초록 ▼

The present invention provides a thermal energy management architecture for a functioning system of electronic components and subsystems comprising a hierarchical scheme in which thermal management components are: (i) operatively engaged with individual portions of the system of electronic component

The present invention provides a thermal energy management architecture for a functioning system of electronic components and subsystems comprising a hierarchical scheme in which thermal management components are: (i) operatively engaged with individual portions of the system of electronic components and subsystems, in multiple defined levels and (ii) substantially only thermally driven, i.e., heat transfer devices that have no moving parts and require no external power for their operations. In one embodiment thermal management devices and technologies are divided into five separate levels within a functioning electronics system. In another embodiment, a sixth level is provided for bypassing one or more of the five levels.

대표청구항 ▼

1. A thermal energy management architecture for a functioning system of electronic components and subsystems comprising:a first level of heat transfer devices comprising means for thermal energy spreading that are thermally driven and operatively engaged with at least one semiconductor chip; a secon

1. A thermal energy management architecture for a functioning system of electronic components and subsystems comprising:a first level of heat transfer devices comprising means for thermal energy spreading that are thermally driven and operatively engaged with at least one semiconductor chip; a second level of heat transfer devices comprising means for thermal energy spreading that are thermally driven and operatively engaged with at least one semiconductor chip package; a third level of heat transfer devices comprising means for thermal energy transport that are thermally driven and operatively engaged with at least one of said first level or second level means thermal energy spreading; and a fourth level of heat transfer devices comprising means for thermal energy transport that are thermally driven and operatively engaged with at least one of said first level means, second means, or third level means.