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[미국특허] Fingered capacitor in an integrated circuit 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01G-004/228
출원번호 US-0675540 (2000-09-29)
발명자 / 주소
  • Jahanshir J. Javanifard
  • Hari R. Giduturi
  • Mathew B. Nazareth
출원인 / 주소
  • Intel Corporation
대리인 / 주소
    Blakely, Sokoloff, Taylor & Zafman LLP
인용정보 피인용 횟수 : 57  인용 특허 : 4

초록

A fingered capacitor in an integrated circuit. A first capacitor element is formed in a first layer of an integrated circuit (IC) die. The first capacitor element includes a positive plate and a negative plate. Each of the positive and negative plates of the first capacitor element has a plurality o

대표청구항

1. An apparatus comprising:a first capacitor element in a first layer of an integrated circuit (IC) die, the first capacitor element including a positive plate and a negative plate, each of the positive and negative plates of the first capacitor element having a plurality of fingers interdigitated w

이 특허에 인용된 특허 (4)

  1. Ng Anthony C. C. (Ottawa CAX) Saran Mukul (Kanata CAX), Capacitor structure for an integrated circuit.
  2. Stolmeijer Andre ; Greenlaw David C., High quality capacitor for sub-micrometer integrated circuits.
  3. Wark James M. ; Akram Salman, Thin film capacitor coupons for memory modules and multi-chip modules.
  4. Wark James M. ; Akram Salman, Thin film capacitor coupons for memory modules and multi-chip modules.

이 특허를 인용한 특허 (57)

