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[미국특허] Transferrable compliant fibrous thermal interface 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B32B-033/00
  • H05K-007/20
출원번호 US-0103416 (1998-06-24)
발명자 / 주소
  • Michael R. Pinter
  • Nancy F. Dean
  • William B. Willett
  • Amy Gettings
  • Charles Smith
출원인 / 주소
  • Honeywell International Inc.
대리인 / 주소
    Wells St. John P.S.
인용정보 피인용 횟수 : 34  인용 특허 : 28

초록

Described is a transferrable fibrous thermal interface. The interface comprises flocked thermally conductive fibers embedded in an adhesive in substantially vertical orientation with portions of the fibers extending out of the adhesive. An encapsulant fills spaces between the portions of the fibers

대표청구항

1. A transferable thermal interface having:an encapsulant and a plurality of thermally conductive fibers forming a thermally conductive composite; and individual fibers having a length and the encapsulant having a thickness encapsulating a portion of the individual lengths of the plurality of fibers

이 특허에 인용된 특허 (28) 인용/피인용 타임라인 분석

  1. Blackmon James B. (Irvine CA) Drubka Robert E. (Huntington Beach CA) Kirby John S. (Long Beach CA) Johnson Dave (Riverside CA) Gerrick R. Andrew (Santa Ana CA) Ingersoll Thomas (Laguna Niguel CA) Jon, Advanced survivable radiator.
  2. Mittal Faquir C. (Audubon PA), Apparatus for cooling integrated circuit chips.
  3. Brown Michael A. ; Hyman Nelson, Compliant attachment.
  4. Grapes Thomas F. (Columbia MD) Fertig Timothy M. (Pasadena MD) Schroeder Mark S. (Severna Park MD), Composite heat transfer means.
  5. Ewing ; Jr. Joseph H. (Lake Park FL) Safai Saed (Vernon CT), Composite thermal insulation structure.
  6. Bunyan Michael H. ; de Sorgo Miksa, Conformal thermal interface material for electronic components.
  7. Koon Robert W. ; Steelman Thomas E., Enhanced conductive joints from fiber flocking.
  8. Koon Robert W. ; Steelman Thomas E., Enhanced heat transfer in printed circuit boards.
  9. Koon Robert W. ; Steelman Thomas E., Enhanced heat transfer in printed circuit boards and electronic components thereof.
  10. Giglia Robert D. (Rye NY), Flocked fabric laminate for protection against chemical agents.
  11. Olsen Randall B. (Olivenhain CA), Graphite fiber thermal radiator.
  12. Aihara Toshio,JPX ; Tasaka Masahito,JPX ; Hayashi Chihiro,JPX, Heat sink having good heat dissipating characteristics.
  13. Weidenbenner William A. (Dallas TX) Steltz Irvin J. (North Wales PA), Heat transfer composition and method of making.
  14. Dickinson Richard C. (Arlington Heights IL), Heat transfer element having the thermally conductive fibers.
  15. Bartley Gerald K. ; Baska Douglas A. ; Bielick James D. ; Butterbaugh Matthew A. ; Hoffmeyer Mark K. ; Kang Sukhvinder Singh, Heatsink and package structures with fusible release layer.
  16. Koon Robert W. ; Steelman Thomas E., Method for single filament transverse reinforcement in composite prepreg material.
  17. Brown, Perry H.; Tremblay, Maurice H.; Surprenant, Norman F., Method of making metal flocked fabric.
  18. Fick Herbert J. (Northfield MN), Method of preparing interfacings of heat sinks with electrical devices.
  19. Quon William (Alhambra CA) Tanzer Herbert J. (Topanga CA), Phase change cooling of semiconductor power modules.
  20. Johnson Michael A. (Stillwater MN) Kuypers Maurice H. (Oakdale MN), Release liner.
  21. Knauf Gary H. (Appleton WI), Release liner base stock for printed films or labels.
  22. O\Donley Bobby (Sherman TX), Semiconductor device with enhanced adhesion between heat spreader and leads and plastic mold compound.
  23. Martorana Richard T. (Andover MA) Heimann Thomas D. (Methuen MA) Bimshas John (Winchester MA), Solid state directional thermal cable.
  24. Lee James C. K. (Los Altos Hills CA) Amdahl Gene M. (Atherton CA) Beck Richard (Cupertino CA) Lee Chune (San Francisco CA) Hu Edward (Sunnyvale CA), System for detachably mounting semiconductors on conductor substrate.
  25. Freuler Raymond G. ; Flynn Gary E., Thermal interface with adhesive.
  26. Bergerson Steven E., Thermally conductive filled polymer composites for mounting electronic devices and method of application.
  27. Liberty James (Hollis NH) Jones Peter (Londonderry NH), Thermally conductive interface materials and methods of using the same.
  28. Browne James M. (21 Pillon Reef Pleasant Hill CA 94523), Thermally conductive joining film.

