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System and method for dividing flow 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G05D-011/13
출원번호 US-0836748 (2001-04-17)
발명자 / 주소
  • Matthew Thomas Taylor
  • John Christopher Hallahan
  • William R. Clark
출원인 / 주소
  • MKS Instruments, Inc.
대리인 / 주소
    McDermott, Will & Emery
인용정보 피인용 횟수 : 27  인용 특허 : 6

초록

A system for dividing a single flow of gas into two or more secondary flows of known, precise values, without requiring a high upstream pressure. The system includes an inlet for receiving the single gas flow, and first and second flow lines connected to the inlet. A mass flow meter measures gas flo

대표청구항

1. A system for dividing a single flow of gas into two or more secondary flows of known, precise values without requiring a high upstream pressure, comprising:an inlet for receiving the single flow of gas; a first flow line connected to the inlet; a second flow line connected to the inlet; a mass fl

이 특허에 인용된 특허 (6)

  1. Goldman Jon C. (Orange CA) Rappaport Robert E. (Westminster CA), Gas control system for chemical vapor deposition system.
  2. McMillin Brian K. ; Knop Robert, Gas distribution apparatus for semiconductor processing.
  3. Marrelli John D. (Houston TX), Means for separating a fluid stream into two separate streams.
  4. Stoy James R. (Missouri City TX) Schrodt James L. G. (Houston TX) Wheeler Stephen S. (Bakersfield CA), Method and apparatus for automatically transferring and measuring wet steam between priority and secondary users.
  5. Moslehi Mehrdad M. (Dallas TX) Davis Cecil J. (Greenville TX) Matthews Robert T. (Plano TX), Programmable multizone gas injector for single-wafer semiconductor processing equipment.
  6. Bergamini Lorenzo,ITX, System for measuring and controlling gas mass flow.

이 특허를 인용한 특허 (27)

  1. Miya, Go; Edamura, Manabu; Yoshioka, Ken; Nishio, Ryoji, Apparatus and method for plasma etching.
  2. Sugiyama, Kazuhiko; Ikeda, Nobukazu; Nishino, Kouji; Dohi, Ryousuke; Uenoyama, Toyomi, Device and method for supplying gas while dividing to chamber from gas supplying facility equipped with flow controller.
  3. Sugiyama, Kazuhiko; Ikeda, Nobukazu; Nishino, Kouji; Dohi, Ryousuke; Uenoyama, Toyomi, Device and method for supplying gas while dividing to chamber from gas supplying facility equipped with flow controller.
  4. Sadjadi, S. M. Reza; Huang, Zhisong; Sam, Jose Tong; Lenz, Eric H.; Dhindsa, Rajinder, Fast gas switching plasma processing apparatus.
  5. Ulens, Jan; Vandenheuvel, Philip; Vandendriessche, Peter, Flow control system.
  6. Ding, Junhua; Zarkar, Kaveh H., Gas delivery method and system including a flow ratio controller using a multiple antisymmetric optimal control arrangement.
  7. Ding, Junhua; Smith, John A.; Zarkar, Kaveh H., Gas delivery method and system including a flow ratio controller using antisymmetric optimal control.
  8. Huang, Zhisong; Sam, Jose Tong; Lenz, Eric H.; Dhindsa, Rajinder; Sadjadi, Reza, Gas distribution system having fast gas switching capabilities.
  9. Huang, Zhisong; Sam, Jose Tong; Lenz, Eric H.; Dhindsa, Rajinder; Sadjadi, Reza, Gas distribution system having fast gas switching capabilities.
  10. Uchida, Yohei; Yamamoto, Takahiro, Gas mixture supplying method and apparatus.
  11. Okabe, Tsuneyuki, Gas supply apparatus for semiconductor manufacturing apparatus.
  12. Yamaguchi, Yuji; Yasuda, Tadahiro, Gas supply system.
  13. Seeli, John W.; Zietlow, David, Heat transfer apparatus and method.
  14. Ambrosina,Jesse; Kottenstette,Nicholas E.; Shajii,Ali, Mass flow ratio system and method.
  15. Singh, Saravjeet; Nangoy, Roy C., Method and apparatus for fast gas exchange, fast gas switching, and programmable gas delivery.
  16. Lull, John M.; Valentine, William S., Method and apparatus for providing a determined ratio of process fluids.
  17. Lull, John M.; Valentine, William S., Method and apparatus for providing a determined ratio of process fluids.
  18. Lull,John M.; Valentine,William S., Method and apparatus for providing a determined ratio of process fluids.
  19. Lull,John M.; Valentine,William S., Method and apparatus for providing a determined ratio of process fluids.
  20. Lull,John M; Valentine,William S, Method and apparatus for providing a determined ratio of process fluids.
  21. Annapragada, Rao V.; Turmel, Odette; Takeshita, Kenji; Zheng, Lily; Choi, Thomas S.; Pirkle, David R., Method for providing uniform removal of organic material.
  22. Ding, Junhua, Method of and apparatus for multiple channel flow ratio controller system.
  23. L'Bassi, Michael; Ding, Junhua; D'Entremont, David, Multiple-channel flow ratio controller.
  24. Shajii,Ali; Nagarkatti,Siddharth P., Semiconductor manufacturing gas flow divider system and method.
  25. Geoffrion, Bruno; Crocket, Mark Adam, System and method to divide fluid flow in a predetermined ratio.
  26. Larson, Dean J.; Kadkhodayan, Babak; Wu, Di; Takeshita, Kenji; Yen, Bi-Ming; Su, Xingcai; Denty, Jr., William M.; Loewenhardt, Peter, Uniform etch system.
  27. Larson,Dean J.; Kadkhodayan,Babak; Wu,Di; Takeshita,Kenji; Yen,Bi Ming; Su,Xingcai; Denty, Jr.,William M.; Loewenhardt,Peter, Uniform etch system.
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