초록 ▼

A portable computer has enhanced cooling of its processor in a docked mode of operation. External cooling of the computer processor takes place using a thermoelectric cooler in the docking station which has its cold side engaged in heat conducting relation in a bottom mount configuration with a ther

A portable computer has enhanced cooling of its processor in a docked mode of operation. External cooling of the computer processor takes place using a thermoelectric cooler in the docking station which has its cold side engaged in heat conducting relation in a bottom mount configuration with a thermal port on the computer for transporting heat from the computer to a cooling mechanism in the docking station. The portable computer is a notebook computer operable in undocked and docked modes in an example embodiment.

대표청구항 ▼

1. An apparatus for cooling comprising:a hardware product containing an electronic component to be cooled, the hardware component being mobile for use in an undocked mode and being mountable on a docking station for use in a docked mode; a docking station on which the hardware product can be mounted

1. An apparatus for cooling comprising:a hardware product containing an electronic component to be cooled, the hardware component being mobile for use in an undocked mode and being mountable on a docking station for use in a docked mode; a docking station on which the hardware product can be mounted; a first cooling mechanism located in the hardware product in heat conducting relation to the electronic component thereof to cool the electronic component in both the undocked and docked modes of use of the hardware product, the first cooling mechanism including a heat conducting first block attached to the electronic component, a first heat pipe attached to the first block, a first internal remote heat exchanger which receives heat transferred by the first heat pipe from the first block, and a fan to drive air flow over the first internal remote heat exchanger to provide cooling, and wherein the first cooling mechanism is in heat conducting relation with a surface of the hardware product which functions as a thermal port by way of at least the first block of the first cooling mechanism; a second cooling mechanism located in the docking station to provide additional cooling of the electrical component in the docked mode of the use of the hardware product; and a thermoelectric cooler located in the docking station and arranged in heat conducting relation between the first and second cooling mechanisms when the hardware product is mounted on the docking station to transport heat from the thermal port of the hardware product to the second cooling mechanism to provide additional cooling of the electronic component in the docked mode of use of the hardware product.