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특허 상세정보

Thermoelectric cooling system

국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) F25B-021/02   
미국특허분류(USC) 62/0037; 62/0036; 62/4578
출원번호 US-0947787 (2001-09-06)
발명자 / 주소
대리인 / 주소
    Robert Ryan Morishita
인용정보 피인용 횟수 : 62  인용 특허 : 3
초록

A thermoelectric cooling system includes a control assembly and a direct current ("d.c.") power source providing direct current to an interface that creates a thermal flow across a thermoelectric module having at least one heat sink and at least one heat source. The d.c. power source, the interface, the control assembly, and the thermoelectric module are connected to each other in series. The control assembly optionally includes a relay and a voltage generating thermocouple. When voltage from the thermocouple reaches a predetermined threshold, the relay ...

대표
청구항

1. A thermoelectric cooling system comprising:a housing; a thermoelectric module comprising at least one heat sink and at least one heat source, said heat source comprising a load and a first body spaced from said load such that the first body is insulated from direct thermal association with the load; an interface intermediate the first body and the heat sink such that the first body, the interface, and the heat sink are mechanically connected in series, the first body absorbing heat from the air surrounding said load and the heat being transferred thro...

이 특허를 인용한 특허 피인용횟수: 62

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