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특허 상세정보

Manufacture of void-free laminates and use thereof

특허상세정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) B32B-027/04   
미국특허분류(USC) 428/2981; 428/2974; 428/2987; 428/2991; 428/2997; 428/2951; 428/2934
출원번호 US-0315064 (1999-05-20)
발명자 / 주소
출원인 / 주소
대리인 / 주소
    Fitzpatrick, Cella, Harper & Scinto
인용정보 피인용 횟수 : 57  인용 특허 : 7
초록

The invention provides a method of forming a void-free laminate, comprising the steps of:(a) enclosing a partially impregnated prepreg in a vacuum envelope, said partially impregnated prepreg comprising a fiber layer partially impregnated with a resin composition; and(b) heating said partially impregnated prepreg under vacuum to withdraw air present in said partially impregnated prepreg and to cause said resin composition (i) to fully infuse into said fiber layer and (ii) to cure thereby forming said void-free laminate.The present invention further provi...

대표
청구항

1. A partially impregnated prepreg comprising a fiber layer partially impregnated with a resin composition such that a portion of the fiber layer is not initially contacted with the resin composition, said resin composition being a semi-solid at room temperature and having reduced viscosity at a cure temperature greater than room temperature such that when heated in a vacuum envelope in the absence of autoclave pressure, the resin flows and fully infuses into said fiber layer and cures to form a void-free laminate.

이 특허를 인용한 특허 피인용횟수: 57

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