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Method for treating a substrate with heat sensitive agents 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C23G-001/02
출원번호 US-0312775 (1999-05-14)
발명자 / 주소
  • Steven L. Nelson
  • Kurt K. Christenson
출원인 / 주소
  • FSI International, Inc.
대리인 / 주소
    Kagan Binder, PLLC
인용정보 피인용 횟수 : 17  인용 특허 : 58

초록

The present invention provides a method for treating a substrate, or a plurality of substrates, so that the treatment thereof is enhanced. In particular, the method includes the steps of causing a heated liquid to contact the substrate(s) and causing a processing liquid to contact the substrate(s).

대표청구항

1. A method of treating a substrate comprising the steps ofcausing a heated liquid to contact the substrate in a manner effective to heat at least a portion of the substrate; and causing a processing liquid to contact the heated substrate, wherein the processing liquid comprises a heat sensitive age

이 특허에 인용된 특허 (58)

  1. Bergman Eric J. ; Hess Mignon P., Apparatus and method for processing the surface of a workpiece with ozone.
  2. Bergman Eric J. ; Hess Mignon P., Apparatus and method for processing the surface of a workpiece with ozone.
  3. Ury Michael G. (Bethesda MD) Matthews John C. (Gaithersburg MD) Rounds Stuart N. (Germantown MD), Apparatus for photoresist stripping.
  4. Matthews Robert Roger, Apparatus for the treatment of semiconductor wafers in a fluid.
  5. Mashimo Noriyoshi (Tokyo JPX) Okumura Katsuya (Yokohama JPX), Arrangement for cleaning semiconductor wafers using mixer.
  6. Aigo Seiichiro (3-15-13 ; Negishi ; Daito-ku Tokyo JPX), Bubbler device for washing semiconductor materials.
  7. Nakajima Kazuo (Shiga-ken JPX) Tanaka Katsunori (Shiga-ken JPX), Chemical agent producing device and method thereof.
  8. Louthan Rector P. (Bartlesville OK), Combination reaction vessel and aspirator-mixer.
  9. Rees Darci L. (4431 Jay St. Duluth MN 55802) George Michael (4431 Jay St. Duluth MN 55802), Continuous process and apparatus for generation of ozone for industrial application with cryogenic refrigeration.
  10. Page John K. R. (Camberley GBX) Kalthod Dilip G. (St. Louis MO), Control of dissolved gases in liquids.
  11. Schick Robert P. (Amherst NY), Cooling water ozonation system.
  12. Jackson David P. (Saugus CA), Dense fluid photochemical process for substrate treatment.
  13. Yoneda Kenji,JPX, Equipment for cleaning, etching and drying semiconductor wafer and its using method.
  14. Wiesmann Rudolf (Gossau CHX), Equipment for gassing a liquid and process for operating the equipment.
  15. Ohno, Reiko; Matsuoka, Terumi, Film removing method and film removing agent.
  16. Park Jin Y. (Moscow ID), Fine line pattern formation by aerosol centrifuge etching technique.
  17. Reid Philip L. (Rte. 2 ; Box 422 Duncan SC 29334), Gas humidification apparatus.
  18. Tremont Peter L. (Spring TX) Ackermann Arthur J. (Kirkwood MO), Integrated circuit manufacturing process.
  19. Clark R. Scot (Fallbrook CA) Baird Stephen S. (Vista CA) Hoffman Joe G. (Cardiff-By-The-Sea CA), Manufacture of high precision electronic components with ultra-high purity liquids.
  20. Clark R. Scot ; Baird Stephen S. ; Hoffman Joe G., Manufacture of high precision electronic components with ultra-high purity liquids.
  21. Murphy Oliver J. (Bryan TX) Hitchens G. Duncan (Bryan TX), Method and apparatus for electrochemical production of ozone.
  22. Omi Tadahiro (Miyagi JPX) Shimada Makoto (Tokyo JPX) Sawamoto Isao (Kanagawa JPX), Method and apparatus for sterilization of and treatment with ozonized water.
  23. Johnson Dennis E. J. (1025 Garfield Ave. Aurora IL 60506), Method and device for in-line mass dispersion transfer of a gas flow into a liquid flow.
  24. Inoue Makoto (Yokohama JPX), Method for manufacturing an oxide of semiconductor.
  25. Matthews John C. (Gaithersburg MD) Wooten Robert D. (Rockville MD) Ferris David S. (Washington DC) Rounds Stuart N. (Germantown MD), Method for photoresist stripping using reverse flow.
