초록 ▼

A thermoelectric device with enhanced structured interfaces for improved cooling efficiency is provided. In one embodiment, the thermoelectric device includes a first thermoelement comprising a supetlattice of p-type thermoelectric material and a second thermoelement comprising superlattice of n-typ

A thermoelectric device with enhanced structured interfaces for improved cooling efficiency is provided. In one embodiment, the thermoelectric device includes a first thermoelement comprising a supetlattice of p-type thermoelectric material and a second thermoelement comprising superlattice of n-type thermoelectric material. The first and second thermoelements are electrically coupled to each other. The first thermoelement is proximate to, without necessarily being in physical contact with, a first array of electrically conducting tips at a discrete set of points. A planer surface of the second thermoelement is proximate to, without necessarily being in physical contact with, a second array of electrically conducting tips at a discrete set of points. The electrically conducting tips are coated with a material that has the same Seebeck coefficient as the material of the nearest layer of the superlattice to the tip.

대표청구항 ▼

1. A thermoelectric device, comprising:a first thermoelement; a second thermoelement electrically coupled to the first thermoelement; a plurality of first tips formed from a semiconductor substrate overlaid by a metallic layer and situated proximate to the first thermoelement at a first set of discr

1. A thermoelectric device, comprising:a first thermoelement; a second thermoelement electrically coupled to the first thermoelement; a plurality of first tips formed from a semiconductor substrate overlaid by a metallic layer and situated proximate to the first thermoelement at a first set of discrete points; and a plurality of second tips formed from a semiconductor substrate overlaid by a metallic layer and situated proximate to the second thermoelement at a second set of discrete points.