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Electrical connector 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-003/30
출원번호 US-0652922 (2000-08-31)
발명자 / 주소
  • David R. Hembree
출원인 / 주소
  • Micron Technology, Inc.
대리인 / 주소
    TraskBritt
인용정보 피인용 횟수 : 34  인용 특허 : 24

초록

In a socket used to house semiconductor die during testing, a recessed socket contact is provided that avoids pinching the die's contacts. Also provided are socket contacts that allow for smaller socket holes and, therefore, denser arrays of socket contacts. In one embodiment, the body of the socket

대표청구항

1. A method for enabling electrical communication between an IC chip and a printed circuit board having an aperture therethrough, comprising:providing a metal tube, said metal tube having a sidewall extending the length of said metal tube, said sidewall having one of at least one aperture therein an

이 특허에 인용된 특허 (24)

  1. Grabbe Dimitry (2160 Rosedale Ave. Middletown PA 17057), Ball grid array socket.
  2. Affolter Hugo,CHX ; Haffter Christoph,CHX, Connection base.
  3. Chang Pierce,TWX, Connector with high-densely arranged terminals for connecting to working element and printed circuit board through LGA type connection.
  4. Kazama Toshio,JPX, Electric contact unit.
  5. Honn ; James J. ; Stuby ; Kenneth P., Electrical package for LSI devices and assembly process therefor.
  6. Sato Kazumasa (Yokohama JPX) Kokubu Akihiko (Yokohama JPX), IC socket.
  7. Farnworth Warren M. ; Gochnour Derek ; Akram Salman, Interconnect having recessed contact members with penetrating blades for testing semiconductor dice and packages with co.
  8. Werther William E. (Glen Cove NY), Interconnection package suitable for electronic devices and methods for producing same.
  9. Fredrickson Toby Alan, Interface structure for an integrated circuit device tester.
  10. Johnson Timothy L. ; Knapp James H. ; Laninga Albert J., Material transfer apparatus and method of using the same.
  11. Akram Salman ; Farnworth Warren M. ; Wood Alan G., Method for fabricating a semiconductor interconnect with laser machined electrical paths through substrate.
  12. Cheng Hing-Liang (Taipei TWX), Method for manufacturing a circuit board with a plurality of conductive terminal pins.
  13. Knodler Dieter,DEX, Method for manufacturing electrically conductive lead-throughs in metallized plastic housings.
  14. Guran Orest D. ; Wood Donald E. ; Middlehurst Richard J., Method of manufacturing an array of surface mount contacts.
  15. Otto James C. (Indian Harbour Beach FL) Jones Herman A. (Melbourne FL), Multilayer circuit prototyping board.
  16. Brown Candice H. (San Jose CA), Process of making a semiconductor device having parallel leads directly connected perpendicular to integrated circuit la.
  17. Butler Douglas (Colorado Springs CO), Sealed self aligned contacts using two nitrides process.
  18. McKenzie ; Jr. Joseph A. (6330 Laura La. Pleasanton CA 94566), Self-masking socket pin carrier for printed circuit boards.
  19. Hirano Hirokazu (Oomiya JPX) Yamaki Bunshiro (Fujisawa JPX), Semiconductor sensor including an aperture having a funnel shaped section intersecting a second section.
  20. Matsumura Shigeru,JPX, Socket for measuring a ball grid array semiconductor.
  21. Jones Robert E. (Saint Peters MO), Surface mounted component adaptor for interconnecting of surface mounted circuit components.
  22. Hembree David R., Test carrier for packaging semiconductor components having contact balls and calibration carrier for calibrating semiconductor test systems.
  23. Swart Mark A. ; Johnston Charles J. ; Vinther Gordon A. ; Sargeant Steve B., Test socket.
  24. Sinclair William Y., Universal production ball grid array socket.