  26. Kashiwase Masaharu (Okayama JPX) Matsuoka Terumi (Okayama JPX), Method for removing organic film.
  27. Goffredo Daniel L. (Riverton NJ) Shakely Conrad Dale (Spring Mills PA), Method for treatment fluid application and removal.
  28. Aoki Hidemitsu (Tokyo JPX) Morita Makoto (Tokyo JPX) Tsuji Mikio (Tokyo JPX), Method for wet processing of a semiconductor substrate.
  29. Brock James R. (Austin TX) Trachtenberg Isaac (Austin TX), Method of aerosol jet etching.
  30. Nagahiro Jinzo (54-24 ; Wakamiya 2-chome Nakano-ku ; Tokyo JPX) Higuchi Ken (Saitama JPX) Ohama Yasunori (Saitama JPX), Method of and apparatus for producing a high concentration ozone water solution.
  31. Koizumi Kootaroo (Kodaira JPX) Tsunekawa Sukeyoshi (Tokorozawa JPX) Kawasumi Kenichi (Oume JPX) Kimura Takeshi (Higashimurayama JPX) Funatsu Keisuke (Hamura JPX), Method of and apparatus for removing an organic film.
  32. Pittner Gregory A. (Yorba Linda CA) Crabtree Larry L. (Lincolnshire IL), Method of preferentially removing oxygen from ozonated water.
  33. Ikeda Akira (Hyogo JPX) Nakatsugawa Naoki (Hyogo JPX) Yoshimura Yumiko (Hyogo JPX) Tanimura Yasuhiro (Hyogo JPX) Ezaki Kenji (Hyogo JPX), Microorganism removing method.
  34. Carter Lawrence E. ; Nelson Steven L., Organic removal process.
  35. Bullock Donald (31 Logging Hill Rd. Concord NH 03301), Oxidation saturation device.
  36. Frosch Robert A. Administrator of the National Aeronautics and Space Administration ; with respect to an invention of ( Duarte CA) Humphrey Marshall F. (Duarte CA) French Kenneth R. (La Canada CA) Ho, Ozonation of cooling tower waters.
  37. Wasinger Eric (551 Boyd St. Wichita KS 67212) Hall David (Auburn AL 36830), Ozone decolorization of garments.
  38. Wong Sik-Lam ; Shea James Howard, Ozone generator with enhanced output.
  39. Sawamoto Isao (Kanagawa JPX), Ozone water treatment method and apparatus.
  40. Schellenberger Wilhelm,DEX ; Herrmannsdorfer Dieter,DEX, Procedure for the drying of silicon.
  41. Schwarzl Karl (Mitterndorf-Traukirchen AUX), Process and an arrangement for preparing ozonic gases and solutions.
  42. Sawamoto Isao (Kanagawa JPX) Nishiki Yoshinori (Kanagawa JPX), Process and apparatus for producing high concentrating ozone water.
  43. Matthews Robert R. (Richmond CA), Process and apparatus for the treatment of semiconductor wafers in a fluid.
  44. Damann Franz-Josef (21 ; Dammstrasse D-4791 Lichtenau-Henglarn DEX), Process and device for the dissolution of gas in liquid.
  45. Sugino Rinshi (Atsugi JPX) Ito Takashi (Kawasaki JPX), Process for cleaning surface of semiconductor substrate.
  46. Lampert Ingolf (Burghausen DEX) Gratzl Christa (Neuotting DEX), Process for the wet-chemical surface treatment of semiconductor wafers.
  47. Ross ; Edward A., Saturated liquid/vapor generating and dispensing.
  48. Ross Edward Alan (Willowdale CA), Saturated liquid/vapor generating and dispensing.
  49. Kodera Masako (Matsudo JPX) Watanabe Tohru (Yokohama JPX) Okumura Katsuya (Yokohama JPX), Semiconductor wafer carrier having a dust cover.
  50. Mann Reginald (19 Heath Road Glossop ; Derbyshire SK13 9AY GB2), Separation of gaseous mixtures.
  51. Molinaro James S. (Coplay PA), Sparger plate for ozone gas diffusion.
  52. Liu Benjamin Y. H. (North Oaks MN) Ahn Kang H. (Minneapolis MN), System for surface and fluid cleaning.
  53. Nelson Steven L. ; Christenson Kurt K., System to increase the quantity of dissolved gas in a liquid and to maintain the increased quantity of dissolved gas in.
  54. Faivre Michel,FRX ; Martin Nathalie,FRX ; Boisdon Vincent,FRX, Unit for the treatment of water by ozonization, and a corresponding installation for the production of ozonized water.
  55. Partus Fred P. (Cobbs County GA), Vapor delivery control system and method.
  56. Partus Fred P. (Atlanta GA), Vapor delivery system and method.
  57. Moy, Timothy Y., Vapor generator and its use in generating vapors in a pressurized gas.
  58. McMenamin Joseph C. (Fresno CA), Vapor mass flow control system.

