초록 ▼

The present invention provides an integrated cooling device employing heat pipes for cooling an electronic component and a method of manufacturing the same. In one embodiment, the integrated cooling device includes a plate couplable to and supportable by the electronic component. The plate has at le

The present invention provides an integrated cooling device employing heat pipes for cooling an electronic component and a method of manufacturing the same. In one embodiment, the integrated cooling device includes a plate couplable to and supportable by the electronic component. The plate has at least one channel therein that presents an enhanced surface area. The cooling device further includes a sealed heat pipe having a heat-receiving portion fitted within the channel such that the enhanced surface area in contact with the heat pipe experiences an increased thermal communication between the plate and the heat pipe. The heat pipe also has a heat-removing portion that is distal from the heat receiving portion. Inside the heat pipe, a fluid, initially located in the heat-receiving portion of the heat pipe as a liquid, receives heat and evaporates to form a vapor that travels to the heat-removing portion. In the heat-removing portion of the heat pipe, the vapor condenses and cycles back o the heat-receiving portion.

대표청구항 ▼

1. For use in cooling an electronic component, an integrated cooling device, comprising: a heat sink having a plate couplable to and supportable by said electronic component, said plate having at least one channel therein that presents an enhanced surface area; a sealed and substantially U-shaped h

1. For use in cooling an electronic component, an integrated cooling device, comprising: a heat sink having a plate couplable to and supportable by said electronic component, said plate having at least one channel therein that presents an enhanced surface area; a sealed and substantially U-shaped heat pipe having a heat-receiving portion fitted within said at least one channel to cause said enhanced surface area to contact said heat pipe to increase thermal communication between said plate and said heat pipe, said heat pipe further having a heat-removing portion distal from said heat receiving portion; a cooling fan coupled to and supported by said heat sink and interposed between said heat receiving portion and said heat-removing portion of said heat pipe; and a fluid, initially located in said heat-receiving portion as a liquid, configured to receive heat via said enhanced surface area, evaporate to form a vapor, travel to said heat-removing portion, condense in said heat-removing portion and cycle back to said heat-receiving portion.