초록 ▼

A deformable fluid supply line for use on a semiconductor fabrication machine is described which includes a generally S-shaped expandable joint connecting between two straight conduit sections for providing full communication thereinbetween and for providing stress absorbing characteristics such tha

A deformable fluid supply line for use on a semiconductor fabrication machine is described which includes a generally S-shaped expandable joint connecting between two straight conduit sections for providing full communication thereinbetween and for providing stress absorbing characteristics such that the expandable joint can be stretched or otherwise deformed by at least 2 cm without breaking connections with the two straight conduit sections. When the generally S-shaped expandable joint is provided with a length of at least 10 cm, a deformation of at least 3.5 cm can be tolerated by the expandable joint without causing failure or otherwise damages in the connections with the two straight conduit sections. The deformable fluid supply line can survive an earthquake of the magnitude of Richter 5 scale. The invention further discloses a method for connecting a deformable fluid supply line to a fabrication machine by using an S-shaped joint connected in between two straight conduit sections. The present invention novel deformable fluid supply line can survive various forms of deformations including stretching, compressing, twisting and bending.

대표청구항 ▼

1. A deformable fluid supply line for a semiconductor fabrication machine comprising:a first rigid conduit having a first open end and an opposing second open end, said first open end being in fluid communication with a fluid reservoir; a second rigid conduit having a third open end and an opposing

1. A deformable fluid supply line for a semiconductor fabrication machine comprising:a first rigid conduit having a first open end and an opposing second open end, said first open end being in fluid communication with a fluid reservoir; a second rigid conduit having a third open end and an opposing fourth open end, said fourth open end being in fluid communication with said semiconductor fabrication machine; and a generally S-shaped expandable joint for connecting and providing fluid communication between said second open end of said first rigid conduit and said third open end of said second rigid conduit, said generally S-shaped expandable joint being connected to said first and said second rigid conduit by welded joints, said expandable joint being stretched by at least 2 cm without fracturing and breaking connection with said first rigid conduit and said second rigid conduit.