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Chemical mechanical method of polishing wafer surfaces 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B24B-001/00
출원번호 US-0484252 (2000-01-18)
우선권정보 JP-0009901 (1999-01-18); JP-0009904 (1999-01-18); JP-0009905 (1999-01-18)
발명자 / 주소
  • Hiroyuki Yano JP
  • Gaku Minamihaba JP
  • Yukiteru Matsui JP
  • Nobuo Hayasaka JP
  • Katsuya Okumura JP
  • Akira Iio JP
  • Masayuki Hattori JP
  • Masayuki Motonari JP
출원인 / 주소
  • Kabushiki Kaisha Toshiba JP
  • JSR Corporation JP
대리인 / 주소
    Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
인용정보 피인용 횟수 : 59  인용 특허 : 8

초록 ▼

It is an object of the present invention to provide an aqueous dispersion and CMP slurry that can achieve polishing at an adequate rate without producing scratches in the polishing surfaces of wafer working films, and a polishing process for wafer surfaces and a process for manufacture of a semicond

대표청구항

1. A polishing process for wafer surfaces characterized by using an aqueous dispersion composition for chemical mechanical polishing that contains polymer particles with a crosslinked structure and a mean particle size of 0.13-0.8 .mu.m, for polishing of a working film formed on a wafer surface.

이 특허에 인용된 특허 (8)

  1. Neuland Edward J., Abrasive suspension systems and methods of making the same.
    상세보기
  2. Hedrick Steven T. ; Creel Howard S. ; Krishnan Subramanian ; Stofko John J. ; Larson Wayne K., Aqueous sulfopolyurea colloidal dispersions, films and abrasive articles.
    상세보기
  3. Sakamoto Hiroyuki,JPX ; Tobinaga Kenshiro,JPX ; Tsuchiya Yasuyuki,JPX ; Muramoto Hisaichi,JPX ; Ninomiya Yusuke,JPX ; Ishii Keizou,JPX ; Ishikura Shinichi,JPX, Crosslinked resin particles and production thereof.
    상세보기
  4. Yam Benny S. ; Colbert Kenneth S., Method for cleaning electronic hardware components.
    상세보기
  5. Burke Peter A. ; Beckage Peter J., Methods of making and using a chemical-mechanical polishing slurry that reduces wafer defects.
    상세보기
  6. Ronay Maria, Polish process and slurry for planarization.
    상세보기
  7. Sasaki Yasutaka,JPX ; Matsuo Mie,JPX ; Nakata Rempei,JPX ; Wada Junichi,JPX ; Hayasaka Nobuo,JPX ; Yano Hiroyuki ; Okano Haruo,JPX, Polishing method and polishing apparatus.
    상세보기
  8. Lenz Ruben P.,CAX, Starch graft copolymer blast media.
    상세보기

이 특허를 인용한 특허 (59)

