초록 ▼

Thin, planar substrates are carried on a substrate carrier (20) through a polishing operation. The substrate carrier (20) is injection molded or modified-injection molded from a plastic material, and includes one or more receptacles for receiving the substrates to be carried through the polishing pr

Thin, planar substrates are carried on a substrate carrier (20) through a polishing operation. The substrate carrier (20) is injection molded or modified-injection molded from a plastic material, and includes one or more receptacles for receiving the substrates to be carried through the polishing process. A drive force transmission arrangement is also included in the substrate carrier (20) through which the carrier may be driven in the polishing process. The substrate carrier (20) is relatively non-abrasive and composed of melt processable engineering polymers or blends. Non-abrasive fillers or reinforcing material may also be included in the plastic.

대표청구항 ▼

1. A carrier for transporting thin, planar objects through a polishing operation, the carrier being prepared by a process comprising the steps of:(a) forcing a plastic material into a mold while maintaining the mold in at least one partially open position; (b) maintaining the plastic material at a s

1. A carrier for transporting thin, planar objects through a polishing operation, the carrier being prepared by a process comprising the steps of:(a) forcing a plastic material into a mold while maintaining the mold in at least one partially open position; (b) maintaining the plastic material at a substantially constant velocity throughout the volume of the mold as the plastic material is forced into the mold; and (c) closing the mold to a fully closed position after the step of injecting the plastic material into the mold has been initiated.