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A power electronics cooling housing for use in a power electronics system. The power electronics cooling housing has a body with a coolant cavity formed in one surface and a capacitor bus assembly potting cavity formed in an opposite surface. A bus bar passthrough opening is formed through the body.

A power electronics cooling housing for use in a power electronics system. The power electronics cooling housing has a body with a coolant cavity formed in one surface and a capacitor bus assembly potting cavity formed in an opposite surface. A bus bar passthrough opening is formed through the body. The bus bar passthrough opening provides an opening from the coolant cavity and the capacitor bus assembly potting cavity. A coolant inlet manifold having a coolant cavity inlet and a coolant outlet manifold having a coolant cavity outlet are formed in the body that are coupled to respective ends of the coolant cavity. An environmental sealing gasket surrounds the coolant cavity.

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1. A power electronics cooling housing comprising:a body having a coolant cavity formed in one surface and having a capacitor bus assembly potting cavity formed in an opposite surface and a capacitor bus assembly potting located in the capacitor bus assembly potting cavity; a bus bar passthrough ope

1. A power electronics cooling housing comprising:a body having a coolant cavity formed in one surface and having a capacitor bus assembly potting cavity formed in an opposite surface and a capacitor bus assembly potting located in the capacitor bus assembly potting cavity; a bus bar passthrough opening formed through the body and a bus bar located in the bus bar passthrough; a coolant inlet manifold having a coolant cavity inlet and a coolant outlet manifold having a coolant cavity outlet formed in the body that are coupled to respective ends of the coolant cavity; and an environmental sealing gasket surrounding the coolant cavity.