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Ceramic member resistant to halogen-plasma corrosion 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C04B-035/505
출원번호 US-0450162 (1999-11-29)
우선권정보 JP-0337224 (1998-11-27); JP-0371726 (1998-12-28); JP-0217013 (1999-07-30); JP-0330093 (1999-11-19)
발명자 / 주소
  • Masahiro Nakahara JP
  • Yumiko Itoh JP
출원인 / 주소
  • Kyocera Corporation JP
대리인 / 주소
    Hogan & Hartson, L.L.P.
인용정보 피인용 횟수 : 69  인용 특허 : 9

초록

The present invention is to provide ceramic members for being used as members constituting a processing chamber for etching or cleaning semiconductor substrates or wafers by halogen plasma. A ceramic member includes at least 10% by volume of a compound of yttrium-aluminum-garnet (YAG) phase and not

대표청구항

1. A ceramic member having a resistance to halogen plasma, comprising not less than 10% by volume of a phase of yttrium-aluminum-garnet and not more than 90% by volume of at least a phase of aluminum oxide, which is formed of a sintered material containing as a main component any one of a combinatio

이 특허에 인용된 특허 (9)

  1. Waku Yoshiharu (Ube JPX) Ohtsubo Hideki (Ube JPX) Kohtoku Yasuhiko (Ube JPX), Ceramic composite material.
  2. Waku Yoshiharu (Ube JPX) Ohtsubo Hideki (Ube JPX) Kohtoku Yasuhiko (Ube JPX), Ceramic composite material.
  3. Waku Yoshiharu,JPX ; Nakagawa Narihito,JPX ; Shimizu Kazutoshi,JPX ; Ohtsubo Hideki,JPX ; Wakamoto Takumi,JPX ; Kohtoku Yasuhiko,JPX, Ceramic composite material and porous ceramic material.
  4. Dodds Gerald C. (Mentor OH) Alexander Ricky A. (Highland Heights OH), Ceramic material for use in casting reactive metals.
  5. Dodds Gerald C. (Mentor OH) Alexander Ricky A. (Highland Heights OH), Ceramic material for use in casting reactive metals.
  6. Takai Yasushi,JPX, Corrosion-resistant composite oxide material.
  7. Ohashi Tsuneaki,JPX ; Araki Kiyoshi,JPX ; Shimura Sadanori,JPX ; Katsuda Yuji,JPX, Corrosion-resistant member, wafer-supporting member, and method of manufacturing the same.
  8. Waku Yoshiharu,JPX ; Nakagawa Narihito,JPX ; Ohtsubo Hideki,JPX ; Wakamoto Takumi,JPX ; Shimizu Kazutoshi,JPX ; Kohtoku Yasuhiko,JPX, Fused ceramic composite.
  9. Nishida Yasunori (Tsukuba JPX) Mohri Masahide (Tsukuba JPX), Method for producing zirconia-based sintered body.

이 특허를 인용한 특허 (69)

