jose CA) Talieh Homayoun (San Jose CA), Wafer polishing machine with fluid bearings and drive systems.
  34. Simpson Steven C. (Kansas City MO) Witt Ronald D. (Kansas City MO) Volkland Gregory E. (Merriam KS), Wide belt sander cleaning device.

이 특허를 인용한 특허 (37) 인용/피인용 타임라인 분석

  1. Celikkaya,Ahmet; Anderson,Thomas J., AIO-LaO-YO-MgO ceramics, and methods of making the same.
  2. Rosenflanz, Anatoly Z., Abrasive particles and methods of making and using the same.
  3. Rosenflanz,Anatoly Z.; Celikkaya,Ahmet; Anderson,Thomas J., Abrasive particles, abrasive articles, and methods of making and using the same.
  4. Rosenflanz,Anatoly Z.; Celikkaya,Ahmet; Anderson,Thomas J., Abrasive particles, and methods of making and using the same.
  5. Rosenflanz,Anatoly Z., AlO-YO-ZrO/HfOmaterials, and methods of making and using the same.
  6. Rosenflanz, Anatoly Z., AlO-rare earth oxide-ZrO/HfOmaterials, and methods of making and using the same.
  7. Rosenflanz, Anatoly Z.; Celikkaya, Ahmet; Anderson, Thomas J., Ceramic fibers and composites comprising same.
  8. Rosenflanz, Anatoly Z.; Endres, Berkan K.; Anderson, Thomas J., Ceramic materials and methods of making and using the same.
  9. Rosenflanz,Anatoly Z., Ceramic materials, abrasive particles, abrasive articles, and methods of making and using the same.
  10. Rosenflanz,Anatoly Z.; Schardt,Craig R., Ceramics comprising AIO, YO, ZrOand/or HfO, and NbOand/or TaOand methods of making the same.
  11. Rosenflanz,Anatoly Z.; Schardt,Craig R., Ceramics comprising AlO, REO, ZrOand/or HfO, and NbOand/or TaOand methods of making the same.
  12. Rosenflanz,Anatoly Z.; Schardt,Craig R., Ceramics comprising AlO, REO, ZrOand/or HfO, and NbOand/or TaOand methods of making the same.
  13. Rosenflanz,Anatoly Z.; Schardt,Craig R., Ceramics comprising AlO, YO, ZrOand/or HfO, and NbOand/or TaOand methods of making the same.
  14. Rosenflanz,Anatoly Z.; Endres,Berkan K.; Anderson,Thomas J., Ceramics, and methods of making and using the same.
  15. Endres,Berkan K.; Anderson,Thomas J.; Rosenflanz,Anatoly Z., Composite articles and methods of making the same.
  16. Butterfield,Paul D.; Chen,Liang Yuh; Hu,Yongqi; Manens,Antoine P.; Mavliev,Rashid; Tsai,Stan D.; Liu,Feng Q.; Wadensweiler,Ralph, Conductive polishing article for electrochemical mechanical polishing.
  17. Butterfield,Paul; Chen,Liang Yuh; Hu,Yongqi; Manens,Antoine; Mavliev,Rashid; Tsai,Stan, Contacts for electrochemical processing.
  18. Rosenflanz,Anatoly Z., Glass-ceramics.
  19. Gagliardi,John J.; Rueb,Chris J., In situ activation of a three-dimensional fixed abrasive article.
  20. Rosenflanz, Anatoly Z., Metal oxide ceramic and method of making articles therewith.
  21. Renteln, Peter; Jensen, Alan J.; Lamb, David S., Method and apparatus for conditioning fixed-abrasive polishing pads.
  22. Jensen, Alan J.; Stella, Mario; Zhao, Eugene; Renteln, Peter; Farber, Jeffrey, Method and apparatus for controlling CMP pad surface finish.
  23. Jensen, Alan J.; Stella, Mario; Zhao, Eugene; Renteln, Peter; Farber, Jeffrey, Method and apparatus for controlling CMP pad surface finish.
  24. Boyd, John M., Method and apparatus for fixed-abrasive substrate manufacturing and wafer polishing in a single process path.
  25. Rosenflanz, Anatoly Z.; Celikkaya, Ahmet; Anderson, Thomas J., Method of making amorphous and ceramics via melt spinning.
  26. Rosenflanz,Anatoly Z.; Celikkaya,Ahmet; Anderson,Thomas J., Method of making amorphous materials and ceramics.
  27. Rosenflanz, Anatoly Z., Method of making ceramic articles.
  28. Celikkaya,Ahmet; Anderson,Thomas J., Methods of making AlO-SiOceramics.
  29. Celikkaya,Ahmet; Anderson,Thomas J., Methods of making AlO-SiOceramics.
  30. Celikkaya, Ahmet; Anderson, Thomas J., Methods of making ceramic particles.
  31. Gotkis, Yehiel; Charatan, Robert, Multiple-conditioning member device for chemical mechanical planarization conditioning.
  32. Rosenflanz,Anatoly Z.; Celikkaya,Ahmet; Anderson,Thomas J., Plasma spraying.
  33. Hishiki,Seigo, Polishing pad.
  34. Kiermasz, Adrian, Polishing pad conditioning and polishing liquid dispersal system.
  35. Charatan, Robert, Polishing pad conditioning system.
  36. Towery, Daniel Lynne, Static pad conditioner.
  37. Towery,Daniel Lynne, Static pad conditioner.

활용도 분석정보

상세보기
다운로드
내보내기

활용도 Top5 특허

해당 특허가 속한 카테고리에서 활용도가 높은 상위 5개 콘텐츠를 보여줍니다.
더보기 버튼을 클릭하시면 더 많은 관련자료를 살펴볼 수 있습니다.

섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로