초록 ▼

Packaging methods suitable for optically linking two silicon chips together for the purpose of optical isolation are shown. These packaging methods rely on the integration of Light Emitting Diodes (LEDs) onto one or both of the silicon chips as well as silicon light detectors. The packaging methods

Packaging methods suitable for optically linking two silicon chips together for the purpose of optical isolation are shown. These packaging methods rely on the integration of Light Emitting Diodes (LEDs) onto one or both of the silicon chips as well as silicon light detectors. The packaging methods include optically linking of side by side silicon chips and vertically stacked chips.

대표청구항 ▼

1. A light coupling device, which is used to couple light between one Si IC die and another Si IC die wherein each die has a top and bottom surface, comprising:a piece of molded plastic wherein the piece comprises the following feature: a light guide, having two ends, that optically couples an LED o

1. A light coupling device, which is used to couple light between one Si IC die and another Si IC die wherein each die has a top and bottom surface, comprising:a piece of molded plastic wherein the piece comprises the following feature: a light guide, having two ends, that optically couples an LED of one of the Si IC die to a light detector of the other Si IC die; a main body; and a support post; wherein a clear insulating layer is deposited on the top surface of each die before coupling the LED to the light detector, and four tabs are used to set a height of the main body with respect to both die.