  1. Saigusa, Hidehito; Takase, Taira; Mitsuhashi, Kouji; Nakayama, Hiroyuki, Apparatus for an improved deposition shield in a plasma processing system.
  2. Escher,Gary; Allen,Mark A., Barrier layer for a processing element and a method of forming the same.
  3. Kobayashi, Yoshiyuki; Murakami, Takahiro; Harada, Yoshio; Takeuchi, Junichi; Yamasaki, Ryo; Kobayashi, Keigo, Ceramic coating member for semiconductor processing apparatus.
  4. Sun, Jennifer Y.; Duan, Ren-Guan; Collins, Kenneth S., Ceramic component formed ceramic portions bonded together with a halogen plasma resistant bonding agent.
  5. Mah, Tai-Il; Parthasarathy, Triplicane A.; Cinibulk, Michael K., Ceramic matrix composite cutting tool material.
  6. Hamada,Toshiyuki; Nakahara,Masahiro, Ceramic member for semiconductor manufacturing equipment.
  7. Keiji Morita JP; Mitsuhiro Fujita JP; Haruo Murayama JP, Ceramics material and producing the same.
  8. O'Donnell, Robert J.; Daugherty, John E., Cerium oxide containing ceramic components and coatings in semiconductor processing equipment and methods of manufacture thereof.
  9. Ozono, Shunichi, Container for treating with corrosive-gas and plasma and method for manufacturing the same.
  10. Bang, Won B.; Nemani, Srivivas D.; Pham, Phong; Yieh, Ellie Y., Dual top gas feed through distributor for high density plasma chamber.
  11. Han, Nianci; Xu, Li; Shih, Hong; Zhang, Yang; Lu, Danny; Sun, Jennifer Y., Electroplating an yttrium-containing coating on a chamber component.
  12. Lee, Chengtsin; Sun, Jennifer Y., Fluoride glazes from fluorine ion treatment.
  13. Lei, Lawrence Chung-Lai; Lu, Siqing; Gianoulakis, Steven E.; Bang, Won B.; Sun, David P.; Wang, Yen-Kun Victor, Gas baffle and distributor for semiconductor processing chamber.
  14. Park, Soonam; Ahmad, Farhan; Mungekar, Hemant P.; Kamath, Sanjay; Lee, Young S.; Lu, Siqing, Gas baffle and distributor for semiconductor processing chamber.
  15. Park, Soonam; Ahmad, Farhan; Mungekar, Hemant P.; Kamath, Sanjay; Lee, Young S.; Lu, Siqing, Gas baffle and distributor for semiconductor processing chamber.
  16. Yamada, Hirotake; Katsuda, Yuji; Ohashi, Tsuneaki; Masuda, Masaaki; Harada, Masashi; Iwasaki, Hiroyuki; Ito, Shigenori, Halogen gas plasma-resistive members and method for producing the same, laminates, and corrosion-resistant members.
  17. Harada, Yoshio; Takeuchi, Junichi; Hamaguchi, Tatsuya; Nagayama, Nobuyuki; Mitsuhashi, Kouji, Internal member for plasma-treating vessel and method of producing the same.
  18. Harada,Yoshio; Takeuchi,Junichi; Nagayama,Nobuyuki; Mitsuhashi,Kouji, Internal member for plasma-treating vessel and method of producing the same.
  19. Mitsuhashi, Kouji; Nakayama, Hiroyuki; Nagayama, Nobuyuki; Moriya, Tsuyoshi; Nagaike, Hiroshi, Internal member of a plasma processing vessel.
  20. Mitsuhashi, Kouji; Nakayama, Hiroyuki; Nagayama, Nobuyuki; Moriya, Tsuyoshi; Nagaike, Hiroshi, Internal member of a plasma processing vessel.
  21. Mitsuhashi, Kouji; Nakayama, Hiroyuki; Nagayama, Nobuyuki; Moriya, Tsuyoshi; Nagaike, Hiroshi, Internal member of a plasma processing vessel.
  22. Lee, Chengtsin; Sun, Jennifer Y., Low temperature fluoride glasses and glazes.
  23. Nishimoto, Shinya; Mitsuhashi, Kouji; Nakayama, Hiroyuki, Method and apparatus for an improved baffle plate in a plasma processing system.
  24. Nishimoto,Shinya; Mitsuhashi,Kouji; Nakayama,Hiroyuki, Method and apparatus for an improved baffle plate in a plasma processing system.
  25. Saigusa, Hidehito; Takase, Taira; Mitsuhashi, Kouji; Nakayama, Hiroyuki, Method and apparatus for an improved baffle plate in a plasma processing system.
  26. Saigusa,Hidehito; Takase,Taira; Mitsuhashi,Kouji; Nakayama,Hiroyuki, Method and apparatus for an improved baffle plate in a plasma processing system.
  27. Saigusa, Hidehito; Takase, Taira; Mitsuhashi, Kouji; Nakayama, Hiroyuki, Method and apparatus for an improved bellows shield in a plasma processing system.
  28. Saigusa,Hidehito; Takase,Taira; Mitsuhashi,Kouji; Nakayama,Hiroyuki, Method and apparatus for an improved bellows shield in a plasma processing system.
  29. Saigusa,Hidehito; Takase,Taira; Mitsuhashi,Kouji; Nakayama,Hiroyuki, Method and apparatus for an improved deposition shield in a plasma processing system.
  30. Nishimoto, Shinya; Mitsuhashi, Kouji; Saigusa, Hidehito; Takase, Taira; Nakayama, Hiroyuki, Method and apparatus for an improved optical window deposition shield in a plasma processing system.
  31. Nishimoto,Shinya; Mitsuhashi,Kouji; Saigusa,Hidehito; Takase,Taira; Nakayama,Hiroyuki, Method and apparatus for an improved optical window deposition shield in a plasma processing system.
  32. Saigusa, Hidehito; Takase, Taira; Mitsuhashi, Kouji; Nakayama, Hiroyuki, Method and apparatus for an improved upper electrode plate in a plasma processing system.
  33. Saigusa,Hidehito; Takase,Taira; Mitsuhashi,Kouji; Nakayama,Hiroyuki, Method and apparatus for an improved upper electrode plate in a plasma processing system.
