초록 ▼

A memory module having a packaging cover to encapsulate a board having multiple separate chips, which dynamically generate varying amounts heat. The packaging cover provides localized heat dissipation among the multiple separate memory chips. The separate chips are interconnected to the board via a

A memory module having a packaging cover to encapsulate a board having multiple separate chips, which dynamically generate varying amounts heat. The packaging cover provides localized heat dissipation among the multiple separate memory chips. The separate chips are interconnected to the board via a set of solder balls. The packaging cover further provides a rigid encapsulation of the board and chips. In one embodiment, the memory module includes a thermally conductive substance displaced within the packaging cover to conduct heat from the separate chips to the packaging cover. In one embodiment, a top cover and bottom cover of the packaging cover are assembled with a separate frame to secure a coupling between the top and bottom covers of the packaging cover. In one embodiment, the frame includes grooves to receive notches of a module connector coupled to a motherboard. In one embodiment, the frame includes an aperture for receiving connections to thermal solutions external to the packaging cover.

대표청구항 ▼

1. A packaging cover to encapsulate a board having multiple separate chips, said separate chips dynamically generating varying amounts of heat, the packaging including a first cover of the packaging cover includes a first set of finger wraps and a second cover of the packaging cover includes a secon

1. A packaging cover to encapsulate a board having multiple separate chips, said separate chips dynamically generating varying amounts of heat, the packaging including a first cover of the packaging cover includes a first set of finger wraps and a second cover of the packaging cover includes a second set of finger wraps that interlace with said first set of finger wraps to secure a coupling between the first cover and a second cover of the packaging cover, and the first cover and second cover of the packaging cover are further assembled with a separate frame to secure a coupling between the first and second covers.