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Integral dielectric heatspreader for transferring heat from semiconductor devices. A semiconductor device is mounted to a thermally conductive electrically insulating substrate, which forms the integral dielectric heatspreader. The heatspreader is then mounted to a package or a lower cost substrate

Integral dielectric heatspreader for transferring heat from semiconductor devices. A semiconductor device is mounted to a thermally conductive electrically insulating substrate, which forms the integral dielectric heatspreader. The heatspreader is then mounted to a package or a lower cost substrate such as a printed circuit board. The integral dielectric heatspreader may also support integral transmission lines, resistors, capacitors, or other bulk components. Performance of the heatspreader is enhanced through the use of thermal vias on a printed circuit board.

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1. An integral dielectric heatspreader for mounting a semiconductor device on a secondary surface, the heatspreader comprising a thermally conductive, electrically insulating material having:a first central area for mounting the semiconductor device on a first surface of the heatspreader, and at lea

1. An integral dielectric heatspreader for mounting a semiconductor device on a secondary surface, the heatspreader comprising a thermally conductive, electrically insulating material having:a first central area for mounting the semiconductor device on a first surface of the heatspreader, and at least one conductive pad on the first surface of the heatspreader for accepting electrical connections from the semiconductor device to the conductive pad, and from the conductive pad to the secondary surface.