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Alignment mechanism for a high density electrical connector 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01R-003/00
출원번호 US-0761193 (2001-01-16)
발명자 / 주소
  • Russell Abbott
대리인 / 주소
    Knobbe, Martens, Olson & Bear, LLP
인용정보 피인용 횟수 : 20  인용 특허 : 21

초록

A electrical connector suitable for aligning and connecting a high-density wire bundle to a receiving member. The wire bundle is attached to an adapter positioned within a mounting location containing electronically controlled, adjustable pushrods which are used to make the fine lateral and rotation

대표청구항

1. A high density electrical connector assembly comprising:a first connector member with a first and second side wherein the first connector member comprises a plurality of electrical conductors on the first side and defines a first contact pattern on the second side comprising a first plurality of

이 특허에 인용된 특허 (21)

  1. Ahmad Umar M. ; Atwood Eugene R., Bare die multiple dies for direct attach.
  2. Koizumi Takao,JPX, Circuit elements mounting.
  3. Bloch Joseph T. (Seattle WA), Clamping device utilizing a shape memory alloy.
  4. Le Parquier Guy (Paris FRX), Connector for flat connections.
  5. Schmidt Juergen K. (Neuss DEX), Contact device for an electrical component and method for manufacture.
  6. Linderman Richard W., Density improvement in integration modules.
  7. Casciotti Albert (Hershey PA) Deak Frederick R. (Kernersville NC) Wrisley ; Jr. David B. (Greensboro NC), Electrical connector using shape memory alloy coil springs.
  8. Shahinpoor Moshen, Fibrous parallel spring-loaded shape memory alloy rebotic linear.
  9. Perry Michael (Mountain View CA) Yasumura Gary (Santa Clara CA), High density and high signal integrity connector.
  10. Yamashita Koji,JPX, High-density mounting method and structure for electronic circuit board.
  11. Mostafazadeh Shahram ; Smith Joseph O., Method for connecting packages of a stacked ball grid array structure.
  12. Sweitzer Brent N. (Nerstrand MN), Method for interconnecting a flip chip to a printed circuit substrate.
  13. O'Boyle John, Micro-electronic assembly including a flip-chip mounted micro-device and method.
  14. Seilhan Denton S. ; Pepper Donald F., Miniature underwater connector.
  15. Forehand Douglas W. ; Lamoreaux Ray, Optimized routing scheme for an integrated circuit/printed circuit board.
  16. Huang James, Peripheral docking module using a shape memory alloy actuator wire.
  17. Decker Lawrence H. (Christiansburg VA), Refreshable braille-cell display implemented with shape memory alloys.
  18. Tarzwell Patrick James, Resilient connector having a tubular spring.
  19. Tarzwell Patrick James, Resilient connector having a tubular spring.
  20. Nakanishi Takao (Takaichi JPX), Shape memory alloy spring connection asssembly.
  21. Krumme John F. (Woodside CA), Thermally responsive electrical connector.

이 특허를 인용한 특허 (20)

  1. Wang, Mill-Jer; Peng, Ching-Nen; Lin, Hung-Chih; Chen, Hao; Lee, Mincent, Alignment testing for tiered semiconductor structure.
  2. Kocalar, Erturk D.; Vora, Saket R.; Verhoeve, Dustin J., Audio accessory with internal clock.
  3. Mullins, Scott; Kosut, Alexei; Krueger, Scott; Ananny, John, Data structures for facilitating communication between a host device and an accessory.
  4. Mullins, Scott; Kosut, Alexei; Krueger, Scott; Ananny, John, Data structures for facilitating communication between a host device and an accessory.
  5. Golko, Albert J.; Schmidt, Mathias W.; Jol, Eric S.; Minoo, Jahan; Spraggs, Ian; Frazier, Cameron; Rothkopf, Fletcher; Aase, Jonathan; Sander, Wendell; Terlizzi, Jeffrey J., Dual orientation connector with external contacts.
  6. Golko, Albert J.; Schmidt, Mathias W.; Jol, Eric S.; Minoo, Jahan; Spraggs, Ian; Frazier, Cameron; Rothkopf, Fletcher; Aase, Jonathan; Sander, Wendell; Terlizzi, Jeffrey J., Dual orientation connector with external contacts.
  7. Golko, Albert J.; Schmidt, Mathias; Jol, Eric S.; Minoo, Jahan; Spraggs, Ian; Frazier, Cameron; Rothkopf, Fletcher; Aase, Jonathan; Sander, Wendell; Terlizzi, Jeffrey J., Dual orientation connector with external contacts.
  8. Golko, Albert J.; Schmidt, Mathias; Jol, Eric; Minoo, Jahan; Spraggs, Ian; Frazier, Cameron; Rothkopf, Fletcher; Aase, Jonathan; Sander, Wendell; Terlizzi, Jeffrey J., Dual orientation connector with external contacts.
  9. Harvey,Rex J.; Hodges,Richard B.; Marban,Joseph, Dual purpose alignment and fluid coupling.
  10. Golko, Albert J.; Schmidt, Mathias W.; Jol, Eric S.; Minoc, Jahan; Spraggs, Ian; Frazier, Cameron; Rothkopf, Fletcher; Aase, Jonathan; Sander, Wendell; Terlizzi, Jeffrey J., Electronic device with circuitry to detect the insertion orientation of a plug connector.
  11. Ho,Chin Wei, Method and apparatus for positioning a printed circuit board in a circuit board panel.
  12. Terlizzi, Jeffrey J.; Rabu, Stanley; Kalayjian, Nicholas R., Systems and methods for determining the configuration of electronic connections.
  13. Terlizzi, Jeffrey J.; Rabu, Stanley; Kalayjian, Nicholas R., Systems and methods for determining the configuration of electronic connections.
  14. Terlizzi, Jeffrey J.; Mullins, Scott; Kosut, Alexei; Minoo, Jahan, Techniques for configuring contacts of a connector.
  15. Terlizzi, Jeffrey J.; Mullins, Scott; Kosut, Alexei; Minoo, Jahan, Techniques for configuring contacts of a connector.
  16. Terlizzi, Jeffrey J.; Mullins, Scott; Kosut, Alexei; Minoo, Jahan, Techniques for configuring contacts of a connector.
  17. Terlizzi, Jeffrey J.; Mullins, Scott; Kosut, Alexei; Minoo, Jahan, Techniques for configuring contacts of a connector.
  18. Mullins, Scott; Kosut, Alexei; Terlizzi, Jeffrey J.; Minoo, Jahan, Techniques for detecting removal of a connector.
  19. Mullins, Scott; Kosut, Alexei; Terlizzi, Jeffrey J.; Minoo, Jahan, Techniques for detecting removal of a connector.
  20. Mullins, Scott; Kosut, Alexei; Terlizzi, Jeffrey J.; Minoo, Jahan, Techniques for detecting removal of a connector.
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