이 특허를 인용한 특허 (34)

  1. Brown,Dirk D.; Williams,John D.; Radza,Eric M., Connector for making electrical contact at semiconductor scales.
  2. Dittmann,Larry E., Connector having staggered contact architecture for enhanced working range.
  3. Dittmann, Larry E., Contact and method for making same.
  4. Williams,John David, Contact grid array system.
  5. Dittmann,Larry E., Deep drawn electrical contacts and method for making.
  6. Akram, Salman; Hembree, David R.; Farnworth, Warren M., Electrical connector.
  7. Light, David Noel; Kalakkad, Dinesh Sundararajan; Nguyen, Peter Tho, Electrical connector and method of making it.
  8. Dittmann, Larry E., Electrical connector having a flexible sheet and one or more conductive connectors.
  9. Light, David Noel; Wang, Hung-Ming; Baker, David Rodney; Nguyen, Peter Tho; Pao, Dexter Shih-Wei, Electrical connector with electrical contacts protected by a layer of compressible material and method of making it.
  10. Nelson, John E.; Sherry, Jeffrey C.; Alladio, Patrick J.; Oberg, Russell F.; Warwick, Brian; Michalko, Gary W., Electrically conductive pins for microcircuit tester.
  11. Nelson, John E.; Sherry, Jeffrey C.; Alladio, Patrick J.; Oberg, Russell F.; Warwick, Brian; Michalko, Gary W., Electrically conductive pins for microcircuit tester.
  12. Nelson, John E.; Sherry, Jeffrey C.; Warwick, Brian; Michalko, Gary W., Electrically conductive pins for microcircuit tester.
  13. Nelson, John E.; Sherry, Jeffrey C.; Warwick, Brian; Michalko, Gary W., Electrically conductive pins for microcircuit tester.
  14. Dittmann,Larry E., Interposer with compliant pins.
  15. Dittmann,Larry E., Interposer with compliant pins.
  16. Chien, Ray, LGA to PGA package adapter.
  17. Radza, Eric M.; Williams, John D., Method and system for batch forming spring elements in three dimensions.
  18. Brown, Dirk Dewar; Williams, John David; Long, William B.; Chen, Tingbao, Method and system for batch manufacturing of spring elements.
  19. Dittmann,Larry E., Method for fabricating a connector.
  20. Williams, John D., Method for fabricating a contact grid array.
  21. Akram, Salman; Farnworth, Warren M., Method of forming recessed socket contacts.
  22. Farnworth, Warren M., Method of forming socket contacts.
  23. Farnworth,Warren M., Method of forming socket contacts.
  24. Williams, John D., Method of making electrical connector on a flexible carrier.
  25. Akram, Salman; Hembree, David R.; Farnworth, Warren M., Methods for the fabrication of electrical connectors.
  26. Nelson, John E.; Sherry, Jeffrey C.; Alladio, Patrick J.; Oberg, Russell F.; Warwick, Brian; Michalko, Gary W., Microcircuit tester with slideable electrically conductive pins.
  27. Kirby, Kyle K., Probe card for use with microelectronic components, and methods for making same.
  28. Petit, Luc; Castellane, Alexandre, Process for producing electrical-connections on a semiconductor package, and semiconductor package.
  29. Akram,Salman; Farnworth,Warren M., Process of forming socket contacts.
  30. Nelson, John E.; Sherry, Jeffrey C.; Warwick, Brian; Michalko, Gary W., Resilient interposer with electrically conductive slide-by pins as part of a microcircuit tester.
  31. Williams, John David; Radza, Eric Michael, Spring connector for making electrical contact at semiconductor scales.
  32. Brown, Dirk D.; Williams, John D.; Long, William B., Structure and process for a contact grid array formed in a circuitized substrate.
  33. Dittmann, Larry E.; Williams, John David; Long, William B., System and method for connecting flat flex cable with an integrated circuit, such as a camera module.
  34. Dittmann, Larry E.; Williams, John D.; Long, William B., System for connecting a camera module, or like device, using flat flex cables.
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