$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Micro-electromechanical system device 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01H-057/00
출원번호 US-0495786 (2000-02-01)
발명자 / 주소
  • Jenn-Hwa Huang
  • Samuel L. Coffman
  • Xi-Qing Sun
  • Ji-Hai Xu
  • John Michael Parsey, Jr.
출원인 / 주소
  • Motorola, Inc.
인용정보 피인용 횟수 : 178  인용 특허 : 15

초록

A Micro-Electromechanical Systems (MEMS) device (100) having conductively filled vias (141). A MEMS component (124) is formed on a substrate (110). The substrate has conductively filled vias (140) extending therethrough. The MEMS component (124) is electrically coupled to the conductively filled via

대표청구항

1. A Micro-Electromechanical System (MEMS) device, comprising:a substrate having first and second major surfaces; a plurality of conductively filled vias located within a portion of the substrate; a first conductive layer over the first major surface of the substrate, a first portion of the first co

이 특허에 인용된 특허 (15)

  1. Goodwin-Johansson Scott Halden, Arc resistant high voltage micromachined electrostatic switch.
  2. Goldberg Howard D. (Somerville MA) Schmidt Martin A. (Reading MA), Backside contact of sensor microstructures.
  3. Martin Jacob H. (Wellesley MA), Covers for micromechanical sensors and other semiconductor devices.
  4. Loo Robert Y. ; Schmitz Adele ; Brown Julia ; Lynch Jonathan ; Choudhury Debabani ; Foschaar James ; Hyman Daniel J. ; Warneke Brett ; Lam Juan ; Hsu Tsung-Yuan ; Lee Jae ; Mehregany Mehran, Design and fabrication of broadband surface-micromachined micro-electro-mechanical switches for microwave and millimeter-wave applications.
  5. Kasano Fumihiro (Sakai JPX) Nishimura Hiromi (Takatsuki JPX) Sakai Jun (Osaka JPX) Aizawa Koichi (Ikoma JPX) Kakite Keiji (Hirakata JPX) Awai Takayoshi (Kadoma JPX), Electrostatic relay.
  6. Feng Milton ; Shen Shyh-Chiang, Low actuation voltage microelectromechanical device and method of manufacture.
  7. Buck Daniel C. (Hanover MD), Low inductance cantilever switch.
  8. Ohara Fumio (Okazaki JPX) Yoshihara Shinji (Nagoya JPX) Kanamori Katuhiko (Nukata-gun JPX) Kurahashi Takashi (Okazaki JPX), Method for manufacturing a semiconductor acceleration sensor device.
  9. Zavracky Paul M. (Norwood MA) Morrison ; Jr. Richard H. (Taunton MA), Micromechanical electric shunt and encoding devices made therefrom.
  10. Zavracky Paul M. (Norwood MA), Micromechanical switch with insulated switch contact.
  11. Zavracky Paul M. ; McGruer Nicol E., Micromechanical switching devices.
  12. Buck Daniel C. (Hanover MD), Non-contact two position microeletronic cantilever switch.
  13. Asada Norihiro,JPX ; Esashi Masayoshi,JPX, Planar type electromagnetic relay and method of manufacturing thereof.
  14. Randall John Neal,BEX ; Kao Ming-Yih, Recessed etch RF micro-electro-mechanical switch.
  15. Jones Gary W. (Raleigh NC) Sune Ching-Tzong (Raleigh NC), Vertical microelectronic field emission devices.

이 특허를 인용한 특허 (178)

  1. Nagarkar, Kaustubh Ravindra; Keimel, Christopher Fred, 3D integrated electronic device structure including increased thermal dissipation capabilities.
  2. Geisberger, Aaron A.; Lin, Yizhen; McNeil, Andrew C., Accelerometer with over-travel stop structure.
  3. Martin, John R.; Frey, Timothy J.; Tsau, Christine H.; Judy, Michael W., Apparatus and method of wafer bonding using compatible alloy.
  4. Martinez, Eduardo M.; Jimenez, Christian; Ibanez Climent, Jose; Donovan, Colm, Automatic characterization of an actuator based on capacitance measurement.