  1. Li, Yuzhuo; Bian, Guomin; Tang, Kwok; Zhao, Joe Zunzi; Westbrook, John; Lin, Yong; Chan, Leina, Abrasive composition containing organic particles for chemical mechanical planarization.
    상세보기
  2. Ueda, Kazumasa; Takashima, Masayuki, Abrasive for metal.
    상세보기
  3. Motonari, Masayuki; Kunitani, Eiichirou; Ueno, Tomikazu; Iijima, Takahiro; Matsuda, Takashi, Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method.
    상세보기
  4. Yano, Hiroyuki; Minamihaba, Gaku; Motonari, Masayuki; Hattori, Masayuki; Kawahashi, Nobuo, Aqueous dispersion for chemical mechanical polishing used for polishing of copper.
    상세보기
  5. Lee, Shen-Nan; Shih, Tsu; Jang, Syun Ming, Bimodal slurry system.
    상세보기
  6. Vacassy, Robert; Zhou, Renjie, CMP method for metal-containing substrates.
    상세보기
  7. Schroeder, David J.; Moeggenborg, Kevin J.; Chou, Homer; Chamberlain, Jeffrey P.; Hawkins, Joseph D.; Carter, Phillip, CMP method utilizing amphiphilic nonionic surfactants.
    상세보기
  8. Costas, Wesley D.; Lack, Craig D.; Saucy, Daniel A., CMP polishing composition for semiconductor devices containing organic polymer particles.
    상세보기
  9. Fukasawa, Masato; Yoshida, Masato; Koyama, Naoyuki; Ootsuki, Yuto; Yamagishi, Chiaki; Enomoto, Kazuhiro; Haga, Kouji; Kurata, Yasushi, CMP polishing slurry and polishing method.
    상세보기
  10. Fukasawa, Masato; Yoshida, Masato; Koyama, Naoyuki; Ootsuki, Yuto; Yamagishi, Chiaki; Enomoto, Kazuhiro; Haga, Kouji; Kurata, Yasushi, CMP polishing slurry and polishing method.
    상세보기
  11. Park,Jeong heon; Lee,Jae dong; Kim,Sung jun; Hong,Chang ki, CMP slurry for forming aluminum film, CMP method using the slurry, and method for forming aluminum wiring using the CMP method.
    상세보기
  12. Scott,Brandon Shane; Small,Robert J., Catalyst attached to solid and used to promote free radical formation in CMP formulations.
    상세보기
  13. Small,Robert J.; Scott,Brandon S., Catalytic composition for chemical-mechanical polishing, method of using same, and substrate treated with same.
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  14. Liu,Zhendong, Chemical mechanical planarization compositions for reducing erosion in semiconductor wafers.
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  15. Ma, Ying; Wojtczak, William; Regulski, Cary; Baum, Thomas H.; Bernhard, David D.; Verma, Deepak, Chemical mechanical polishing compositions for metal and associated materials and method of using same.
    상세보기
  16. Ma,Ying; Wojtczak,William; Regulski,Cary; Baum,Thomas H.; Bernhard,David D.; Verma,Deepak, Chemical mechanical polishing compositions for metal and associated materials and method of using same.
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  17. Matsui, Yukiteru; Minamihaba, Gaku; Tateyama, Yoshikuni; Yano, Hiroyuki; Shigeta, Atsushi, Chemical mechanical polishing method of organic film and method of manufacturing semiconductor device.
    상세보기
  18. Matsui,Yukiteru; Minamihaba,Gaku; Tateyama,Yoshikuni; Yano,Hiroyuki; Shigeta,Atsushi, Chemical mechanical polishing method of organic film and method of manufacturing semiconductor device.
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  19. Singh, Rajiv K.; Arjunan, Arul Chakkaravarthi; Das, Dibakar; Singh, Deepika; Mishra, Abhudaya; Jayaraman, Tanjore V., Chemical mechanical polishing of silicon carbide comprising surfaces.
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  20. Singh, Rajiv K; Arjunan, Arul C.; Das, Dibakar; Singh, Deepika; Mishra, Abhudaya; Jayaraman, Tanjore V, Chemical mechanical polishing of silicon carbide comprising surfaces.
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  21. Matsui,Yukiteru, Chemical mechanical polishing slurry and method of manufacturing semiconductor device by using the same.
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  22. Singh, Rajiv K.; Lee, Seung-Mahn, Chemical-mechanical polishing slurry for polishing of copper or silver films.
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  23. Konno,Tomohisa; Kubota,Kiyonobu; Hattori,Masayuki; Kawahashi,Nobuo, Cleaning composition, method for cleaning semiconductor substrate, and process for manufacturing semiconductor device.
    상세보기
  24. Fukasawa, Masato; Koyama, Naoyuki; Kurata, Yasushi; Haga, Kouji; Akutsu, Toshiaki; Ootsuki, Yuuto, Cmp polishing slurry and method of polishing substrate.
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  25. Small,Robert J.; Chen,Zhefei J., Composition for chemical-mechanical polishing and method of using same.
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  26. Cox, Jr., Henry Wilmore, Compositions, methods, and systems for managing total sulfide.
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  27. Cox, Jr., Henry Wilmore, Compositions, methods, and systems for reducing contamination.
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  29. Yang, Kai; Sahota, Kashmir S.; Avanzino, Steven C., Conductor abrasiveless chemical-mechanical polishing in integrated circuit interconnects.
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  30. Ihnfeldt, Robin, Contact release capsule useful for chemical mechanical planarization slurry.
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  32. Tran, Tony Quan; Sachan, Vikas; Gettman, David; Thomas, Terence M.; Lack, Craig D.; Burke, Peter A., Dissolution of metal particles produced by polishing.
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  33. Scott,Brandon Shane; Small,Robert J., Free radical-forming activator attached to solid and used to enhance CMP formulations.
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  34. Siddiqui, Junaid Ahmed; Small, Robert J.; Castillo, Daniel Hernandez, Free radical-forming activator attached to solid and used to enhance CMP formulations.
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  35. Mossoba, Magdi; Al-Khaldi, Sufian, Hydrophilic IR transparent membrane, spectroscopic sample holder comprising same and method of using same.
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  37. Shteinvas, Bela; Melamed, Semyon; Mandel, Kostia, Incorporation of particulate additives into metal working surfaces.
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  50. Partch,Richard E.; Barney,Nathaniel A.; Wang,Hongyu; Quanci,John, Polymer-coated particles for chemical mechanical polishing.
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  51. Swisher,Robert G.; Wang,Alan E.; Allison,William C., Polyurethane urea polishing pad.
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  52. Kurashima, Nobuyuki; Minamihaba, Gaku; Yano, Hiroyuki, Post-CMP treating liquid and manufacturing method of semiconductor device using the same.
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  53. Ota, Katsuhiro; Saito, Akio, Process for fabricating a semiconductor device.
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  54. Leigh, Joseph; Liu, Connie; Kuo, David, Single-step electromechanical mechanical polishing on Ni-P plated discs.
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  55. Minamihaba,Gaku; Fukushima,Dai; Yamamoto,Susumu; Yano,Hiroyuki, Slurry for CMP, polishing method and method of manufacturing semiconductor device.
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  56. Minamihaba,Gaku; Matsui,Yukiteru; Yano,Hiroyuki, Slurry for CMP, polishing method and method of manufacturing semiconductor device.
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  57. Lee, Woo Jin, Solution for ruthenium chemical mechanical planarization.
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  58. Siddiqui,Junaid Ahmed, Surface modified colloidal abrasives, including stable bimetallic surface coated silica sols for chemical mechanical planarization.
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