이 특허를 인용한 특허 (34) 인용/피인용 타임라인 분석

  1. Abrams, Louis Brown, Co-molded direct flock and flock transfer and methods of making same.
  2. Abrams,Louis Brown, Co-molded direct flock and flock transfer and methods of making same.
  3. Dean, Nancy F.; Emigh, Roger A.; Pinter, Michael R.; Smith, Charles; Knowles, Timothy R.; Ahmadi, Mani; Ellman, Brett M.; Seaman, Christopher L., Compliant fibrous thermal interface.
  4. Knowles, Timothy R.; Seaman, Christopher L., Dendritic fiber material.
  5. Knowles,Timothy R.; Seaman,Christopher L., Dendritic fiber material.
  6. Smith, Charles; Chau, Michael M.; Emigh, Roger A.; Dean, Nancy F., Electronic device having fibrous interface.
  7. Smith, Charles; Chau, Michael M.; Emigh, Roger A.; Dean, Nancy F., Electronic device having fibrous interface.
  8. Li, Shih-Yao; Hung, Jui-Wen; Hwang, Ching-Bai, Electronic deviec having heat dissipation device.
  9. Knowles,Timothy R.; Seaman,Christopher L., Fiber adhesive material.
  10. Abrams, Louis Brown, Flexible heat sealable decorative articles and method for making the same.
  11. Abrams, Louis Brown, Flocked adhesive article having multi-component adhesive film.
  12. Abrams,Louis Brown, Flocked articles and methods of making same.
  13. Abrams, Louis Brown, Flocked articles having a resistance to splitting and methods for making the same.
  14. Abrams, Louis Brown, Flocked articles having noncompatible insert and porous film.
  15. Abrams, Louis Brown, Flocked articles having noncompatible insert and porous film.
  16. Abrams, Louis Brown, Flocked elastomeric articles.
  17. Abrams, Louis Brown, Flocked elastomeric articles.
  18. Abrams, Louis Brown, Flocked multi-colored adhesive article with bright lustered flock and methods for making the same.
  19. Abrams,Louis Brown, Flocked stretchable design or transfer.
  20. Abrams, Louis Brown, Flocked stretchable design or transfer including thermoplastic film and method for making the same.
  21. Abrams, Louis Brown, Flocked transfer and article of manufacture including the application of the transfer by thermoplastic polymer film.
  22. Abrams,Louis Brown, Flocked transfer and article of manufacture including the application of the transfer by thermoplastic polymer film.
  23. Abrams,Louis Brown, Flocked transfer and article of manufacture including the application of the transfer by thermoplastic polymer film.
  24. Abrams,Louis Brown, Flocked transfer and article of manufacture including the flocked transfer.
  25. Abrams,Louis Brown, Flocked transfer and article of manufacture including the flocked transfer.
  26. Abrams,Louis Brown, Flocked transfer and article of manufacturing including the flocked transfer.
  27. Kim, Yong K.; Lewis, Armand F.; Rice, John M., Materials methodology to improve the delamination strength of laminar composites.
  28. Mehrabi, Ali R.; Mehrabi, Reza; Chica, Frank; Hsiao, Janet; deSantos Avila, Juan, Porous material and method for producing the same.
  29. Abrams,Louis Brown, Process for dimensionalizing flocked articles or wear, wash and abrasion resistant flocked articles.
  30. Abrams,Louis Brown, Process for printing and molding a flocked article.
  31. Abrams,Louis Brown, Process for printing and molding a flocked article.
  32. Obermeyer, Henry K.; Gilbert, Eric N.; Baker, Grant Quinn, Process of manufacturing fiber reinforced composite via selective infusion of resin and resin blocking substance.
  33. Abrams, Louis Brown, Sublimation dye printed textile.
  34. Pinter, Michael R.; Dean, Nancy F.; Willett, William B.; Gettings, Amy; Smith, Charles, Transferrable compliant fibrous thermal interface.

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