  1. Tyhach,Jeffrey; Wang,Bonnie I; Chong,Yan; Sung,Chiakang, Apparatus and methods for providing highly effective and area efficient decoupling capacitance in programmable logic devices.
  2. Sadoughi, Sharmin; Ahn, Jae-Gyung, Calibrating device performance within an integrated circuit.
  3. Okamoto, Kiyomi; Sugioka, Tetsurou; Adachi, Kazuki, Capacitor structure.
  4. Soenen, Eric; Bui, Dan, Capacitor structure and automated design flow for incorporating same.
  5. Chen, Chun Sheng; Tseng, Ying Che, Capacitor structure for integrated circuit.
  6. Jing, Jing; Wu, Shuxian, Capacitor structure in an integrated circuit.
  7. Kito, Yoshiharu, Cell-based IC layout system and cell-based IC layout method.
  8. Laskar, Joy, Compact and low-power millimeter-wave integrated VCO-up/down-converter with gain-boosting.
  9. Min,Won Gi; Fallico,Geno L.; Kroll,Amanda M.; Yang,Hongning; Zuo,Jiang Kai, Composite capacitor and method for forming the same.
  10. Hajimiri, Seyed-Ali; Kee, Scott D.; Aoki, Ichiro, Cross-differential amplifier.
  11. Hajimiri, Seyed-Ali; Kee, Scott D.; Aoki, Ichiro, Cross-differential amplifier.
  12. Hajimiri, Seyed-Ali; Kee, Scott D.; Aoki, Ichiro, Cross-differential amplifier.
  13. Kito, Yoshiharu, Decoupling capacitor cell, cell-based IC, cell-based IC layout system and method, and portable device.
  14. Aoki, Ichiro; Hajimiri, Seyed-Ali; Ruthledge, David B.; Kee, Scott D., Distributed circular geometry power amplifier architecture.
  15. Aoki, Ichiro; Hajimiri, Seyed-Ali; Rutledge, David B.; Kee, Scott David, Distributed circular geometry power amplifier architecture.
  16. Aoki, Ichiro; Hajimiri, Seyed-Ali; Rutledge, David B.; Kee, Scott David, Distributed circular geometry power amplifier architecture.
  17. Aoki,Ichiro; Hajimiri,Seyed Ali; Ruthledge,David B.; Kee,Scott David, Distributed circular geometry power amplifier architecture.
  18. Hu, Man-Chun; Kuo, Jinn-Ann; Lin, Wen-Chung, Electrically polar integrated capacitor and method of making same.
  19. Schultz,Richard; Burleson,Jeffrey; Howard,Steven, Fully shielded capacitor cell structure.
  20. Signoff, David M.; Loeb, Wayne A., Ground shield capacitor.
  21. Jing, Jing; Wu, Shuxian; Wu, Zhaoyin D., High quality factor inductive and capacitive circuit structure.
  22. Tang,Denny; Lin,Wen Chin; Lai,Li Shyue; Chen,Chun Hon; Chang,Chung Long, Integrated capacitor.
  23. Quinn, Patrick J., Integrated capacitor with array of crosses.
  24. Quinn, Patrick J., Integrated capacitor with cabled plates.
  25. Quinn, Patrick J., Integrated capacitor with tartan cross section.
  26. Rahim, Irfan; Vest, William Bradley; Wong, Myron Wai, Integrated circuit decoupling capacitors.
  27. Li, Zhi-Qi, Integrated circuit with lateral flux capacitor.
  28. Coolbaugh, Douglas D.; Ding, Hanyi; Eshun, Ebenezer E.; Gordon, Michael D.; He, Zhong-Xiang; Stamper, Anthony K., Integrated parallel plate capacitors.
  29. Wu, Zhaoyin D.; Upadhyaya, Parag; Jiang, Xuewen, Interdigitated capacitor having digits of varying width.
  30. Harris, Edward B.; He, Canzhong; Leung, Che Choi; McNeill, Bruce W., Interdigitated capacitors.
  31. Bang, David, Intertwined finger capacitors.
  32. Aoki, Ichiro; Mohta, Setu; Damgaard, Morten, Low offset envelope detector and method of use.
  33. He, Canzhong; Schuler, John A.; Sharpe, John M.; Vuong, Hong-Ha, Metal capacitor stacked with a MOS capacitor to provide increased capacitance density.
  34. Olewine, Michael Charles; Saiz, Kevin F., Metal-insulator-metal (MIM) capacitor structure and methods of fabricating same.
  35. Olewine, Michael; Saiz, Kevin, Metal-insulator-metal (MIM) capacitor structure and methods of fabricating same.
  36. Anthony, Michael P., Metal-insulator-metal capacitors.
  37. Chen, Shuxian; Watt, Jeffrey T.; Chian, Mojy Curtis, Metal-insulator-metal capacitors.
  38. Marotta, Giulio Giuseppe, Metal-poly integrated capacitor structure.
  39. Marotta,Giulio Giuseppe, Metal-poly integrated capacitor structure.
  40. Marotta,Giulio Giuseppe, Metal-poly integrated capacitor structure.
  41. Rotella,Francis M., Method for fabricating a lateral metal-insulator-metal capacitor.
  42. Drennan, Patrick G., Method for improving capacitor noise and mismatch constraints in a semiconductor device.
  43. Collins,David S.; Ding,Hanyi; Feng,Kai Di; He,Zhong Xiang; Liu,Xuefeng, Method for symmetric capacitor formation.
  44. Kastenmeier, Bernd E.; Evazians, Raman E., Methods of forming semiconductor devices having conductors with different dimensions.
  45. Chen, Shuxian; Watt, Jeffrey T., Multi-segment capacitor.
  46. Chen, Shuxian; Watt, Jeffrey T., Multi-segment capacitor.
  47. Chen, Shuxian; Watt, Jeffrey T., Multi-segment capacitor.
  48. Montagnana,Marco, Multilayer metal structure of supply rings with large parasitic capacitance.
  49. Childs, Michael A.; Fischer, Kevin J.; Natarajan, Sanjay S., On-chip capacitors and methods of assembling same.
  50. Chinthakindi, Anil K.; Thompson, Eric, On-chip decoupling capacitor structures.
  51. Oh, Kyung Suk; Sardana, Charu; Xu, Yanzhong; Chen, Guang, On-die capacitor (ODC) structure.
  52. Komijani, Abbas; Hajimiri, Seyed-Ali; Kee, Scott D.; Aoki, Ichiri, Reconfigurable distributed active transformers.
  53. Komijani, Abbas; Hajimiri, Seyed-Ali; Kee, Scott D.; Aoki, Ichiro, Reconfigurable distributed active transformers.
  54. Komijani,Abbas; Hajimiri,Seyed Ali; Kee,Scott D.; Aoki,Ichiro, Reconfigurable distributed active transformers.
  55. Quinn, Patrick J., Shielding for integrated capacitors.
  56. Kim, Hyunjun; He, Jiangqi; Kim, Joong-Ho; Han, Dong-Ho, Vertical capacitor apparatus, systems, and methods.
  57. Kim,Hyunjun; He,Jiangqi; Kim,Joong Ho; Han,Dong Ho, Vertical capacitor apparatus, systems, and methods.

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