  5. Dropmann, Hans; Sridhar, Uppili; Stuebing, Carlton, Bonded wafer package module.
  6. Lee, Hee-Joong, Cantilever having step-up structure and method for manufacturing the same.
  7. Coppeta, Jonathan R.; Shelton, Kurt; Sheppard, Jr., Norman F.; Snell, Douglas; Santini, Catherine M. B., Compression and cold weld sealing method for an electrical via connection.
  8. DiUbaldi, Anthony; Tracey, Michael R., Conductive mesh for neurostimulation.
  9. Miyazaki, Masaru; Sampei, Hirokazu; Liu, Yongxun; Esashi, Masayoshi, Connecting member, a micro-switch, a method for manufacturing a connecting member, and a method for manufacturing a micro-switch.
  10. Uhland, Scott A.; Polito, Benjamin F.; Maloney, John M.; Sheppard, Jr., Norman F.; Herman, Stephen J.; Yomtov, Barry M., Containment device with multi-layer reservoir cap structure.
  11. Liu,Lianjun; Gogoi,Bishnu P., Control and testing of a micro electromechanical switch.
  12. Liu, Lianjun, Control and testing of a micro electromechanical switch having a piezo element.
  13. Uhland,Scott A.; Polito,Benjamin F.; Maloney,John M.; Sheppard, Jr.,Norman F.; Herman,Stephen J.; Yomtov,Barry Y., Controlled release device and method using electrothermal ablation.
  14. Uhland,Scott A.; Polito,Benjamin F.; Maloney,John M.; Sheppard, Jr.,Norman F.; Herman,Stephen J.; Yomtov,Barry Y., Controlled release device and method using electrothermal ablation.
  15. Santini, Jr.,John T.; Sheppard, Jr.,Norman F.; Young,Chung Chang; Langer,Robert S., Device for the controlled exposure of reservoir-based sensors.
  16. Rogers, John E., Directional couplers with variable frequency response.
  17. Wang, Tih-Hong; Brackett, George; Clevenger, David; Bort, Donovan E., Droplet actuator assemblies and methods of making same.
  18. Wallis, Andrew D.; Foster, John S.; Rubel, Paul J.; Rybnicek, Kimon; Shillinger, Michael J.; Summers, Jeffrey F., Dual substrate electrostatic MEMS switch with hermetic seal and method of manufacture.
  19. Gudeman, Christopher S.; Rubel, Paul J.; Sigurdson, Marin, Dual substrate electrostatic MEMS switch with multiple hinges and method of manufacture.
  20. Staker, Bryan P.; Teeter, Jr., Douglas L.; DeBey, Thomas A.; Amm, David T., Electro ceramic MEMS structure with oversized electrodes.
  21. Sheppard, Jr., Norman F.; Santini, Jr., John T., Electrochemical biosensors and arrays.
  22. Dunec,John L.; Peeters,Eric; Volkel,Armin R.; Rosa,Michel A.; DeBruyker,Dirk; Hantschel,Thomas, Electrode design and positioning for controlled movement of a moveable electrode and associated support structure.
  23. Feng, Milton; Shen, Shyh-Chiang, Electromagnetic energy controlled low actuation voltage microelectromechanical switch.
  24. Shen,Jun; Wei,Chengping, Electromechanical latching relay and method of operating same.
  25. Najafi, Khalil; Lee, Sang-Hyun; Lee, Sang Woo, Environment-resistant module, micropackage and methods of manufacturing same.
  26. Najafi, Khalil; Lee, Sang-Hyun; Lee, Sang Woo, Environment-resistant module, micropackage and methods of manufacturing same.
  27. Najafi, Khalil; Lee, Sang-Hyun; Lee, Sang Woo, Environment-resistant module, micropackage and methods of manufacturing same.
  28. Hunziker, Werner; Hornung, Mark; Monnin, Eric, Flow sensor package.
  29. Martin, John R.; Harney, Kieran H., Hermetic seals for large optical packages and the like.
  30. Coppeta, Jonathan R.; Shelton, Kurt; Sheppard, Jr., Norman F.; Snell, Douglas; Santini, Catherine M. B., Hermetically sealing using a cold welded tongue and groove structure.