이 특허를 인용한 특허 (17)

  1. Christenson, Kurt Karl; Hanestad, Ronald J.; Ruether, Patricia Ann; Wagener, Thomas J., Apparatus for removing material from one or more substrates.
  2. Sapra, Sanjeev; Chen, Cheng-Shun; Tsai, Hung-Ming; Yang, Sheng-Wei, Methods of forming bulb-shaped trenches in silicon.
  3. Bergman,Eric J., Process and apparatus for treating a workpiece with gases.
  4. Nelson, Steven L., Process for increasing the hydrophilicity of silicon surfaces following HF treatment.
  5. Lauerhaas, Jeffrey M., Process for removing carbon material from substrates.
  6. Christenson, Kurt Karl; Hanestad, Ronald J.; Ruether, Patricia Ann; Wagener, Thomas J., Process for removing material from substrates.
  7. Christenson, Kurt Karl; Hanestad, Ronald J.; Ruether, Patricia Ann; Wagener, Thomas J., Process for removing material from substrates.
  8. Ratkovich, Anthony S.; Butterbaugh, Jeffery W.; Becker, David Scott, Process for selectively removing nitride from substrates.
  9. Christenson, Kurt K.; DeKraker, David, Process for treatment of semiconductor wafer using water vapor containing environment.
  10. DeKraker, David; Butterbaugh, Jeffery W.; Williamson, Richard E., Process for treatment of substrates with water vapor or steam.
  11. DeKraker, David; Butterbaugh, Jeffery W.; Williamson, Richard E., Process for treatment of substrates with water vapor or steam.
  12. Bergman,Eric J., Processing a workpiece using water, a base, and ozone.
  13. Verhaverbeke,Steven, Rotational thermophoretic drying.
  14. Gilton, Terry L.; Li, Li, Semiconductor fabrication methods and apparatus.
  15. Davis, Jeffry A.; Dolechek, Kert L.; Curtis, Gary L., Semiconductor wafer processing apparatus.
  16. Takemura, Makoto; Fukuda, Yasuo; Souda, Kazuaki; Iwahashi, Junichiro; Okuda, Koichi, Semiconductor wafer treatment method and apparatus therefor.
  17. Bergman,Eric J.; Gebhart,Thomas Maximilian, System and methods for polishing a wafer.
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