이 특허에 인용된 특허 (20) 인용/피인용 타임라인 분석

1. Lewis David A. (Carmel NY) Narayan Chandrasekhar (Hopewell Junction NY), Device to monitor and control the temperature of electronic chips to enhance reliability.

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2. Shakouri Ali ; Bowers John E., Heterostructure thermionic coolers.

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3. Meissner Edward G., Integrated circuit package having a thermoelectric cooling element therein.

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4. Miller Joel (14340 Trinidad Rd. San Leandro CA 94577), Laminated thermo element.

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5. Schmidt William L. (Acton MA) Olson Richard E. (Rindge NH) Solley Dennis J. (Windham NH), Localized cooling apparatus for cooling integrated circuit devices.

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6. Paige David F., Microfabricated silicon thermopile sensor.

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7. Chi Cheng-Chung John,TWX ; Huebener Rudolf Peter,DEX ; Tsuei Chang Chyi, On-chip Peltier cooling devices on a micromachined membrane structure.

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8. Ghoshal Uttam Shyamalindu, Solid state thermal switch.

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9. Imanishi Yuichiro,JPX ; Miyoshi Makoto,JPX ; Watanabe Tetsuo,JPX ; Kushibiki Keiko,JPX ; Shinohara Kazuhiko,JPX ; Kobayashi Masakazu,JPX ; Furuya Kenji,JPX, Thermoelectric conversion module having channels filled with semiconducting material and insulating fillers.

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10. Yamamura Akira (c/o Nippon Ferrofluidics Corporation ; 17-22 ; Akasaka 2-chome Minato-ku ; Tokyo ; 107 MA JPX) Baldwin John (c/o International Thermoelectric Incorporated ; 131 Stedman St. Chelmsford, Thermoelectric conversion module with series connection.

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11. Kishi Matsuo,JPX ; Nemoto Hirohiko,JPX ; Okano Hiroshi,JPX, Thermoelectric device.

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12. Kishi Matsuo,JPX ; Nemoto Hirohiko,JPX ; Okano Hiroshi,JPX, Thermoelectric device.

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13. Macris Chris, Thermoelectric device and method of manufacture.

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14. Sakuragi Shiro,JPX, Thermoelectric element and cooling or heating device provided with the same.

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15. Koyanagi Tadamasa (Yasatomachi JPX) Oohira Tsunehiro (Tsukuba JPX), Thermoelectric element sheet in which thermoelectric semiconductors are mounted between films.

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16. Fritz Robert E. (2041 Vista Del Mar San Mateo CA 94404) Monkowski Joseph R. (1850 Lawrence Rd. Danville CA 94506), Thermoelectric module having reduced spacing between semiconductor elements.

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17. Yokotani Youichirou (Osaka JPX) Kugimiya Kouichi (Osaka JPX) Ando Hamae (Osaka JPX), Thermoelectric semiconductor having a porous structure deaerated in a vacuum and thermoelectric panel using p-type and n.

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18. Yokotani Youichirou (Suita JPX) Kugimiya Kouichi (Toyonaka JPX) Ando Hamae (Neyagawa JPX), Thermoelectric semiconductor having a porous structure deaerated in a vacuum and thermoelectric panel using p-type and n.

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19. Tsuno Katsuhiro,JPX ; Tosho Tsuyoshi,JPX ; Watanabe Hideo,JPX, Thermoelectric semiconductor having a sintered semiconductor layer and fabrication process thereof.

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20. Hidaka Norio,JPX, Thermoelectric system using semiconductor.

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이 특허를 인용한 특허 (73) 인용/피인용 타임라인 분석

1. Ghaffari, Roozbeh; Lee, Stephen; Work, John; Wright, Jr., John A.; Klinker, Lauren, Catheter or guidewire device including flow sensing and use thereof.

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2. Ghaffari, Roozbeh; Lee, Stephen; Work, John; Wright, Jr., John A.; Klinker, Lauren, Catheter or guidewire device including flow sensing and use thereof.

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3. Hershberger, Jeffrey Gerard; Hill, Richard F.; Smythe, Robert Michael; Sutsko, Michael G., Circuit assemblies including thermoelectric modules.

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4. Hershberger, Jeffrey Gerard; Hill, Richard F.; Smythe, Robert Michael; Sutsko, Michael G., Circuit assemblies including thermoelectric modules.

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5. Lofy, John, Climate controlled seating assembly with sensors.

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6. Lofy, John, Condensation and humidity sensors for thermoelectric devices.

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7. Lofy, John D., Condensation and humidity sensors for thermoelectric devices.

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8. Huppert, Gilbert Lee; Ghaffari, Roozbeh; Ceruolo, Melissa; Keen, Bryan; Raj, Milan; McGrane, Bryan, Conformal sensor systems for sensing and analysis of cardiac activity.