  31. Cohn, Michael B., High force MEMS device.
  32. Potter, Michael D., High temperature embedded charge devices and methods thereof.
  33. Santini, Jr., John T.; Sheppard, Jr., Norman F., Implantable medical device for diagnostic sensing.
  34. DiUbaldi, Anthony, Implantable pulse generators and methods for selective nerve stimulation.
  35. Santini, Jr., John T.; Cima, Michael J.; Sheppard, Jr., Norman F.; Herman, Stephen J., Implantable, tissue conforming drug delivery device.
  36. Rice, Janet L., Integrated MEMS device and package.
  37. Liu, Lianjun; Miller, Melvy F., Integrated passive device and method of fabrication.
  38. Yun, Changhan; Villarreal, Javier; Karpman, Maurice S., Interconnection of through-wafer vias using bridge structures.
  39. Stafford, John; Tam, Gordon; Shen, Jun, Latching micro magnetic relay packages and methods of packaging.
  40. Stafford,John; Tam,Gordon; Shen,Jun, Latching micro magnetic relay packages and methods of packaging.
  41. Ebel, John L.; Cortez, Rebecca; Leedy, Kevin D.; Strawser, Richard E.; Strawser, legal representative, Donald E., Latching zip-mode actuated mono wafer MEMS switch method.
  42. Busta,Heinz H., MEM switching device.
  43. Heck,John M.; Chou,Tsung Kuan Allen; Hayden, III,Joseph S., MEMS RF switch module including a vertical via.
  44. Heck,John M.; Chou,Tsung Kuan Allen; Hayden, III,Joseph S., MEMS RF switch module including a vertical via.
  45. Harney, Kieran P.; Felton, Lawrence E.; Nunan, Thomas Kieran; Alie, Susan A.; Wachtmann, Bruce, MEMS device with conductive path through substrate.
  46. Lee, Check F.; Goggin, Raymond C.; Fitzgerald, Padraig L., MEMS device with constant capacitance.
  47. Cohn, Michael Bennett; Xu, Ji-Hai, MEMS device with integral packaging.
  48. Fu, Yee-Chung, MEMS electrical switch.
  49. Wang, Xuefeng; Subramanian, Kanakasabapathi; Keimel, Christopher Fred; Aimi, Marco Francesco; Kishore, Kuna Venkat Satya Rama; Claydon, Glenn Scott; Boomhower, Oliver Charles; Thakre, Parag, MEMS microswitch having a conductive mechanical stop.
  50. Keimel, Christopher Fred; Wang, Xuefeng; Aimi, Marco Francesco; Subramanian, Kanakasabapathi, MEMS microswitch having a dual actuator and shared gate.
  51. Martin, John R.; Zhang, Xin, MEMS sensor with cap electrode.
  52. Hong, Young-tack; Kim, Jong-seok; Song, In-sang; Kwon, Sang-wook; Oh, Seung-jin; Lee, Eun-sung; Choi, Seung-tae, MEMS structure and method of fabricating the same.
  53. Fitzgerald, Padraig L.; Wong, Jo-ey; Goggin, Raymond C.; Stenson, Bernard P.; Lambkin, Paul; Schirmer, Mark, MEMS switch.
  54. Macnamara, John G; Fitzgerald, Padraig L.; Goggin, Raymond C; Stenson, Bernard P, MEMS switch device and method of fabrication.
  55. Chu, Chia-Hua; Lin, Chung-Hsien; Cheng, Chun-Wen, MEMS switch with reduced dielectric charging effect.
  56. Rogers, John E.; Weatherspoon, Michael R., MEMS switches and other miniaturized devices having encapsulating enclosures, and processes for fabricating same.
  57. Kishore, Kuna Venkat Satya Rama; Aimi, Marco, MEMS switching array having a substrate arranged to conduct switching current.
  58. Lee, Check F.; Goggin, Raymond C.; Fitzgerald, Padraig L.; Stenson, Bernard P.; Schirmer, Mark; Wong, Jo-ey, MEMS swtich with internal conductive path.
  59. Huang, Yongli, MEMS ultrasonic device having a PZT and cMUT.
  60. Chen, Li; Nunan, Thomas Kieran; Yang, Kuang L., MEMs device with outgassing shield.
  61. Kretschmann, Robert J.; Harris, Richard D., Magnetic field sensor using microelectromechanical system.
  62. Santini, Jr.,John T.; Sheppard, Jr.,Norman F., Medical device and method for diagnostic sensing.
  63. Yomtov, Barry M.; Herman, Stephen J.; Santini, Jr., John T., Medical device for neural stimulation and controlled drug delivery.
