이 특허에 인용된 특허 (7) 인용/피인용 타임라인 분석

1. Myers Alan M. (Hillsboro OR) Charvat Peter K. (Portland OR) Letson Thomas A. (Beaverton OR) Yang Shi-ning (Portland OR) Bai Peng (Aloha OR), Anchored via connection.

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2. Dupraz Jean-Pierre (Lyons FRX) Gris Jean-Paul (Lyons FRX) Trenchat Daniel (Tignieu Jameyzieu FRX), Capacitor having high stability with temperature.

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3. Warren Keith O. (Newbury Park CA), Electrode structure and method for anodically-bonded capacitive sensors.

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4. Smith Donald Leonard ; Alimonda Andrew Sebastian, Method for forming a spring contact.

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5. Smith Donald L. (Palo Alto CA) Alimonda Andrew S. (Los Altos CA), Photolithographically patterned spring contact.

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6. Smith Donald Leonard ; Alimonda Andrew Sebastian, Photolithographically patterned spring contact.

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7. Cowen Allen Bruce ; Dhuler Vijayakumar Rudrappa ; Hill Edward Arthur ; Koester David Alan ; Mahadevan Ramaswamy, Variable capacitor and associated fabrication method.

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이 특허를 인용한 특허 (43) 인용/피인용 타임라인 분석

1. Takai, Daisuke; Soeta, Kaoru, Connection unit between substrated and component and method for fabricating connection unit.

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2. Mok, Sammy; Chong, Fu Chiung, Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies.

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3. Appleby,Michael; Fraser,Iain; Atkinson,James E., Devices, methods, and systems involving castings.

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4. Appleby,Michael; Fraser,Iain; Atkinson,James E., Devices, methods, and systems involving castings.

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5. Musolf, Jurgen; Kohl, Paul, Electrostatic actuators with intrinsic stress gradient.

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6. Haemer,Joseph Michael; Chong,Fu Chiung; Modlin,Douglas N., Enhanced compliant probe card systems having improved planarity.

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7. Bottoms, Wilmer R.; Chong, Fu Chiung; Mok, Sammy; Modlin, Douglas, High density interconnect system for IC packages and interconnect assemblies.

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8. Chong, Fu Chiung; Kao, Andrew; McKay, Douglas; Litza, Anna; Modlin, Douglas; Mok, Sammy; Parekh, Nitin; Swiatowiec, Frank John; Shan, Zhaohui, High density interconnect system having rapid fabrication cycle.

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9. Chong, Fu Chiung; Kao, Andrew; McKay, Douglas; Litza, Anna; Modlin, Douglas; Mok, Sammy; Parekh, Nitin; Swiatowiec, Frank John; Shan, Zhaohui, High density interconnect system having rapid fabrication cycle.

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10. Chong,Fu Chiung; Kao,Andrew; McKay,Douglas; Litza,Anna; Modlin,Douglas; Mok,Sammy; Parekh,Nitin; Swiatowiec,Frank John; Shan,Zhaohui, High density interconnect system having rapid fabrication cycle.

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11. Depetro, Riccardo; Manzini, Stefano, High-Q, variable capacitance capacitor.

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12. Van Schuylenbergh, Koenraad; Chow, Eugene M.; Lu, JengPing, Integrateable capacitors and microcoils and methods of making thereof.

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13. Chow, Eugene M., Interposer with microspring contacts.

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14. Reid, Jr.,James R., Low cost digital variable capacitor.

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15. Fork, David K.; Mei, Ping; Van Schuylenbergh, Koenraad F., Low cost integrated out-of-plane micro-device structures and method of making.

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16. Cohn, Michael Bennett; Xu, Ji-Hai, MEMS device with integral packaging.

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17. Stokes, Robert B., MEMS variable inductor and capacitor.

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18. Chong, Fu Chiung; Mok, Sammy, Massively parallel interface for electronic circuit.

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19. Chong,Fu Chiung; Mok,Sammy, Massively parallel interface for electronic circuit.

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20. Fork, David K.; Mei, Ping; Van Schuylenbergh, Koenraad F., Method of forming an out-of-plane structure.

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21. Musolf, Jurgen; Kohl, Paul, Method of making an electrostatic actuator.

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22. Fork, David K.; Chua, Christopher L., Method of making low cost integrated out-of-plane micro-device structures.

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23. Chua,Christopher L.; Lemmi,Francesco; Van Schuylenbergh,Koenraad F.; Lu,Jeng Ping; Fork,David K.; Peeters,Eric; Sun,Decai; Smith,Donald L.; Romano,Linda T., Method of making photolithographically-patterned out-of-plane coil structures.

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24. Chow, Eugene M., Method of producing an interposer with microspring contacts.

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25. Appleby, Michael P.; Fraser, Iain; Atkinson, James E., Methods for manufacturing three-dimensional devices and devices created thereby.

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26. Appleby, Michael P.; Fraser, Iain; Atkinson, James E., Methods for manufacturing three-dimensional devices and devices created thereby.

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27. Appleby, Michael P.; Fraser, Iain; Atkinson, James E., Methods for manufacturing three-dimensional devices and devices created thereby.

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28. Appleby,Michael P.; Fraser,Iain; Atkinson,James E., Methods for manufacturing three-dimensional devices and devices created thereby.

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29. Scott Halden Goodwin-Johansson, Microelectromechanical elevating structures.

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30. Mei, Ping; Sun, Decai; Street, Robert A., Microelectromechanical system based sensors, sensor arrays, sensing systems, sensing methods and methods of fabrication.

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31. Chow, Eugene M.; Shrader, Eric J.; Paschkewitz, John S., Microspring structures adapted for target device cooling.

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32. Chow, Eugene M.; Peeters, Eric, Microsprings partially embedded in a laminate structure and methods for producing same.

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33. Chua, Christopher L.; Peeters, Eric; Van Schuylenbergh, Koenraad F.; Smith, Donald L., Photolithographically-patterned variable capacitor structures and method of making.

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34. Chua, Christopher L.; Peeters, Eric; Van Schuylenbergh, Koenraad F.; Smith, Donald L., Photolithographically-patterned variable capacitor structures and method of making.

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35. Hantschel, Thomas; Fork, David K.; De Bruyker, Dirk; Shih, Chinnwen; Lu, Jeng Ping; Chua, Christopher L.; Apte, Raj B.; Krusor, Brent S., Release height adjustment of stressy metal devices by annealing before and after release.

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36. Ikehashi,Tamio, Semiconductor device using piezoelectric actuator formed by use of MEMS technique.

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37. Appleby, Michael P.; Randolph, William T.; Klinger, Jill E., Systems for large area micro mechanical systems.

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38. Mok, Sammy; Chong, Fu Chiung; Milter, Roman, Systems for testing and packaging integrated circuits.

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39. Appleby, Michael P.; Fraser, Iain; Paulus, John, Systems, devices, and/or methods for manufacturing castings.

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40. Appleby, Michael; Fraser, Iain; Paulus, John, Systems, devices, and/or methods for manufacturing castings.

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41. Appleby, Michael; Paulus, John; Fraser, Iain; Klinger, Jill; Heneveld, Benjamin, Systems, devices, and/or methods for producing holes.

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42. Chan, Edward; Wen, Bing, Thermomechanical device for measuring electromagnetic radiation.

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43. Hantschel, Thomas; Chow, Eugene M., Vertically spaced plural microsprings.

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