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9. Huppert, Gilbert Lee; Ghaffari, Roozbeh; Ceruolo, Melissa; Keen, Bryan; Raj, Milan; McGrane, Bryan, Conformal sensor systems for sensing and analysis of cardiac activity.

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10. Prasher, Ravi, Cooling an integrated circuit die with coolant flow in a microchannel and a thin film thermoelectric cooling device in the microchannel.

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11. Liu, Yu-Ching; Yu, Chi-An; Li, Xi-Hang; Liu, Bing; Xu, Bo; Kang, Jie-Peng, Cooling device for cooling electronic components.

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12. Makansi, Tarek; Wood, Steve; Franklin, John L.; Evers, Mark N., Distributed thermoelectric string and insulating panel.

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13. Li, Xia; Dalal, Mitul; Huppert, Gilbert Lee; Gupta, Sanjay, Electronic device having antenna.

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14. Rafferty, Conor; Dalal, Mitul, Embedding thin chips in polymer.

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15. Dai, Ming Ji; Liu, Chun Kai; Yu, Chih Kuang; Wu, Shih Hsien, Encapsulation and methods thereof.

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16. Kasichainula, Sridhar, Energy harvesting for wearable technology through a thin flexible thermoelectric device.

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17. Brykalski, Michael J.; Terech, John; Petrovski, Dusko, Environmentally-conditioned bed.

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18. Brykalski, Michael J.; Terech, John; Petrovski, Dusko, Environmentally-conditioned bed.

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19. Arora, William J.; Ghaffari, Roozbeh, Extremely stretchable electronics.

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20. Hershberger, Jeffrey Gerard; Hill, Richard F.; Roser, Richard I., Flexible assemblies with integrated thermoelectric modules suitable for use in extracting power from or dissipating heat from fluid conduits.

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21. Dalal, Mitul; Gupta, Sanjay, Flexible electronic circuits with embedded integrated circuit die.

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22. Bell, Lon E., Flexible thermoelectric circuit.

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23. Yu, Chih-Kuang; Liu, Chun-Kai; Dai, Ming-Ji, Flexible thermoelectric device.

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24. Petrovski, Dusko, Heating and cooling systems for seating assemblies.

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25. Moczygemba, Joshua E.; Bierschenk, James L.; Sharp, Jeffrey W., High temperature thermoelectrics.

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26. Makansi, Tarek; Berman, Michael J.; Franklin, John Latimer; Evers, Mark Nelsen; Wood, Steven, Integration of distributed thermoelectric heating and cooling.

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27. Makansi, Tarek; Wood, Steven; Berman, Michael J.; Evers, Mark Nelsen; Franklin, John L.; Thomson, Steve, Medical, topper, pet wireless, and automated manufacturing of distributed thermoelectric heating and cooling.

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28. Aguirre, Mario; Scullin, Matthew L., Method and structure for thermoelectric unicouple assembly.

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29. Aguirre, Mario; Scullin, Matthew L., Method and structure for thermoelectric unicouple assembly.

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30. Petrovski, Dusko; Zheng, Sihai; Maass, Michael, Method and system for controlling an operation of a thermoelectric device.

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31. Graff, Bassel de; Callsen, Gilman; Arora, William J.; Ghaffari, Roozbeh, Methods and applications of non-planar imaging arrays.

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32. Ghaffari, Roozbeh; Callsen, Gilman; Arora, William J.; Schlatka, Benjamin, Methods of detecting parameters of a lumen.

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33. Koester, David A.; Alley, Randall G., Methods of forming embedded thermoelectric coolers with adjacent thermally conductive fields.

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34. O'Quinn, Brooks; Venkatasubramanian, Rama; Siivola, Edward, Methods of forming thermoelectric devices including conductive posts and/or different solder materials and related methods and structures.

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35. Alley, Randall G.; Koester, David A., Methods of forming thermoelectric devices including electrically insulating matrices between conductive traces.

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36. Bharathan, Jayesh; Koester, David A.; Alley, Randall G.; Venkatasubramanian, Rama; Addepalli, Pratima; Shen, Bing; Watkins, Cynthia, Methods of forming thermoelectric devices using islands of thermoelectric material and related structures.

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37. Lorimer, Adam; Scullin, Matthew L.; Sura, Sravan Kumar R.; Hannemann, Christopher, Modular thermoelectric units for heat recovery systems and methods thereof.

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38. Brykalski, Michael; Marquette, David, Moisture abatement in heating operation of climate controlled systems.

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39. Venkatasubramanian,Rama; Siivola,Edward; Colpitts,Thomas; O'Quinn,Brooks, Phonon-blocking, electron-transmitting low-dimensional structures.

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40. Pham,Hung M.; Warner,Wayne R., Refrigeration system including thermoelectric module.

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41. Pham,Hung M; Warner,Wayne R, Refrigeration system including thermoelectric module.