  64. Santini, Jr., John T.; Herman, Stephen J., Medical device for sensing glucose.
  65. Santini, Jr., John T.; Sheppard, Jr., Norman F.; Young, Chung Chang; Langer, Robert S., Medical device with reservoir-based sensors.
  66. Forehand,David, Membrane switch components and designs.
  67. Gilbert, Roland, Method and apparatus for using RF-activated MEMS switching element.
  68. Tilmans,Hendrikus; Beyne,Eric; Jansen,Henri; De Raedt,Walter, Method and system for fabrication of integrated tunable/switchable passive microwave and millimeter wave modules.
  69. Renault, Mickael; Lacey, Joseph Damian Gordon; Joshi, Vikram; Maguire, Thomas L., Method for MEMS device fabrication and device formed.
  70. Soussan, Philippe; Ruythooren, Wouter; Beyne, Eric; De Munck, Koen, Method for aligning and bonding elements and a device comprising aligned and bonded elements.
  71. Kretschmann, Robert J.; Lucak, Mark A.; Harris, Richard D.; Knieser, Michael J., Method for constructing an isolate microelectromechanical system (MEMS) device using surface fabrication techniques.
  72. Chu, Chia-Hua; Lin, Chung-Hsien; Cheng, Chun-Wen, Method for fabricating MEMS switch with reduced dielectric charging effect.
  73. Harris, Richard D.; Kretschmann, Robert J., Method for fabricating a microelectromechanical system (MEMS) device using a pre-patterned bridge.
  74. Harris, Richard D.; Kretschmann, Robert J., Method for fabricating a microelectromechanical system (MEMS) device using a pre-patterned bridge.
  75. Harris, Richard D.; Knieser, Michael J.; Kretschmann, Robert J.; Lucak, Mark A., Method for fabricating an isolated microelectromechanical system (MEMS) device incorporating a wafer level cap.
  76. Harris, Richard D.; Kretschmann, Robert J.; Knieser, Michael J.; Lucak, Mark A., Method for fabricating an isolated microelectromechanical system (MEMS) device using an internal void.
  77. Harris,Richard D.; Kretschmann,Robert J.; Knieser,Michael J.; Lucak,Mark A., Method for fabricating an isolated microelectromechanical system (MEMS) device using an internal void.
  78. Harris,Richard D.; Kretschmann,Robert J.; Knieser,Michael J.; Lucak,Mark A., Method for fabricating an isolated microelectromechanical system (MEMS) device using an internal void.
  79. Shen,Jun; Wei,Cheng Ping; Goranson,Mark, Method for laminating electro-mechanical structures.
  80. Santini, Jr., John T.; Sheppard, Jr., Norman F.; Langer, Robert S.; Young, Chung Chang, Method for making reservoir-based sensor device.
  81. Potter,Michael D., Method for non-damaging charge injection and a system thereof.
  82. Potter,Michael D., Method for non-damaging charge injection and system thereof.
  83. Santini, Jr., John T.; Sheppard, Jr., Norman F.; Langer, Robert S.; Young, Chung Chang, Method for operating a reservoir-based sensor device.
  84. Sheppard, Jr., Norman F.; Santini, Jr., John T.; Cima, Michael J.; Langer, Robert S.; Ausiello, Dennis, Method for wirelessly monitoring implanted medical device.
  85. Santini, Jr., John T.; Cima, Michael J.; Langer, Robert S.; Ausiello, Dennis; Sheppard, Jr., Norman F., Method of actuating implanted medical device.
  86. Lucak, Mark A.; Harris, Richard D.; Knieser, Michael J.; Kretschmann, Robert J., Method of fabricating a microelectromechanical system (MEMS) device using a pre-patterned substrate.
  87. Najafi,Khalil; Giachino,Joseph M.; Chae,Junseok, Method of fabricating a package with substantially vertical feedthroughs for micromachined or MEMS devices.
  88. Volant, Richard P.; Bisson, John C.; Cote, Donna R.; Dalton, Timothy J.; Groves, Robert A.; Petrarca, Kevin S.; Stein, Kenneth J.; Subbanna, Seshadri, Method of fabricating micro-electromechanical switches on CMOS compatible substrates.
