초록 ▼

A semiconductor chip is provided with a dielectric element having conductive features interconnecting electronic elements within the chip with one another. The conductive features replace internal conductors, and can provide enhanced signal propagation between elements of the chip. The conductive fe

A semiconductor chip is provided with a dielectric element having conductive features interconnecting electronic elements within the chip with one another. The conductive features replace internal conductors, and can provide enhanced signal propagation between elements of the chip. The conductive features on the dielectric element are connected to contacts on the chip by deformable conductive elements such as flexible leads so that the dielectric element remains movable with respect to the chip. The dielectric element may have a coefficient of expansion different from that of the chip itself.

대표청구항 ▼

1. A microelectronic assembly including:(a) a first semiconductor chip including a plurality of electronic elements and a front surface having contacts thereon, at least some of said electronic elements being connected to said contacts; (b) a dielectric element separate from said chip and movable wi

1. A microelectronic assembly including:(a) a first semiconductor chip including a plurality of electronic elements and a front surface having contacts thereon, at least some of said electronic elements being connected to said contacts; (b) a dielectric element separate from said chip and movable with respect to said chip, said dielectric element having a plurality of conductive interconnect traces thereon; and (c) deformable conductive elements interconnecting said at least some of said contacts with said interconnect traces so that at least some of said electronic elements are connected to one another for transmission of signals therebetween through said traces.