초록 ▼

An apparatus, as well as a method, brings a surface of a substrate into contact with a polishing pad. A light beam is directed by an optical endpoint detection system to impinge the surface of the substrate. A signal from the optical endpoint detection system is monitored, and if a first endpoint cr

An apparatus, as well as a method, brings a surface of a substrate into contact with a polishing pad. A light beam is directed by an optical endpoint detection system to impinge the surface of the substrate. A signal from the optical endpoint detection system is monitored, and if a first endpoint criterion is not detected within a first time window, polishing is stopped at a default polishing time. If the first endpoint criterion is detected within the first time window, the signal is monitored for the second endpoint criterion, and polishing stops if the second endpoint criterion is detected.

대표청구항 ▼

1. A computer-implemented endpoint detection method for a chemical mechanical polishing operation, comprising:storing a first endpoint criterion, a first time window for the first endpoint criterion, and a second endpoint criterion; receiving a signal from a polishing endpoint detection system; moni

1. A computer-implemented endpoint detection method for a chemical mechanical polishing operation, comprising:storing a first endpoint criterion, a first time window for the first endpoint criterion, and a second endpoint criterion; receiving a signal from a polishing endpoint detection system; monitoring the signal for the first endpoint criterion; if the first endpoint criterion is not detected within the first time window, stopping polishing at a default polishing time; and if the first endpoint criterion is detected within the first time window, monitoring the signal for the second endpoint criterion and stopping polishing if the second endpoint criterion is detected.