  89. Chou,Chia Shing, Method of fabricating semiconductor devices employing at least one modulation doped quantum well structure and one or more etch stop layers for accurate contact formation.
  90. Wygant, Ira Oaktree; Johnson, Peter B., Method of forming capacitive MEMS sensor devices.
  91. Luce, Stephen E.; Stamper, Anthony K., Method of manufacture MEMS switches with reduced voltage.
  92. Luce, Stephen E.; Stamper, Anthony K., Method of manufacturing MEMS switches with reduced switching voltage.
  93. Luce, Stephen E.; Stamper, Anthony K., Method of manufacturing MEMS switches with reduced switching volume.
  94. Luce, Stephen E.; Stamper, Anthony K., Method of manufacturing MEMS switches with reduced voltage.
  95. Luce, Stephen E.; Stamper, Anthony K., Method of manufacturing a switch.
  96. Santini, Jr., John T.; Cima, Michael J.; Langer, Robert S.; Ausiello, Dennis; Sheppard, Jr., Norman F., Method of opening reservoir of containment device.
  97. Potter,Michael D., Methods for distributed electrode injection.
  98. Potter,Michael D., Micro fluidic valves, agitators, and pumps and methods thereof.
  99. Shen,Jun; Ruan,Meichun; Wei,Chengping, Micro magnetic proximity sensor system.
  100. Bouche, Guillaume; Andre, Bernard; Sillon, Nicolas, Micro-component packaging process and set of micro-components resulting from this process.
  101. Potter,Michael D., Micro-electro-mechanical switch and a method of using and making thereof.
  102. Ellis, Denis; Fitzgerald, Padraig; Wong, Jo-ey; Goggin, Raymond; Eckl, Richard Tarik, Micro-electro-mechanical switch beam construction with minimized beam distortion and method for constructing.
  103. Huang, Yongli, Micro-electro-mechanical transducer having a surface plate.
  104. Huang, Yongli, Micro-electro-mechanical transducer having a surface plate.
  105. Huang, Yongli, Micro-electro-mechanical transducer having an optimized non-flat surface.
  106. Huang, Yongli, Micro-electro-mechanical transducer having an optimized non-flat surface.
  107. Huang, Yongli, Micro-electro-mechanical transducer having an optimized non-flat surface.
  108. Huang, Yongli, Micro-electro-mechanical transducer having an optimized non-flat surface.
  109. Greenberg, David R.; Deligianni, Hariklia; Groves, Robert A.; Jahnes, Christopher V.; Lund, Jennifer L.; Saenger, Katherine L.; Volant, Richard P., Micro-electromechanical switch having a conductive compressible electrode.
  110. Zribi,Anis; Claydon,Glenn Scott; Kapusta,Christopher James; Meyer,Laura Jean; Berkcan,Ertugrul; Tian,Wei Cheng, Micro-electromechanical system (MEMS) based current and magnetic field sensor having capacitive sense components.
  111. Berkcan,Ertugrul; Chandrasekaran,Shankar; Kapusta,Christopher James; Meyer,Laura Jean; Claydon,Glenn Scott; Jones,Debbie Gahaton; Zribi,Anis, Micro-electromechanical system (MEMS) based current and magnetic field sensor having improved sensitivities.
  112. Berkcan,Ertugrul; Chandrasekaran,Shankar; Kapusta,Christopher James; Meyer,Laura Jean; Claydon,Glenn Scott; Jones,Debbie Gahaton; Zribi,Anis, Micro-electromechanical system (MEMS) based current and magnetic field sensor having improved sensitivities.
  113. Majumder, Sumit; Skrobis, Kenneth; Morrison, Richard H.; Haigh, Geoffrey, Micro-machined relay.
  114. Iwata, Hideki; Yuba, Takashi; Saso, Hirofumi, Micro-relay and method of fabricating the same.
  115. Takayanagi, Fumikazu; Moro, Yoshiaki; Sanpei, Hirokazu, Micro-switch device and method for manufacturing the same.
  116. Sheppard, Jr.,Norman F.; Santini, Jr.,John T.; Herman,Stephen J.; Cima,Michael J.; Langer,Robert S.; Ausiello,Dennis, Microchip reservoir devices using wireless transmission of power and data.