  34. Nishimoto, Shinya; Mitsuhashi, Kouji; Nakayama, Hiroyuki, Method and apparatus for an improved upper electrode plate with deposition shield in a plasma processing system.
  35. Nishimoto,Shinya; Mitsuhashi,Kouji; Nakayama,Hiroyuki, Method and apparatus for an improved upper electrode plate with deposition shield in a plasma processing system.
  36. Fink, Steven T., Method and apparatus for improved baffle plate.
  37. Escher, Gary; Allen, Mark A.; Kudo, Yasuhisa, Method for adjoining adjacent coatings on a processing element.
  38. Simpson, Matthew A.; Billieres, Dominique; Main, G?rard; Drouin, Jean-Michel, Method for forming ceramic layer having garnet crystal structure phase and article made thereby.
  39. Han, Nianci; Xu, Li; Shih, Hong, Method of manufacturing a process chamber component having yttrium-aluminum coating.
  40. Sun, Jennifer Y.; Collins, Kenneth S.; Duan, Ren-Guan; Thach, Senh; Graves, Thomas; He, Xiaoming; Yuan, Jie, Method of reducing plasma arcing on surfaces of semiconductor processing apparatus components in a plasma processing chamber.
  41. Harada, Yoshio; Takeuchi, Junichi; Hamaguchi, Tatsuya; Nagayama, Nobuyuki; Mitsuhashi, Kouji, Plasma processing container internal member and production method thereof.
  42. Fink, Steven T., Plasma processing system and baffle assembly for use in plasma processing system.
  43. Kobayashi, Yoshiyuki, Plasma treating apparatus and plasma treating method.
  44. Sun, Jennifer Y.; Collins, Kenneth S.; Duan, Ren-Guan; Thach, Senh; Graves, Thomas; He, Xiaoming; Yuan, Jie, Plasma-resistant ceramics with controlled electrical resistivity.
  45. Han, Nianci; Xu, Li; Shih, Hong; Zhang, Yang; Lu, Danny; Sun, Jennifer Y., Process chamber component having electroplated yttrium containing coating.
  46. Han, Nianci; Xu, Li; Shih, Hong, Process chamber component having yttrium—aluminum coating.
  47. Han, Nianci; Xu, Li; Shih, Hong, Process chamber having component with yttrium-aluminum coating.
  48. Otsuki, Hayashi, Processing apparatus with a chamber having therein a high-corrosion-resistant sprayed film.
  49. Otsuki, Hayashi, Processing apparatus with a chamber having therein a high-corrosion-resistant sprayed film.
  50. Toda,Akihito; Ogawa,Kazuto, Processing method.
  51. Sun, Jennifer Y.; Duan, Ren-Guan; Collins, Kenneth S., Protective coatings resistant to reactive plasma processing.
  52. Takai, Yasushi; Hamaya, Noriaki, Rare earth-containing oxide member.
  53. Sun, Jennifer Y.; Kanungo, Biraja P., Rare-earth oxide based monolithic chamber material.
  54. Sun, Jennifer Y.; Kanungo, Biraja P., Rare-earth oxide based monolithic chamber material.
  55. Liang,Qiwei; Lu,Siqing, Self-cooling gas delivery apparatus under high vacuum for high density plasma applications.
  56. Sun, Jennifer Y.; Duan, Ren-Guan; Yuan, Jie; Xu, Li; Collins, Kenneth S., Semiconductor processing apparatus comprising a coating formed from a solid solution of yttrium oxide and zirconium oxide.
  57. Sun, Jennifer Y.; Duan, Ren-Guan; Yuan, Jie; Xu, Li; Collins, Kenneth S., Semiconductor processing apparatus comprising a solid solution ceramic formed from yttrium oxide, zirconium oxide, and aluminum oxide.
  58. Sun, Jennifer Y.; Duan, Ren-Guan; Yuan, Jie; Xu, Li; Collins, Kenneth S., Semiconductor processing apparatus which is formed from yttrium oxide and zirconium oxide to produce a solid solution ceramic apparatus.
  59. Sun, Jennifer Y.; Duan, Ren-Guan; Yuan, Jie; Xu, Li; Collins, Kenneth S., Semiconductor processing apparatus with a ceramic-comprising surface which exhibits fracture toughness and halogen plasma resistance.
  60. Sun, Jennifer Y; Duan, Ren-Guan; Collins, Kenneth S, Semiconductor processing apparatus with protective coating including amorphous phase.
  61. Niimi,Norikazu, Sintered bodies of yttrium-aluminum garnet, a method of producing the same and sintering aid therefor.
  62. Harada, Yoshio; Teratani, Takema, Spray coating member having excellent injury resistance and so on and method for producing the same.
  63. Harada, Yoshio; Togoe, Kenichiro; Kushiki, Fujio, Spray-coated member having an excellent resistance to plasma erosion and method of producing the same.
  64. Harada, Yoshio; Togoe, Kenichiro; Kushiki, Fujio, Spray-coated member having an excellent resistance to plasma erosion and method of producing the same.
  65. Rasheed, Muhammad M.; Lubomirsky, Dmitry, Surface treated aluminum nitride baffle.
  66. Rasheed, Muhammad M.; Lubomirsky, Dmitry, Surface treated aluminum nitride baffle.
  67. Harada,Yoshio; Teratani,Takema, YOspray-coated member and production method thereof.
  68. O'Donnell, Robert J.; Chang, Christopher C.; Daugherty, John E., Zirconia toughened ceramic components and coatings in semiconductor processing equipment and method of manufacture thereof.
  69. O'Donnell,Robert J.; Chang,Christopher C.; Daugherty,John E., Zirconia toughened ceramic components and coatings in semiconductor processing equipment and method of manufacture thereof.
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