초록 ▼

In one aspect the invention provides a method for laser induced breakdown of a material with a pulsed laser beam where the material is characterized by a relationship of fluence breakdown threshold (Fth) versus laser beam pulse width (T) that exhibits an abrupt, rapid, and distinct change or at leas

In one aspect the invention provides a method for laser induced breakdown of a material with a pulsed laser beam where the material is characterized by a relationship of fluence breakdown threshold (Fth) versus laser beam pulse width (T) that exhibits an abrupt, rapid, and distinct change or at least a clearly detectable and distinct change in slope at a predetermined laser pulse width value. The method comprises generating a beam of laser pulses in which each pulse has a pulse width equal to or less than the predetermined laser pulse width value. The beam is focused to a point at or beneath the surface of a material where laser induced breakdown is desired.The beam may be used in combination with a mask in the beam path. The beam or mask may be moved in the x, y, and Z directions to produce desired features. The technique can produce features smaller than the spot size and Rayleigh range due to enhanced damage threshold accuracy in the short pulse regime.

대표청구항 ▼

1. A method for laser induced breakdown (LIB) of a non-biologic material with a pulsed laser beam, the material being characterized by a relationship of fluence breakdown threshold at which breakdown occurs versus laser pulse width that exhibits a rapid and distinct change in slope at a characteri

1. A method for laser induced breakdown (LIB) of a non-biologic material with a pulsed laser beam, the material being characterized by a relationship of fluence breakdown threshold at which breakdown occurs versus laser pulse width that exhibits a rapid and distinct change in slope at a characteristic laser pulse width, said method comprising the steps of:a. generating a beam of at least one or more laser pulses in which each pulse has a pulse width equal to or less than said characteristic laser pulse width; and b. focusing said beam directing said pulse to a point at or beneath the surface of the material.