  117. Ma, Qing; Rao, Valluri; Heck, John; Wang, Li-Peng; Shim, Dong; Tran, Quan, Microelectromechanical (MEMS) switching apparatus.
  118. Ma, Qing; Rao, Valluri; Heck, John; Wang, Li-Peng; Shim, Dong; Tran, Quan, Microelectromechanical (MEMS) switching apparatus.
  119. Bluzer, Nathan, Microelectromechanical RF switch.
  120. Knieser, Michael J.; Harris, Richard D.; Pond, Robert J.; Szabo, Louis F.; Discenzo, Frederick M.; Herbert, Patrick C.; Kretschmann, Robert J.; Lucak, Mark A., Microelectromechanical isolating circuit.
  121. Harris, Richard D.; Knieser, Michael J.; Dummermuth, Ernst H.; Kretschmann, Robert J., Microelectromechanical system (MEMS) analog electrical isolator.
  122. Knieser, Michael J.; Harris, Richard D.; Kretschmann, Robert J.; Dummermuth, Ernst H.; Herbert, Patrick C., Microelectromechanical system (MEMS) digital electrical isolator.
  123. Herbert, Patrick C.; Annis, Jeffrey R.; Yao, Jun J.; Morris, Winfred L.; Larsson, Henric; Harris, Richard D.; Kretschmann, Robert J., Microelectromechanical system (MEMS) with improved beam suspension.
  124. Cohn, Michael Bennett; Kung, Joseph T., Microelectromechanical systems using thermocompression bonding.
  125. Suzuki, Kenichiro; Ara, Youichi; Chen, Shuguang, Micromachine switch and its production method.
  126. Suzuki, Kenichiro; Marumoto, Tsunehisa, Micromachine switch and its production method.
  127. Shen, Jun; Godavarti, Prasad S.; Stafford, John; Tam, Gordon, Micromagnetic latching switch packaging.
  128. Liu, Lianjun, Micromechanical device with piezoelectric and electrostatic actuation and method therefor.
  129. Aigner, Robert; Michaelis, Sven; Plötz, Florian, Microrelay.
  130. Ono, Tomio; Sakai, Tadashi; Sakuma, Naoshi; Suzuki, Mariko, Microswitch and method of manufacturing the same.
  131. Potter,Michael D., Motion based, electrostatic power source and methods thereof.
  132. Santini, Jr., John T.; Sbiaa, Zouhair; Coppeta, Jonathan R.; Uhland, Scott A.; Sheppard, Jr., Norman F., Multi-cap reservoir devices for controlled release or exposure of reservoir contents.
  133. Santini, Jr., John T.; Sbiaa, Zouhair; Coppeta, Jonathan R.; Uhland, Scott A.; Sheppard, Jr., Norman F., Multi-opening reservoir devices for controlled release or exposure of reservoir contents.
  134. Pessoa, Lucio F. C.; Pelley, III, Perry H., Multiple core system.
  135. Feng, Xiao-Li; Karabalin, Rassul B.; Aldridge, John Sequoyah; Roukes, Michael L., Nano-electro-mechanical systems switches.
  136. Harris, Richard D.; Kretschmann, Robert J., On-board microelectromechanical system (MEMS) sensing device for power semiconductors.
  137. Ma, Qing; Rao, Valluri; Wang, Li-Peng; Heck, John; Tran, Quan, Packaging microelectromechanical structures.
  138. Shen,Jun; Godavarti,Prasad S., Packaging of a micro-magnetic switch with a patterned permanent magnet.
  139. DiUbaldi, Anthony; Wahlgren, Stephen; Tracey, Michael R., Piezoelectric stimulation device.
  140. Bieck, Dipl.-Ing. Florian; Leib, Jürgen, Process for making contact with and housing integrated circuits.
  141. Bieck, Dipl.-Ing. Florian; Leib, Jürgen, Process for making contact with and housing integrated circuits.
  142. Bieck, Florian; Leib, Jürgen, Process for making contact with and housing integrated circuits.
  143. Bieck, Florian; Leib, Jürgen, Process for making contact with and housing integrated circuits.
  144. Leib, J?rgen; Bieck, Florian, Process for producing microelectromechanical components and a housed microelectromechanical component.