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42. Pham,Hung M; Warner,Wayne R, Refrigeration system including thermoelectric module.

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43. Watts, Phillip C., Same plane multiple thermoelectric mounting system.

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44. Lofy, John, Segmented thermoelectric device.

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45. Hsu, Yung-Yu, Strain isolation structures for stretchable electronics.

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46. Horning, Robert D.; Lodden, Grant H., Systems and methods for device temperature stabilization.

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47. De Graff, Bassel; Ghaffari, Roozbeh; Arora, William J., Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy.

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48. Chadwick, Nathaniel R.; Gambino, Jeffrey P.; Peterson, Kirk D., Thermal energy dissipation using backside thermoelectric devices.

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49. Siivola, Edward P.; Mahadevan, Ramaswamy, Thermoelectric (TE) devices/structures including thermoelectric elements with exposed major surfaces.

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50. Takeda, Masatoshi; Mutou, Tsuyoshi; Kondo, Takeshi, Thermoelectric conversion element.

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51. Mandal, Sudeep; Graf, Richard S., Thermoelectric cooling using through-silicon vias.

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52. Petrovski, Dusko, Thermoelectric device.

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53. Petrovski, Dusko; Zheng, Sihai; Maass, Michael, Thermoelectric device controls and methods.

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54. Savelli, Guillaume; Coronel, Philippe; Plissonnier, Marc, Thermoelectric device which provides for varying the effective height of the contacts of a thermocouple, and method for manufacturing the device.

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55. Ghamaty, Saied; Elsner, Norbert B., Thermoelectric device with Si/SiC superlattice N-legs.

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56. Inaba, Masahiko; Clark, Jay Christopher; Comiskey, Brian, Thermoelectric device with internal sensor.

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57. Reifenberg, John; Miller, Lindsay; Scullin, Matthew L.; Lorimer, Adam; Sura, Sravan Kumar R.; Beera, Sasi Bhushan; Crane, Douglas, Thermoelectric devices having reduced thermal stress and contact resistance, and methods of forming and using the same.

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58. Venkatasubramanian,Rama; Siivola,Edward P., Thermoelectric devices utilizing double-sided Peltier junctions and methods of making the devices.

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59. Park, Cheol-Hee, Thermoelectric element module and manufacturing method.

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60. Venkatasubramanian, Rama, Thermoelectric generators for solar conversion and related systems and methods.

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61. Gatecliff, George W.; Horton, William T., Thermoelectric heat lifting application.

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62. Leija,Javier; Lucero,Christopher D., Thermoelectric module.

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63. Onoue,Katsuhiko, Thermoelectric module package.

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64. Poelloth, Horst; Eder, Andreas; Linde, Matthias; Mazar, Boris; Limbeck, Sigrid; Brueck, Rolf, Thermoelectric module with a heat conducting layer and method of manufacturing a thermoelectric module.

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65. Smythe, Robert Michael; Hershberger, Jeffrey Gerard, Thermoelectric modules and related methods.

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66. Makansi, Tarek; Franklin, John L.; Evers, Mark N.; Forbes, Kevin C.; Dominguez, Jose Santos; Sato, Michael T., Thermoelectric string, panel, and covers for function and durability.

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67. Venkatasubramanian, Rama; Alley, Randall G.; Addepalli, Pratima; Reddy, Anil J.; Siivola, Edward P.; O'Quinn, Brooks C.; Coonley, Kip D.; Posthill, John; Colpitts, Thomas, Thin film thermoelectric devices for hot-spot thermal management in microprocessors and other electronics.

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68. Venkatasubramanian, Rama; Alley, Randall G.; Addepalli, Pratima; Reddy, Anil J.; Siivola, Edward P.; O'Quinn, Brooks C.; Coonley, Kip D.; Posthill, John; Colpitts, Thomas, Thin film thermoelectric devices for hot-spot thermal management in microprocessors and other electronics.

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69. Venkatasubramanian,Rama, Thin-film thermoelectric cooling and heating devices for DNA genomic and proteomic chips, thermo-optical switching circuits, and IR tags.

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70. Akei, Masao; Ignatiev, Kirill M; Jayanth, Nagaraj; Pham, Hung M; Caillat, Jean-Luc M, Vapor compression circuit and method including a thermoelectric device.

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71. Akei, Masao; Ignatiev, Kirill; Jayanth, Nagaraj; Pham, Hung M.; Caillat, Jean-Luc M., Vapor compression circuit and method including a thermoelectric device.

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72. Steinman, Adam Joseph; Bunyak, Kenneth James; Orlando, Bruno Antonio, Vehicle headliner assembly for zonal comfort.

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73. Fitzpatrick, Robert C.; Lowell, Dana R.; Makansi, Tarek; Franklin, John Latimer, Vehicle seat with thermal device.

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