  145. Rogers, John E.; Weatherspoon, Michael R., Processes for fabricating MEMS switches and other miniaturized devices having encapsulating enclosures.
  146. Goldsmith, Charles L., Proximity micro-electro-mechanical system.
  147. Gilbert,Roland A, RF-actuated MEMS switching element.
  148. Coutu, Jr.,Ronald A.; Kladitis,Paul E.; Crane,Robert L.; Leedy,Kevin D., Radio frequency MEMS switch contact metal selection.
  149. Liu, Lianjun, Radio frequency circuit with integrated on-chip radio frequency inductive signal coupler.
  150. Liu, Lianjun; Miller, Melvy F., Re-configurable impedance matching and harmonic filter system.
  151. Ma, Qing; Ravi, Kramadhati V.; Rao, Valluri, Reliable opposing contact structure.
  152. Potter,Michael D., Rotational motion based, electrostatic power source and methods thereof.
  153. Pashby,Gary Joseph; Slater,Timothy G., Sealed integral MEMS switch.
  154. MacNamara, Cormac; Brogan, Conor; Griffin, Hugh J.; Wilson, Robin, Silicon wafer having through-wafer vias.
  155. Pashby, Gary Joseph; Slater, Timothy G.; Gottlieb, Glenn, Single-pole double-throw MEMS switch.
  156. Martin, John R.; Tsau, Christine H.; Frey, Timothy J., Substrate bonding with bonding material having rare earth metal.
  157. Yang, Chin-Sheng, Suspended beam for use in MEMS device.
  158. Yuba,Takashi; Iwata,Hideki; Segawa,Yuriko, Switch device.
  159. Aimi, Marco Francesco; Bansal, Shubhra; Keimel, Christopher Fred; Kishore, Kuna Venkat Satya Rama; Sundaram, Sairam; Thakre, Parag, Switch structures.
  160. Min, Tang; Le Neel, Olivier; Shankar, Ravi, Switch with increased magnetic sensitivity.
  161. Rogers, John E.; Weatherspoon, Michael R., Switches for use in microelectromechanical and other systems, and processes for making same.
  162. Rogers, John E.; Weatherspoon, Michael R., Switches for use in microelectromechanical and other systems, and processes for making same.
  163. Rogers, John E.; Weatherspoon, Michael R., Switches for use in microelectromechanical and other systems, and processes for making same.
  164. Rogers, John E.; Weatherspoon, Michael R., Switches for use in microelectromechanical and other systems, and processes for making same.
  165. Furuta, Shigeo; Takahashi, Tsuyoshi; Ono, Masatoshi; Naitoh, Yasuhisa; Shimizu, Tetsuo, Switching element.
  166. Tracey, Michael R.; DiUbaldi, Anthony, System and method for nerve stimulation.
  167. Tracey, Michael R.; DiUbaldi, Anthony, System and method for nerve stimulation.
  168. DiUbaldi, Anthony; Tracey, Michael R., System and method for selectively stimulating different body parts.
  169. Tracey, Michael R.; DiUbaldi, Anthony; Johns, Douglas B., System and method for selectively stimulating different body parts.
  170. Pessoa, Lucio F. C.; Pelley, III, Perry H., Testing of multiple integrated circuits.
  171. Santini, Jr.,John T.; Cima,Michael J.; Uhland,Scott Albert, Thermally-activated reservoir devices.
  172. Liu, Lianjun, Three dimensional integrated passive device and method of fabrication.
  173. Liu, Lianjun, Three dimensional integrated passive device and method of fabrication.
  174. Liu, Lianjun; Uscola, Ricardo A., Transmitter with improved power efficiency.
  175. Bregante, Raymond S.; Shaffer, Tony; Mellen, K. Scott; Ross, Richard J., Use of diverse materials in air-cavity packaging of electronic devices.
  176. Felton,Lawrence E.; Harncy,Kieran P.; Roberts,Carl M., Wafer level capped sensor.
  177. Felton,Lawrence E.; Harney,Kieran P.; Roberts,Carl M., Wafer level capped sensor.
  178. Sridhar,Uppili; Zou,Quanbo, Wafer level packaging process.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로